Epoxy resins, curing agents, compounds, and modifiers: An industrial guide E. W. Flick, Noycs Publications, Park Ridge, New Jersey, 1987. pp. xxxiii + 620, pricc $78.00. ISBN 0-8155-1 113-2

1988 ◽  
Vol 20 (2) ◽  
pp. 166-166
Author(s):  
W. W. Wright
1985 ◽  
Vol 22 (8) ◽  
pp. 1101-1107
Author(s):  
Devendra Kumar ◽  
Alka D. Gupta
Keyword(s):  

1992 ◽  
Vol 45 (4) ◽  
pp. 607-610 ◽  
Author(s):  
N. Galego ◽  
A. Vazquez ◽  
C. C. Riccardi ◽  
R. J. J. Williams

CrystEngComm ◽  
2021 ◽  
Author(s):  
Tsuyoshi Haneda ◽  
Shinya Matsuno ◽  
Hisanao Yamamoto ◽  
Hiroyoshi Ohtsu ◽  
Masaki Kawano

Latency control on the basis of molecular design of a solid state by introducing hydrogen bonding into epoxy curing agents.


Author(s):  
Zhenwei Miao ◽  
Dongpeng Yan ◽  
Xiaodong Wang ◽  
Xinfang Zhang ◽  
Wenqi Zhou ◽  
...  

2003 ◽  
Vol 30 (4) ◽  
pp. 25-32
Author(s):  
Yu. N. Smirnov ◽  
S.V. Kruzhkova ◽  
T.E. Shatskaia ◽  
V.I. Natrusov

Sign in / Sign up

Export Citation Format

Share Document