Low‐stress over‐molding of media‐tight electronics using thermoplastic foam injection molding
2019 ◽
Vol 220
◽
pp. 371-385
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2018 ◽
Vol 103
◽
pp. 68-79
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Keyword(s):
2018 ◽
Vol 37
(15)
◽
pp. 1020-1034
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Keyword(s):