Thermal conductivity enhancement of electrically insulating syndiotactic poly(styrene) matrix for diphasic conductive polymer composites

2006 ◽  
Vol 17 (9-10) ◽  
pp. 732-745 ◽  
Author(s):  
G. Droval ◽  
J.-F. Feller ◽  
P. Salagnac ◽  
P. Glouannec
RSC Advances ◽  
2018 ◽  
Vol 8 (40) ◽  
pp. 22846-22852 ◽  
Author(s):  
Seokgyu Ryu ◽  
Taeseob Oh ◽  
Jooheon Kim

Boron nitride (BN) particles surface-treated with different amounts of aniline trimer (AT) were used to prepare thermally conductive polymer composites with epoxy-terminated dimethylsiloxane (ETDS).


RSC Advances ◽  
2021 ◽  
Vol 11 (4) ◽  
pp. 1984-1991
Author(s):  
Yue Yuan ◽  
Wei Wu ◽  
Huanbo Hu ◽  
Dongmei Liu ◽  
Hui Shen ◽  
...  

The introduction of hybrid fillers in SLS technology is an effective method for the manufacture of thermally conductive polymer composites with high thermal conductivity, complex structures and good mechanical properties.


Author(s):  
Baojie Wei ◽  
xi cheng ◽  
Shuangqiao Yang

Ceramic-based polymer composites with high thermal conductivity and electrically insulation has been wildly used in modern electrical systems for thermal management application. Compared with ceramic materials, metals usually exhibit better...


2021 ◽  
Vol 2133 (1) ◽  
pp. 012002
Author(s):  
Wei Yang ◽  
Yun Chen ◽  
Yipeng Zhang ◽  
Yongsheng Fu ◽  
Kun Zheng ◽  
...  

Abstract The interfacial thermal conductance (ITC) between filler and polymer matrix is considered as one of the important factors that limits the thermal conductivity of thermally conductive polymer composites. The effect of two different surface treatments (piranha solution and plasma) on ITC of epoxy/alumina was investigated using Time-domain thermoreflectance method (TDTR). The TDTR results show that compared with non-treated samples, the ITC of samples treated by piranha solution and plasma increased 2.9 times and 3.4 times, respectively. This study provides guidance for improving the thermal conductivity of thermally conductive polymer composites.


2020 ◽  
Vol 4 (4) ◽  
pp. 180
Author(s):  
Hao Zhang ◽  
Xiaowen Zhang ◽  
Zhou Fang ◽  
Yao Huang ◽  
Hong Xu ◽  
...  

At present, the rapid accumulation of heat and the heat dissipation of electronic equipment and related components are important reasons that restrict the miniaturization, high integration, and high power of electronic equipment. It seriously affects the performance and life of electronic devices. Hence, improving the thermal conductivity of polymer composites (TCPCs) is the key to solving this problem. Compared with manufacturing intrinsic thermally conductive polymer composites, the method of filling the polymer matrix with thermally conductive fillers can better-enhance the thermal conductivity (λ) of the composites. This review starts from the thermal conduction mechanism and describes the factors affecting the λ of polymer composites, including filler type, filler morphology and distribution, and the functional surface treatment of fillers. Next, we introduce the preparation methods of filled thermally conductive polymer composites with different filler types. In addition, some commonly used thermal-conductivity theoretical models have been introduced to better-analyze the thermophysical properties of polymer composites. We discuss the simulation of λ and the thermal conduction process of polymer composites based on molecular dynamics and finite element analysis methods. Meanwhile, we briefly introduce the application of polymer composites in thermal management. Finally, we outline the challenges and prospects of TCPCs.


2018 ◽  
Vol 159 ◽  
pp. 103-110 ◽  
Author(s):  
Hélio Ribeiro ◽  
João P.C. Trigueiro ◽  
Peter S. Owuor ◽  
Leonardo D. Machado ◽  
Cristiano F. Woellner ◽  
...  

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