Visualization of particles arrangement during filling stage of polyamide 6 - metal insert injection molding

2019 ◽  
Vol 59 (s2) ◽  
pp. E271-E278 ◽  
Author(s):  
Karol Bula ◽  
Justyna Szymańska ◽  
Tomasz Sterzyński ◽  
Adam Piasecki ◽  
Roman Wróblewski
2018 ◽  
Vol 32 (9) ◽  
pp. 1190-1203 ◽  
Author(s):  
Xuping Yang ◽  
Wenbin Yang ◽  
Jinghui Fan ◽  
Juying Wu ◽  
Kai Zhang

Thermally conductive and electrically insulating polyamide 6 (PA6) matrix quaternary composites were prepared by hot press molding and injection molding, respectively. The quaternary composites were composed of zero-dimensional aluminum oxide particle, one-dimensional silicon carbide whisker, two-dimensional flake graphite, and PA6 resin matrix. Morphology, structure, density, thermal conductivity, volume electrical resistivity, and tensile strength of two types of composites were characterized by scanning electron microscopy, X-ray diffractometer, thermal conductivity tester, high resistance micro-current tester, and tensile tester. The results showed that crystallinity, thermal conductivity, density, and tensile strength of hot press molding samples were superior to those of samples made by injection molding method. This is due to that hot press molding method can provide higher molding pressure and longer annealing time than injection molding. The mechanism could be explained that the performances of the composites were promoted by increasing molding pressure and annealing time.


2021 ◽  
pp. 41-48
Author(s):  
Thanh-Hai Nguyen ◽  
Tran Long Vu ◽  
Vo Van Duy Phong ◽  
Tra Ngoc Tien Dat ◽  
Anh Van Nguyen ◽  
...  

2018 ◽  
Vol 38 (7) ◽  
pp. 675-684 ◽  
Author(s):  
Tobias Kleffel ◽  
Dietmar Drummer

Abstract One method to produce electronic systems with high resilience is the encapsulation of metal inserts, for example, lead frames, using assembly injection molding. Such parts are exposed to different mediums, such as water and oil, which can infiltrate and damage the electronic system, especially in automotive applications. Hence, one challenge is to ensure the tightness. The research covered in this paper focuses on the assembly injection molding of tight electronic systems using microstructured metal inserts, manufactured by a two-stage electrochemical treatment. The effects of the electrochemical treatment on the tightness and the bond between metal and polymer of the electronic system are investigated. Furthermore, the influence of the electrochemical treatment on the surface and geometry of the metal insert is evaluated.


Polymers ◽  
2022 ◽  
Vol 14 (1) ◽  
pp. 173
Author(s):  
Hyun Keun Kim ◽  
Jaehoo Kim ◽  
Donghwi Kim ◽  
Youngjae Ryu ◽  
Sung Woon Cha

In this study, the vibration and sound response characteristics of composites produced via injection molding applied with a microcellular foaming process (MCPs) were improved. The study was conducted using PA6 and glass fiber composites, which are representative thermoplastic engineering plastics. Two types of specimens were used: a plate specimen to confirm the basic sound and vibration characteristics, and a large roof-rack specimen from an actual vehicle with a complex shape. The frequency response function curve was calculated by conducting an impact test, and natural frequency and damping ratio were measured based on the curve. The results confirmed that, in the case of a specimen manufactured through the injection molding process to which MCPs were applied, the natural frequency was lowered, and the damping ratio decreased. The degree of change in the natural frequency and damping ratio was confirmed. To determine the cause of the change in the natural frequency and damping ratio, the mode shape at the natural frequency of each specimen was measured and the relationship was confirmed by measuring the density and the elastic modulus of the composite. In addition, the usability of the specimens to which MCPs were applied was verified by conducting impact strength and tensile strength tests.


Polymer ◽  
2019 ◽  
Vol 180 ◽  
pp. 121679 ◽  
Author(s):  
Yan Yan ◽  
Yan-Hao Huang ◽  
Yue Wang ◽  
Zhi-Chao Xiao ◽  
Ming-Bo Yang

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