Heat Dissipation Properties of Thin-Film Encapsulation by Insertion of a Metal Thin Film for Organic Light-Emitting Diodes
2018 ◽
Vol 215
(23)
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pp. 1800326
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2019 ◽
Vol 35
(7)
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pp. 681-700
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2011 ◽
Vol 01
(02)
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pp. 23-28
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2015 ◽
Vol 15
(10)
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pp. 8199-8204