Continuous-Flow Chemical Processing in Three-Dimensional Microchannel Network for On-Chip Integration of Multiple Reactions in a Combinatorial Mode

2005 ◽  
Vol 24 (6) ◽  
pp. 742-757 ◽  
Author(s):  
Yoshikuni Kikutani ◽  
Masaharu Ueno ◽  
Hideaki Hisamoto ◽  
Manabu Tokeshi ◽  
Takehiko Kitamori
Keyword(s):  
Continuous Flow ◽  
Three Dimensional ◽  
Chemical Processing ◽  
Multiple Reactions ◽  
On Chip

scholarly journals Electromechanically reconfigurable optical nano-kirigami

2021 ◽  
Vol 12 (1) ◽  
Author(s):  
Shanshan Chen ◽  
Zhiguang Liu ◽  
Huifeng Du ◽  
Chengchun Tang ◽  
Chang-Yin Ji ◽  
...  
Keyword(s):  
Near Infrared ◽  
Large Range ◽  
Three Dimensional ◽  
High Contrast ◽  
Si Substrate ◽  
High Modulation ◽  
Gold Nanostructure ◽  
Infrared Wavelengths ◽  
On Chip ◽  
Nano Electromechanical System

AbstractKirigami, with facile and automated fashion of three-dimensional (3D) transformations, offers an unconventional approach for realizing cutting-edge optical nano-electromechanical systems. Here, we demonstrate an on-chip and electromechanically reconfigurable nano-kirigami with optical functionalities. The nano-electromechanical system is built on an Au/SiO2/Si substrate and operated via attractive electrostatic forces between the top gold nanostructure and bottom silicon substrate. Large-range nano-kirigami like 3D deformations are clearly observed and reversibly engineered, with scalable pitch size down to 0.975 μm. Broadband nonresonant and narrowband resonant optical reconfigurations are achieved at visible and near-infrared wavelengths, respectively, with a high modulation contrast up to 494%. On-chip modulation of optical helicity is further demonstrated in submicron nano-kirigami at near-infrared wavelengths. Such small-size and high-contrast reconfigurable optical nano-kirigami provides advanced methodologies and platforms for versatile on-chip manipulation of light at nanoscale.

scholarly journals High-Performance On-Chip Silicon Beamsplitter Based on Subwavelength Metamaterials for Enhanced Fabrication Tolerance

Nanomaterials ◽  
2021 ◽  
Vol 11 (5) ◽  
pp. 1304
Author(s):  
Raquel Fernández de Cabo ◽  
David González-Andrade ◽  
Pavel Cheben ◽  
Aitor V. Velasco
Keyword(s):  
Integrated Circuits ◽  
Fundamental Mode ◽  
High Performance ◽  
Three Dimensional ◽  
High Sensitivity ◽  
Power Splitting ◽  
Excess Loss ◽  
Power Splitters ◽  
On Chip ◽  
Efficient Power

Efficient power splitting is a fundamental functionality in silicon photonic integrated circuits, but state-of-the-art power-division architectures are hampered by limited operational bandwidth, high sensitivity to fabrication errors or large footprints. In particular, traditional Y-junction power splitters suffer from fundamental mode losses due to limited fabrication resolution near the junction tip. In order to circumvent this limitation, we propose a new type of high-performance Y-junction power splitter that incorporates subwavelength metamaterials. Full three-dimensional simulations show a fundamental mode excess loss below 0.1 dB in an ultra-broad bandwidth of 300 nm (1400–1700 nm) when optimized for a fabrication resolution of 50 nm, and under 0.3 dB in a 350 nm extended bandwidth (1350–1700 nm) for a 100 nm resolution. Moreover, analysis of fabrication tolerances shows robust operation for the fundamental mode to etching errors up to ± 20 nm. A proof-of-concept device provides an initial validation of its operation principle, showing experimental excess losses lower than 0.2 dB in a 195 nm bandwidth for the best-case resolution scenario (i.e., 50 nm).

