Enhanced adhesion between glass, carbon, and their hybrid fiber-bundle with epoxy at room and elevated temperatures: A comparative study between graphene and MWCNT filled interface strategies

2017 ◽  
Vol 39 (S4) ◽  
pp. E2370-E2380 ◽  
Author(s):  
Bin Yang ◽  
Kang Yang ◽  
Fu-Zhen Xuan ◽  
Yanxun Xiang ◽  
Dan Li ◽  
...  
2014 ◽  
Vol 989-994 ◽  
pp. 15-18
Author(s):  
Dang Sheng Li ◽  
Xi Liang Chen

This paper presents a comparative study of the performance of ferrate (VI) towards wastewater treatment. The effects of solution pH, reaction temperature and amount of ferrate on the eosin removal rate were investigated. Results demonstrated that increasing the amount of ferrate (VI) and low acidity leads to good removal performance of ferrate towards eosin. So ferrate (VI) is an effective reagent for dyes treatment. The reaction temperature, however, has little influence on the removal rate which may be due to the degradation effects of ferrate at elevated temperatures.


2000 ◽  
Vol 612 ◽  
Author(s):  
Yuxiao Zeng ◽  
Linghui Chen ◽  
T. L. Alford

AbstractFor the benefit of reducing capacitance in multilevel interconnect technology, low-k dielectric HSQ (hydrogen silsesquioxane) has been used as a gapfill material in Al-metallization- based non-etchback embedded scheme. The vias are consequently fabricated through the HSQ layer followed by W plug deposition. In order to reduce the extent of via poisoning and achieve good W/Al contact, thin Ti/TiN stack films are typically deposited before via plug deposition. In this case, HSQ makes direct contact with the Ti layer. The reliability of the Ti/HSQ structures at elevated temperatures has been systematically studied in this work by using a variety of techniques. These results are also compared with those from Ti/TEOS (Tetraethylorthosilicate) structure, where TEOS is a conventional intra-metal dielectric. When the temperature is below 550 °C, a significant number of oxygen atoms are observed to diffuse into the titanium layer. The primary source of oxygen is believed to come from the HSQ film. When the temperature is above 550 °C, HSQ starts to react with Ti. At 700 °C, a TiO/Ti5Si3/HSQ stack structure forms. The Ti/HSQ system exhibits a higher reactivity than that of the Ti/TEOS system.


2020 ◽  
Vol 833 ◽  
pp. 48-53
Author(s):  
Rahul Davis ◽  
Abhishek Singh ◽  
Sabindra Kachhap ◽  
Neeraj Nath

In recent times, aerospace, chemical industries and nuclear plant have usually used Inconel 718 alloy because of its excellent mechanical and chemical properties at elevated temperatures. It falls under the category of difficult-to-cut materials due to its high toughness, poor thermal conductivity and high hardness. The set-ups for electric discharge drilling (EDD) and powder-mixed electric discharge drilling (PM-EDD) were developed, and experiments were conducted on them separately. This research shows a comparative study amid producing holes by EDD and PM-EDD in Inconel 718 alloy workpiece with copper tool electrode. SiC was used as an abrasive powder because of its better thermal conductivity in order to get properly mixed with dielectric in a separate tank. Output response was assessed in the form of material removal rate, under the influence of discharge current, duty factor, pulse-on-time and tool speed, as the input parameters.


2020 ◽  
Vol MA2020-02 (2) ◽  
pp. 254-254
Author(s):  
Franziska Friedrich ◽  
Benjamin Strehle ◽  
Hubert A. Gasteiger

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