Synergistic enhancement of thermal conductivity by addition of graphene nanoplatelets to three‐dimensional boron nitride scaffolds for polyamide 6 composites

2021 ◽  
Author(s):  
Fangjuan Wu ◽  
Anlin Chen ◽  
Hanlu Pan ◽  
Denghui Li ◽  
Lingjie Zhang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Three Dimensional ◽  
Polyamide 6 ◽  
Graphene Nanoplatelets ◽  
Synergistic Enhancement

A thermal interface material based on foam-templated three-dimensional hierarchical porous boron nitride

2018 ◽  
Vol 6 (36) ◽  
pp. 17540-17547 ◽  
Author(s):  
Zhilin Tian ◽  
Jiajia Sun ◽  
Shaogang Wang ◽  
Xiaoliang Zeng ◽  
Shuang Zhou ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Three Dimensional ◽  
High Thermal Conductivity ◽  
Thermal Interface Material ◽  
Thermal Interface ◽  
Hierarchical Porous ◽  
Templated Method

A high thermal conductivity boron nitride based thermal interface material was developed by a foam-templated method.

Enhanced thermal conductivity and flame retardancy of polyamide 6/flame retardant composites with hexagonal boron nitride

2018 ◽  
Vol 38 (8) ◽  
pp. 767-774 ◽  
Author(s):  
Liang Wang ◽  
Luchong Zhang ◽  
Andreas Fischer ◽  
Yuhua Zhong ◽  
Dietmar Drummer ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Flame Retardant ◽  
Flame Retardancy ◽  
High Performance ◽  
Heat Dissipation ◽  
Hexagonal Boron Nitride ◽  
Light Emitting Diode ◽  
Polyamide 6 ◽  
Twin Screw

Abstract High performance composite of polyamide 6 (PA6)/flame retardant (FR)/hexagonal boron nitride (hBN) was prepared via twin screw extrusion, followed by injection molding. The heat dissipation of the composite was significantly improved by incorporating 40 vol% of hBN, and the corresponding thermal conductivity was up to 5.701 W/(m·K), nearly 17 times that of the PA6/FR composites. In addition, the combination effect of hBN and FR to the flame retardancy of the composites was observed, and the addition of hBN could dramatically enhance the flame retardancy of composites, achieving a UL94 V-0 rating with a limited oxygen index (LOI) value of 37%. This multifunctional modification would broaden the application field of PA6 composites in light-emitting diode (LED) lamps, electronic products, and so on.

scholarly journals Epoxy–PCM Composites with Nanocarbons or Multidimensional Boron Nitride as Heat Flow Enhancers

Molecules ◽  
2019 ◽  
Vol 24 (10) ◽  
pp. 1883 ◽  
Author(s):  
Richa Agrawal ◽  
Joshua Hanna ◽  
I. Emre Gunduz ◽  
Claudia C. Luhrs
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Latent Heat ◽  
Phase Change Materials ◽  
Three Dimensional ◽  
Boron Nitride Nanotubes ◽  
Thermal Regulation ◽  
Curing Process ◽  
Sample Composition ◽  
Support Matrix

The need for affordable systems that are capable of regulating the temperature of living or storage spaces has increased the interest in exploring phase change materials (PCMs) for latent heat thermal energy storage (LHTES). This study investigates n-nonadecane (C19H40) and n-eicosane (C20H42) as alkane hydrocarbons/paraffins for LHTES applications. An epoxy resin is used as the support matrix medium to mitigate paraffin leakage, and a thickening agent is utilized to suppress phase separation during the curing process. In order to enhance the thermal conductivity of the epoxy–paraffin composite, conductive agents including carbon nanofibers (CNFs), carbon nanotubes (CNTs), boron nitride (BN) microparticles, or boron nitride nanotubes (BNNTs) are incorporated in different gravimetric ratios. Enhancements in latent heat, thermal conductivity, and heat transfer are realized with the addition of the thermal fillers. The sample composition with 10 wt.% BN shows excellent reversibility upon extended heating–cooling cycles and adequate viscosity for template casting as well as direct three-dimensional (3D) printing on fabrics, demonstrating the feasibility for facile integration onto liners/containers for thermal regulation purposes.

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