The influences of different size SiO 2 nanoparticles on dielectric properties and corona resistance of epoxy composites

2020 ◽  
Vol 31 (12) ◽  
pp. 3070-3078
Author(s):  
Wei Zhao ◽  
Hao Chen ◽  
Yong Fan ◽  
Weiwei Cui
2012 ◽  
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Author(s):  
Sung Kun Yoon ◽  
Hyeung Gyu Lee ◽  
Woo Sung Lee ◽  
Eung Soo Kim

2015 ◽  
Vol 3 (27) ◽  
pp. 7195-7202 ◽  
Author(s):  
Jun-Wei Zha ◽  
Tian-Xing Zhu ◽  
Yun-Hui Wu ◽  
Si-Jiao Wang ◽  
Robert K. Y. Li ◽  
...  

Epoxy resin is widely used for electrical and electronics packaging in various forms due to its excellent adhesion, low cure shrinkage and good electrical insulation.


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