Thermal expansion of poly(ether-ether-ketone) (PEEK)

1990 ◽  
Vol 28 (11) ◽  
pp. 1965-1977 ◽  
Author(s):  
C. L. Choy ◽  
W. P. Leung ◽  
C. Nakafuku
Keyword(s):  
Thermal Expansion ◽  
Ether Ether Ketone ◽  
Poly Ether Ether Ketone ◽  
Ether Ketone

Poly(ether ether ketone)s processed through extrusion-machining and 3D printing: A comparative study on mechanical, thermal and fracture properties at ambient and cryogenic environments

2020 ◽  
pp. 009524432096183
Author(s):  
Leena Karthikeyan ◽  
Suraj Sudhi ◽  
Tushar Shriram Bhatt ◽  
Mani Ganesan ◽  
Panthaplackal Bhaskaran Soumyamol ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Thermal Expansion ◽  
3D Printing ◽  
Fracture Morphology ◽  
Morphological Studies ◽  
Ether Ether Ketone ◽  
Poly Ether Ether Ketone ◽  
3D Printed ◽  
Ether Ketone ◽  
Printing Direction

Poly Ether Ether Ketone (PEEK) is a very promising engineering thermoplastic material having capability to perform over wide service temperatures from cryogenic to around 300°C. Processing of PEEK is a challenging task, owing to its physical, thermo physical properties and chemical nature. The present paper envisages processing of PEEK by two different techniques viz, 3D printing and extrusion and assessment of properties of respective specimens at 30°C and −196°C. Thermal and mechanical properties and fracture morphological features of PEEK specimen, processed using these techniques are compared. Samples processed by extrusion possessed higher mechanical properties both at 30°C and −196°C. The 3D printed samples, though exhibited inferior strength and modulus, showed significantly higher elongation (150–250%) at 30°C. All samples showed ductile fracture behavior at 30°C. At −196°C, the fracture morphology got transformed in to a pattern typical of brittle materials, as expected. Extruded specimens showed lower thermal expansion coefficient compared to the 3D printed specimens. Thermal expansion characteristics were different in the X, Y and Z directions for 3D printed specimens due to the anisotropy resulting from printing direction which is corroborated by the morphological studies. The results of this investigation enable designing and fabrication of PEEK based structural components of desired geometries for various applications.

scholarly journals Thermally conductive poly(ether ether ketone)/boron nitride composites with low coefficient of thermal expansion

2021 ◽  
Vol 56 (17) ◽  
pp. 10326-10337
Author(s):  
Barun Ghosh ◽  
Fang Xu ◽  
Xianghui Hou
Keyword(s):  
Thermal Expansion ◽  
Boron Nitride ◽  
Thermal Management ◽  
Coefficient Of Thermal Expansion ◽  
Weight Ratio ◽  
Thermal Dissipation ◽  
Ether Ether Ketone ◽  
Poly Ether Ether Ketone ◽  
Thermally Conductive ◽  
Ether Ketone

AbstractThe substantial heat generation due to miniaturization and high-degree integration of electronic devices is one of the major issues to facilitate efficient thermal management in power electronics. Though epoxy-based composites have shown great interest in different applications such as laminated circuit board, electronic component encapsulations, and potting, they have low application temperature (up to 150 °C) and higher mismatch of coefficient of thermal expansion (CTE) between the heat source and heat sink. Here, poly(ether ether ketone) (PEEK) composites reinforced with hexagonal boron nitride (hBN) nanoplatelets have been developed by liquid mixing and re-melting method for a step change in composite materials with lower CTE and significantly improved thermal dissipation capability. The lowest achieved CTE is 2.1 µm m−1 K−1, and the highest thermal conductivity is 1.04 W m−1 K−1 in PEEK/hBN composites at 30 wt% hybrid hBN content (hBN platelets with two different sizes, i.e. 70 nm and 500 nm, taken as 1:1 weight ratio), due to the formation of thermally conductive inter-filler networks. The composites show negligible variation in K with the working temperature up to 250 °C. The developed composites also exhibit excellent electrical insulation properties; thus, they will have good potential in thermal management for power electronic applications. Graphical abstract

Preparation of a novel poly (ether ether ketone) self-reinforced paper appropriate for harsh conditions

2021 ◽  
Vol 56 (18) ◽  
pp. 11174-11185
Author(s):  
Xin Cong ◽  
Jiannan Ren ◽  
Chunhui Xiang ◽  
Xuzhao Gai ◽  
Guibin Wang ◽  
...  
Keyword(s):  
Ether Ether Ketone ◽  
Poly Ether Ether Ketone ◽  
Ether Ketone ◽  
Harsh Conditions
Sign in / Sign up

Export Citation Format

Share Document