Phase separation and rheological behavior during curing of an epoxy resin modified with syndiotactic polystyrene

2005 ◽  
Vol 45 (3) ◽  
pp. 303-313 ◽  
Author(s):  
A. Tercjak ◽  
P.M. Remiro ◽  
I. Mondragon
2012 ◽  
Vol 499 ◽  
pp. 308-311
Author(s):  
Yong Lv ◽  
Song Ci ◽  
Long Zhu

The thermal conductivity & insulating adhesive was prepared by mixed with diamond particles, epoxy resin (E-20), methanol etherified amino resin, ethylene glycol monobutyl ether (BCS), mixed diethyl ester (DBE), and other additives. The influence on rheological behavior of different particle sizes, volume content of diamond particles was studied. Meantime, the effect of different concentration of dispersant and flatting agent was also investigated. The mechanism of the rheological behavior was analyzed.


2003 ◽  
Vol 36 (20) ◽  
pp. 7746-7751 ◽  
Author(s):  
Wenjun Gan ◽  
Yingfeng Yu ◽  
Minghai Wang ◽  
Qingsheng Tao ◽  
Shanjun Li

2006 ◽  
Vol 44 (6) ◽  
pp. 889-899 ◽  
Author(s):  
Qipeng Guo ◽  
Alexia Habrard ◽  
Yoosup Park ◽  
Peter J. Halley ◽  
George P. Simon

2009 ◽  
Vol 118 (2-3) ◽  
pp. 398-404 ◽  
Author(s):  
Gang Li ◽  
Zhibin Huang ◽  
Chunling Xin ◽  
Peng Li ◽  
Xiaolong Jia ◽  
...  

2005 ◽  
Vol 54 (4) ◽  
pp. 667-672 ◽  
Author(s):  
Nicolas Salmon ◽  
V�ronique Carlier ◽  
Jaap Schut ◽  
Pedro M Remiro ◽  
I?aki Mondragon

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