Effect of Small-Angle Grain Boundary on the Mechanical Properties in Direct Silicon Bonded Wafer
2018 ◽
Vol 215
(14)
◽
pp. 1800118
◽
2021 ◽
Vol 11
◽
pp. 834-848
2010 ◽
Vol 638-642
◽
pp. 273-278
◽
Keyword(s):
1993 ◽
Vol 166
(1-2)
◽
pp. 81-88
◽
Keyword(s):
1996 ◽
Vol 37
(1)
◽
pp. 56-62
◽
2016 ◽
Vol 667
◽
pp. 391-401
◽
2011 ◽
Vol 214
◽
pp. 108-112
◽
2010 ◽
Vol 312
(4)
◽
pp. 607-610
◽
2012 ◽
Vol 625
◽
pp. 304-307
◽
2019 ◽
Keyword(s):