Numerical Simulation of HTPB Resin Curing Process Using OpenFOAM and Study the Effect of Different Conditions on its Curing Time

2021 ◽  
Author(s):  
Hamed Moghimi Rad ◽  
Saeed Tavangar Roosta ◽  
Seyed Hadi Motamed Shariati ◽  
Seyed Ghorban Hosseini
Keyword(s):  
Numerical Simulation ◽  
Curing Process ◽  
Curing Time ◽  
Resin Curing

Solvent diffusion mechanism of PMMA/ acetone coated glass fiber fabric during curing process

2021 ◽  
pp. 152808372110362
Author(s):  
Zhenrong Zheng ◽  
Yuejiao Bi ◽  
Lihuan Tong ◽  
Yalan Liu
Keyword(s):  
Glass Fiber ◽  
Diffusion Mechanism ◽  
Coating Film ◽  
Curing Process ◽  
Curing Time ◽  
Solvent Concentration ◽  
Solvent Diffusion ◽  
Coated Glass ◽  
Drying Model ◽  
Fiber Fabric

Fabric it is not an impermeable substrate because of fiber porosity. To study the solvent diffusion mechanism of coated fabric in the curing process, the drying model of PMMA/acetone coated glass fiber fabric was established. This drying model was verified by confocal Raman spectroscopy. Finally, the impact of fabric structure, thickness and porosity on the solvent diffusion process in coated fabrics was studied by the model. It was shown that the predicted solvent concentrations by the model were consistent with the experimental values. This model can be used to quantitatively calculate the solvent concentration at any position and at any time inside the coating film during the drying process. Moreover, it can also predict the curing time and residual solvent concentration of the coating fabric required to reach drying equilibrium. Compared with coated 3/1 twill, 5/3 satin and 2/1 twill, the solvent diffusion of coated plain fabric was faster during curing. Under the same environmental conditions, the thinner the fabric was and the greater the porosity was, the shorter the curing time was. The fitting equations for fabric thickness, fabric porosity and drying time were obtained, which can provide a theoretical guidance for the preparation, performance research and drying conditions optimization of PMMA coated textile materials.

The Study of Underfill Epoxy Hardness in Reducing Curing Process Time for Flip Chip Packaging

2011 ◽  
Vol 462-463 ◽  
pp. 1194-1199
Author(s):  
Zainudin Kornain ◽  
Azman Jalar ◽  
Rozaidi Rashid ◽  
Shahrum Abdullah
Keyword(s):  
Thermal Expansion ◽  
Flip Chip ◽  
Ball Grid Array ◽  
Process Time ◽  
Curing Process ◽  
Curing Time ◽  
Hold Temperature ◽  
Flip Chip Packaging ◽  
Time Cycle ◽  
The Impact

Underfilling is the vital process to reduce the impact of the thermal stress that results from the mismatch in the co-efficient of thermal expansion (CTE) between the silicon chip and the substrate in Flip Chip Packaging. This paper reported the pattern of underfill’s hardness during curing process for large die Ceramic Flip Chip Ball Grid Array (FC-CBGA). A commercial amine based underfill epoxy was dispensed into HiCTE FC-CBGA and cured in curing oven under a new method of two-step curing profile. Nano-identation test was employed to investigate the hardness of underfill epoxy during curing steps. The result has shown the almost similar hardness of fillet area and centre of the package after cured which presented uniformity of curing states. The total curing time/cycle in production was potentially reduced due to no significant different of hardness after 60 min and 120 min during the period of second hold temperature.

Managing Voids in Adhesives for Medical Devices

2014 ◽  
Vol 2014 (1) ◽  
pp. 000567-000571
Author(s):  
M. Ruales ◽  
J. Merced ◽  
R. Ramos
Keyword(s):  
Medical Devices ◽  
Adhesive Layer ◽  
Microelectronic Packaging ◽  
Void Content ◽  
Curing Process ◽  
Curing Time ◽  
Optimal Process ◽  
Thermal Transfer ◽  
Device Reliability ◽  
Packaging Industry

Void content within the adhesive layer dispensed over the connector module in neuromodulation devices is critical. Voids can affect the thermal transfer, bond strength, and stress decoupling of the adhesive, which can eventually lead to degraded device reliability. The effects of voids are investigated for a silicone based adhesive used in these medical devices. There are many challenges associated with the curing process that this adhesive undergoes which drive the need for unique and specific testing to determine optimal process settings. The parameters evaluated included curing time, temperature, thickness, and relative humidity. Reduction in void content was linked with mechanical properties including hardness and tensile strength. Achievement of void free medical adhesives will encourage today's microelectronic packaging industry to meet the challenges of smaller and denser medical devices.

Influence of aluminosilsesquioxane on epoxy resin curing process (Rapid Communication)

Polimery ◽  
2014 ◽  
Vol 59 (11/12) ◽  
pp. 855-858 ◽  
Author(s):  
Danuta Matykiewicz ◽  
Beata Dudziec ◽  
Tomasz Sterzynski
Keyword(s):  
Epoxy Resin ◽  
Curing Process ◽  
Rapid Communication ◽  
Resin Curing

scholarly journals Effects of Post-Curing Time on the Mechanical and Color Properties of Three-Dimensional Printed Crown and Bridge Materials

Polymers ◽  
2020 ◽  
Vol 12 (11) ◽  
pp. 2762
Author(s):  
Dohyun Kim ◽  
Ji-Suk Shim ◽  
Dasun Lee ◽  
Seung-Ho Shin ◽  
Na-Eun Nam ◽  
...  
Keyword(s):  
Vickers Hardness ◽  
Color Change ◽  
Clinical Performance ◽  
Three Dimensional ◽  
Degree Of Conversion ◽  
Curing Process ◽  
Curing Time ◽  
Color Tone ◽  
Curing Conditions ◽  
3D Printed

Three-dimensional (3D) printing is increasingly being utilized in the dental field. After fabricating a prosthesis using a 3D printed resin, a post-curing process is required to improve its mechanical properties, but there has been insufficient research on the optimal post-curing conditions. We used various 3D printed crown and bridge materials in this study, and evaluated the changes in their properties according to post-curing time by evaluating the flexural strength, Weibull modulus, Vickers hardness, color change, degree of conversion, and biocompatibility. The obtained results confirmed that the strength of the 3D printed resin increased when it was post-cured for 60–90 min. The Vickers hardness, the degree of conversion, and biocompatibility of the 3D printed resins increased significantly around the beginning of the post-curing time, and then increased more gradually as the post-curing time increased further. It was observed that the color tone also changed as the post-curing time increased, with some groups showing a ΔE00 value of ≥ 2.25, which can be recognized clinically. This study has confirmed that, after the printing process of a 3D printed resin was completed, a sufficient post-curing time of at least 60 min is required to improve the overall clinical performance of the produced material.

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