Investigation of the cure kinetics and thermal stability of an epoxy system containing cystamine as curing agent

2020 ◽  
Author(s):  
Hamid Reza Khalafi ◽  
Morteza Ehsani ◽  
Hossein Ali Khonakdar
Keyword(s):  
Thermal Stability ◽  
Cure Kinetics ◽  
Curing Agent ◽  
Epoxy System ◽  
Thermal Stability Of

Cure kinetics and thermal stability of multifunctional epoxy/anhydride containing release agent and carbon fiber

2013 ◽  
Vol 35 (3) ◽  
pp. 596-601 ◽  
Author(s):  
Zhengwei Zhou ◽  
Aijun Li ◽  
Ruicheng Bai ◽  
Jinliang Sun
Keyword(s):  
Thermal Stability ◽  
Carbon Fiber ◽  
Cure Kinetics ◽  
Release Agent ◽  
Thermal Stability Of

Epoxy Cured with Anhydride Terminated Polydimethylsiloxane: Cure Kinetics and Thermal Properties

2011 ◽  
Vol 415-417 ◽  
pp. 261-264
Author(s):  
Yuan Ren ◽  
Zheng Xi ◽  
Wen Jun Gan ◽  
Liang Zhang ◽  
Jing Zhang ◽  
...  
Keyword(s):  
Activation Energy ◽  
Thermal Stability ◽  
Thermal Properties ◽  
Succinic Anhydride ◽  
Cure Kinetics ◽  
Diglycidyl Ether ◽  
Scanning Calorimetry ◽  
Thermogravimetric Analyses ◽  
Isothermal Measurements ◽  
Thermal Stability Of

A siloxane-containing dianhydride, succinic anhydride terminated polydimethylsiloxane (DMS-Z21) was selected to cure diglycidyl ether of bisphenol-A based epoxy resin (DGEBA). The cure kinetics and thermal properties were investigated by nonisothermal and isothermal differential scanning calorimetry (DSC) and thermogravimetric analyses (TGA), respectively. The activation energy (Ea) of the curing reaction was obtained based on the methods of Kissinger and isothermal measurements. The results of the thermogravimetric analyses of the DGEBA/DMS-Z21 system showed that the thermal stability of the DGEBA/DMS-Z21 system was slightly higher than the DGEBA/MeTHPA system.

Epoxy Resin (EP) / Nano-SiO2 Composite Material Preparation by Two Processes

2013 ◽  
Vol 652-654 ◽  
pp. 127-130
Author(s):  
Ying Na Zhao ◽  
Xiong Feng Zeng ◽  
Wen Li Zhang
Keyword(s):  
Thermal Stability ◽  
Composite Material ◽  
Comprehensive Evaluation ◽  
Sol Gel ◽  
Curing Agent ◽  
Spectra Analysis ◽  
Nano Sio2 ◽  
Ep Matrix ◽  
Material Preparation ◽  
Thermal Stability Of

Ultrasonic wave (UW) and sol-gel (SG) technology were using to preprocess the nano-SiO2, and the SiO2/EP composites were prepared by adding coupling agent KH-550, curing agent T-31 and different contents SiO2 into EP matrix. Using infrared spectra analysis tested the samples’ structures and the thermal stability of two preparation processes were tested by TG. The results indicated that, the thermal stability of the SiO2/EP composites by UW preprocess was improved about 25 oC -60 oC when compared with pure EP and the SiO2/EP composites by SG. Comparing to the comprehensive evaluation of thermal stability of different SiO2 contents SiO2/EP composites, the most optimum additive of nano-SiO2 was about 10 wt. % by UW process.

scholarly journals Thermal and Mechanical Interfacial Behaviors of Graphene Oxide-Reinforced Epoxy Composites Cured by Thermal Latent Catalyst

Materials ◽  
2019 ◽  
Vol 12 (8) ◽  
pp. 1354 ◽  
Author(s):  
Shahina Riaz ◽  
Soo-Jin Park
Keyword(s):  
Thermal Stability ◽  
Fracture Toughness ◽  
Graphene Oxide ◽  
Mechanical Performance ◽  
Gradual Increase ◽  
Diglycidyl Ether ◽  
Crack Deflection ◽  
Epoxy Composites ◽  
Curing Agent ◽  
Thermal Stability Of

A series of composites was prepared from a diglycidyl ether of bisphenol A (DGEBA) with different graphene filler contents to improve their mechanical performance and thermal stability. Graphene oxide (GO) and GO modified with hexamethylene tetraamine (HMTA) were selected as reinforcing agents. As a latent cationic initiator and curing agent, N-benzylepyrizinium hexafluoroantimonate (N-BPH) was used. The effect of fillers and their contents on the mechanical properties and thermal stability of the composites were studied. Fracture toughness improved by 23% and 40%, and fracture energy was enhanced by 1.94- and 2.27-fold, for the composites containing 0.04 wt.% GO and HMTA-GO, respectively. The gradual increase in fracture toughness at higher filler contents was attributed to both crack deflection and pinning mechanisms. Maximum thermal stability in the composites was achieved by using up to 0.1 wt.% graphene fillers.

Thermal Stability of an Epoxy Adhesive

2014 ◽  
Vol 1053 ◽  
pp. 257-262
Author(s):  
Mei Li ◽  
Xiang Yu Zhao ◽  
Wei Shao ◽  
Chuan Bao Ma ◽  
Rui Xue Zheng ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Thermal Stability ◽  
Thermal Properties ◽  
Epoxy Adhesive ◽  
Inert Gas ◽  
Curing Agent ◽  
Pure Epoxy ◽  
Different Levels ◽  
Thermal Stability Of ◽  
Better Than

An epoxy adhesive and its curing agent are tested using differential scaning calorimetry under different atmospheres and after different exposure times to natural air to analyze its thermal properties. The results show that after the pure epoxy, the curing agent and the adhesive mixture of them are exposed in natural air for different period of time, all show different levels of decline in thermal stability and more complicated reactions when tested in the DSC and TGA in O2 and air, while the thermal properties remain stable when they are tested in an inert gas like N2. And according to the mechanical property tests and SEM results, the mechanical properties of the adhesive mixture in N2 are better than that in air. The results indicate that inert gas can protect the property of this kind of adhesive and thus increase its bond strength.

Cure kinetics and thermal stability of maleimide modified epoxy TGIC/CPE powder coating system

2015 ◽  
Vol 617 ◽  
pp. 191-199 ◽  
Author(s):  
Gamal R. Saad ◽  
Heba M. Abdallah ◽  
Mohamed S. Abdel Aziz ◽  
Nadia A. Mohamed ◽  
Magdy W. Sabaa
Keyword(s):  
Thermal Stability ◽  
Cure Kinetics ◽  
Powder Coating ◽  
Coating System ◽  
Modified Epoxy ◽  
Thermal Stability Of
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