Noncovalent functionalization of multiwalled and double-walled carbon nanotubes: Positive effect of the filler functionalization on high glass transition temperature epoxy resins

2009 ◽  
Vol 47 (19) ◽  
pp. 1860-1868 ◽  
Author(s):  
L. A. S. de A. Prado ◽  
A. De La Vega ◽  
J. Sumfleth ◽  
K. Schulte
Keyword(s):  
Carbon Nanotubes ◽  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Epoxy Resins ◽  
High Glass Transition Temperature ◽  
Noncovalent Functionalization ◽  
Double Walled Carbon Nanotubes ◽  
Walled Carbon Nanotubes ◽  
Positive Effect

The Research of the Effect of Single-Walled Carbon Nanotubes on the Properties of Epichlorohydrin Rubber

2019 ◽  
Vol 945 ◽  
pp. 428-432
Author(s):  
E.N. Timofeeva ◽  
Natalia N. Petrova ◽  
K.N. Nikolaeva ◽  
E.S. Kuzmina
Keyword(s):  
Carbon Nanotubes ◽  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Low Temperatures ◽  
High Performance ◽  
Single Walled Carbon Nanotubes ◽  
Elastomeric Materials ◽  
Multi Walled Carbon Nanotubes ◽  
Walled Carbon Nanotubes

The development of frost-resistant elastomeric materials with high performance characteristics remains one of the topical issues. Solving this issue will significantly improve the reliability of machines and mechanisms operating under extremely low temperatures. The influence of multi-walled carbon nanotubes on the performance properties of epichlorohydrin rubber was investigated. This rubber of unique frost resistance has low glass transition temperature (Tg = -60 °C).

Preparation and Tensile/Thermal Properties of Polyvinyl Alcohol/Multi-Walled Carbon Nanotubes Composites

2015 ◽  
Vol 749 ◽  
pp. 182-185 ◽  
Author(s):  
Ching Wen Lou ◽  
Zheng Ian Lin ◽  
Chien Lin Huang ◽  
Wen Cheng Chen ◽  
Chih Kuang Chen ◽  
...  
Keyword(s):  
Carbon Nanotubes ◽  
Glass Transition ◽  
Thermal Properties ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Polyvinyl Alcohol ◽  
Tensile Properties ◽  
Test Results ◽  
Multi Walled Carbon Nanotubes ◽  
Walled Carbon Nanotubes

This study presents polyvinyl alcohol (PVA)/multi-walled carbon nanotubes (MWCNTs) composites, and examines the influence of the content of MWCNTs on the tensile and thermal properties of the PVA matrices. The test results show that an increase of 1.5 wt% of MWCNTs results in greater tensile properties of the PVA matrices, while decreasing their toughness. The interaction between MWCNTs and PVA pertains to the thermal properties of PVA matrices, which is exemplified by a significant increase in their glass transition temperature (Tg).

High-temperature carbon plastics based on thermoreactive polyimide binder

2020 ◽  
pp. 89-102
Author(s):  
M. I. Valueva ◽  
I. V. Zelenina ◽  
M. A. Zharinov ◽  
M. A. Khaskov
Keyword(s):  
Glass Transition ◽  
High Temperature ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Strength Properties ◽  
High Glass Transition Temperature ◽  
Reinforced Plastics ◽  
Carbon Plastics ◽  
Fundamental Possibility ◽  
Fiber Reinforced Plastics

The article presents results of studies of experimental carbon plastics based on thermosetting PMRpolyimide binder. Сarbon fiber reinforced plastics (CFRPs) are made from prepregs prepared by melt and mortar technologies, so the rheological properties of the polyimide binder were investigated. The heat resistance of carbon plastics was researched and its elastic-strength characteristics were determined at temperatures up to 320°С. The fundamental possibility of manufacturing carbon fiber from prepregs based on polyimide binder, obtained both by melt and mortar technologies, is shown. CFRPs made from two types of prepregs have a high glass transition temperature: 364°C (melt) and 367°C (solution), with this temperature remaining at the 97% level after boiling, and also at approximately the same (86–97%) level of conservation of elastic strength properties at temperature 300°С.

