Degradation analysis on trend gamma process

2021 ◽  
Author(s):  
Yi‐Fu Wang ◽  
Yufen Huang ◽  
Wei‐Chieh Liao
Keyword(s):  
Gamma Process ◽  
Degradation Analysis

Bayesian information fusion for degradation analysis of deteriorating products with individual heterogeneity

2018 ◽  
Vol 233 (4) ◽  
pp. 615-622 ◽  
Author(s):  
Junyu Guo ◽  
Hong-Zhong Huang ◽  
Weiwen Peng ◽  
Jie Zhou
Keyword(s):  
Reliability Analysis ◽  
Information Fusion ◽  
Process Model ◽  
High Reliability ◽  
Small Sample Size ◽  
Small Sample ◽  
Gamma Process ◽  
Individual Heterogeneity ◽  
Multiple Sources ◽  
Degradation Analysis

Degradation analysis is a popular and effective method for reliability analysis of long-life and high-reliability products. However, for newly developed products, especially for highly customized products with small sample size, the challenge of sparse degradation observations with product heterogeneity is still an open issue deserving further research. In this article, Bayesian degradation analysis is presented for reliability analysis of products with heterogeneity. The degradation process is modeled by a Gamma process. Random effects are incorporated in the Gamma process model for characterizing the individual heterogeneity. To improve the precision of parameter estimation and degradation analysis, a Bayesian information fusion is presented to leverage degradation information from multiple sources. The proposed model is demonstrated through degradation-based reliability analysis of heavy-duty machine tool’s spindle system, which is characterized as degradation analysis with individual heterogeneity and information fusion.

Accelerated Degradation Analysis for the Quality of a System Based on the Gamma Process

2015 ◽  
Vol 64 (1) ◽  
pp. 463-472 ◽  
Author(s):  
Man Ho Ling ◽  
Kwok Leung Tsui ◽  
Narayanaswamy Balakrishnan
Keyword(s):  
Gamma Process ◽  
Accelerated Degradation ◽  
Degradation Analysis

Improved Gamma Process for Degradation Analysis Under Nonlinear Condition

2015 ◽  
Vol 22 (06) ◽  
pp. 1550030 ◽  
Author(s):  
Zhao-Yi Fan ◽  
Hua Ju ◽  
Feng-Bin Sun
Keyword(s):  
Scale Parameter ◽  
Gamma Process ◽  
Improved Method ◽  
Degradation Analysis ◽  
Degradation Models ◽  
Life Tests ◽  
Nonlinear Condition ◽  
Improved Model ◽  
Product Degradation ◽  
Process Method

Some life tests result in few or no failures. In such cases, we can, and should, consider using degradation measurements to assess reliability. In real world, product degradation is a stochastic process. Since such degradation is often seen as a monotonous process, literature widely uses Gamma Process to describe and quantify degradation. However, in these publications, scale parameter is considered constant over time and results under this assumption may have big deviation from the actual measurements under nonlinear condition. The purpose of this paper is to improve Gamma Process method to fit a broader class of degradation models. Firstly, we use MLE to estimate the parameters under the timely constant-scale-parameter assumption and analyze why the model does not fit data well. Then we propose an improved model to improve the method and use Monte Carlo simulation to verify the validity of the improved method.

Degradation Analysis and Degradation Suppression Technology Caused by Light Absorption at Active Layer Facet of GaInAsP Laser Diode

2008 ◽  
Vol 128 (5) ◽  
pp. 732-737
Author(s):  
Hiroyuki Ichikawa ◽  
Masashi Ito ◽  
Chie Fukuda ◽  
Kotaro Hamada ◽  
Akira Yamaguchi ◽  
...  
Keyword(s):  
Active Layer ◽  
Laser Diode ◽  
Light Absorption ◽  
Degradation Analysis

Thermal Degradation Analysis of Fluorocarbon Thin Films prepared by an r.f. Sputtering with Poly (tetrafluoroethylene) Target

2013 ◽  
Vol 56 (4) ◽  
pp. 133-135
Author(s):  
Yuki IKEDA ◽  
Satoru IWAMORI ◽  
Hiroyuki MATSUMOTO ◽  
Kiyoshi YOSHINO ◽  
Itsuo NISHIYAMA ◽  
...  
Keyword(s):  
Thin Films ◽  
Thermal Degradation ◽  
Degradation Analysis

Degradation Analysis of Thick Film Chip Resistors

2009 ◽  
Author(s):  
Bhanu Sood ◽  
Diganta Das ◽  
Michael H. Azarian ◽  
Michael Pecht
Keyword(s):  
Thick Film ◽  
Printed Circuit Board ◽  
Negative Resistance ◽  
Circuit Board ◽  
High Humidity ◽  
Circuit Boards ◽  
Chemical Modifications ◽  
Current Leakage ◽  
Printed Circuit ◽  
Degradation Analysis

Abstract Negative resistance drift in thick film chip resistors in high temperature and high humidity application conditions was investigated. This paper reports on the investigation of possible causes including formation of current leakage paths on the printed circuit board, delamination between the resistor protective coating and laser trim, and the possibility of silver migration or copper dendrite formation. Analysis was performed on a set of circuit boards exhibiting failures due to this phenomenon. Electrical tests after mechanical and chemical modifications showed that the drift was most likely caused by moisture ingress that created a conductive path across the laser trim.

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