A new efficient multi‐task applications mapping for three‐dimensional Network‐on‐Chip based MPSoC

2021 ◽  
Author(s):  
Khadidja Gaffour ◽  
Mohammed Kamel Benhaoua ◽  
Abou El Hassan Benyamina ◽  
Amit Kumar Singh
Keyword(s):  
Three Dimensional ◽  
Network On Chip ◽  
Dimensional Network ◽  
On Chip

Current and Future Three-Dimensional LSI Integration Technology by “chip on chip”, “chip on wafer” and “wafer on wafer”

2006 ◽  
Vol 970 ◽  
Author(s):  
Manabu Bonkohara ◽  
Makoto Motoyoshi ◽  
Kazutoshi Kamibayashi ◽  
Mitsumasa Koyanagi
Keyword(s):  
Three Dimensional ◽  
Process Time ◽  
Future Technology ◽  
Sensor Device ◽  
Research Level ◽  
Key Technologies ◽  
The Future ◽  
Chip Size ◽  
On Chip ◽  
Chip Chip

ABSTRACTRecently the development of three dimensional LSI (3D-LSI) has been accelerated and its stage has changed from the research level or limited production level to the investigation level with a view to mass production. This paper describes the current and the future 3D-LSI technologies which we have considered and imagined. The current technology is taken our Chip Size Package (CSP) for sensor device, for instance. In the future technology, there are the five key technologies are described. And considering con and pro of the current 3D LSI stacked approach, such as CoC (Chip on Chip), CoW (Chip on Wafer) and WoW (Wafer on Wafer), We confirmed that CoW combined with Super-Smart-Stack (SSS™) technology will shorten the process time per chip at the same level as WoW approach and is effective to minimize process cost.

Development and Application of Graphics Displays for a Mini-Computer Based Vibration Analysis System

1992 ◽  
Author(s):  
Bill Trevillion
Keyword(s):  
Three Dimensional ◽  
Large Data ◽  
Electric Utility ◽  
Chemical Processing ◽  
Acoustic Data ◽  
Interactive Display ◽  
Computer Based ◽  
Data Files ◽  
Vibration Problems ◽  
Analysis System

Abstract Radian Corporation has developed extensive data display capabilities to analyze vibration and acoustic data from structures and rotating equipment. The Machinery Interactive Display and Analysis System (MIDAS) displays data collected through the acquisition functions of MIDAS. The graphics capabilities include displaying spectra in three-dimensional waterfall and in X-Y formats. Both types of plots can relate vibrations to time, equipment speed, or process parameters. Using menu-driven parameter selection, data can be displayed in formats that are the most useful for analysis. The system runs on a popular mini-computer, and it can be used with a great variety of graphics terminals, workstations, and printer/plotters. The software was designed and written for interactive display and plotting. Automatic plotting of large data files is facilitated by a batch plotting mode. The user can define display formats for the analysis of noise and vibration problems in the electric utility, chemical processing, paper, and automotive industries. This paper describes the history and development of graphics capabilities of the MIDAS system. The system, as illustrated in the examples, has proven efficient and economical for displaying large quantities of data.

Three-dimensional tissue model in direct contact with an on-chip vascular bed enabled by removable membranes

Lab on a Chip ◽  
2022 ◽  
Author(s):  
Yoshikazu Kameda ◽  
Surachada Chuaychob ◽  
Miwa Tanaka ◽  
Yang Liu ◽  
Ryu Okada ◽  
...  
Keyword(s):  
Tissue Culture ◽  
Direct Contact ◽  
Three Dimensional ◽  
Culture Period ◽  
Tissue Model ◽  
Vascular Bed ◽  
On Chip

Three-dimensional (3D) tissue culture is a powerful tool for understanding physiological events. However, 3D tissues still have limitations in their size, culture period, and maturity, which are caused by the...

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