scholarly journals Cure Kinetics Modeling of a High Glass Transition Temperature Epoxy Molding Compound (EMC) Based on Inline Dielectric Analysis

Polymers ◽  
2021 ◽  
Vol 13 (11) ◽  
pp. 1734
Author(s):  
Erick Franieck ◽  
Martin Fleischmann ◽  
Ole Hölck ◽  
Larysa Kutuzova ◽  
Andreas Kandelbauer
Keyword(s):  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Kinetic Parameters ◽  
Measurement Techniques ◽  
Process Conditions ◽  
Dielectric Analysis ◽  
High Glass Transition Temperature ◽  
General Process ◽  
Molding Compound

We report on the cure characterization, based on inline monitoring of the dielectric parameters, of a commercially available epoxy phenol resin molding compound with a high glass transition temperature (>195 °C), which is suitable for the direct packaging of electronic components. The resin was cured under isothermal temperatures close to general process conditions (165–185 °C). The material conversion was determined by measuring the ion viscosity. The change of the ion viscosity as a function of time and temperature was used to characterize the cross-linking behavior, following two separate approaches (model based and isoconversional). The determined kinetic parameters are in good agreement with those reported in the literature for EMCs and lead to accurate cure predictions under process-near conditions. Furthermore, the kinetic models based on dielectric analysis (DEA) were compared with standard offline differential scanning calorimetry (DSC) models, which were based on dynamic measurements. Many of the determined kinetic parameters had similar values for the different approaches. Major deviations were found for the parameters linked to the end of the reaction where vitrification phenomena occur under process-related conditions. The glass transition temperature of the inline molded parts was determined via thermomechanical analysis (TMA) to confirm the vitrification effect. The similarities and differences between the resulting kinetics models of the two different measurement techniques are presented and it is shown how dielectric analysis can be of high relevance for the characterization of the curing reaction under conditions close to series production.

Imide Oligomers Containing Pendent and Terminal Phenylethynyl Groups—II

1998 ◽  
Vol 10 (3) ◽  
pp. 273-283 ◽  
Author(s):  
J W Connell ◽  
J G Smith ◽  
P M Hergenrother
Keyword(s):  
Molecular Weight ◽  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Average Molecular Weight ◽  
Adhesive Tape ◽  
High Glass Transition Temperature ◽  
Compressive Properties ◽  
Compression Moulding ◽  
Imide Oligomers

As part of a programme to develop high-performance/high-temperature structural resins for aeronautical applications, imide oligomers containing pendent and terminal phenylethynyl groups were prepared, characterized and the cured resins evaluated as composite matrices. The oligomers were prepared at a calculated number-average molecular weight of 5000 g mol−1 and contained 15–20 mol% pendent phenylethynyl groups. In previous work, an oligomer containing pendent and terminal phenylethynyl groups exhibited a high glass transition temperature (∼313 °C), and laminates therefrom exhibited high compressive properties, but processability, fracture toughness, microcrack resistance and damage tolerance were less than desired. In an attempt to improve these deficiencies, modifications in the oligomeric backbone involving the incorporation of 1,3-bis(3-aminophenoxy)benzene were investigated as a means of improving processability and toughness without detracting from the high glass transition temperature and high compressive properties. The amide acid oligomeric solutions were prepared in N-methyl-2-pyrrolidinone and were subsequently processed into imide powder, thin films, adhesive tape and carbon fibre prepreg. Neat resin plaques were fabricated from imide powder by compression moulding. The maximum processing pressure was 1.4 MPa and the cure temperature ranged from 350 to 371 °C for 1 h for the mouldings, adhesives, films and composites. The properties of the 1,3-bis(3-aminophenoxy)benzene modified cured imide oligomers containing pendent and terminal phenylethynyl groups are compared with those of previously prepared oligomers containing pendent and terminal phenylethynyl groups of similar composition and molecular weight.

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