Enhanced thermal conductivity of epoxy-matrix composites with hybrid fillers

2014 ◽  
Vol 26 (1) ◽  
pp. 26-31 ◽  
Author(s):  
Karolina Gaska ◽  
Andrzej Rybak ◽  
Czeslaw Kapusta ◽  
Robert Sekula ◽  
Artur Siwek
Keyword(s):  
Thermal Conductivity ◽  
Epoxy Matrix ◽  
Matrix Composites ◽  
Hybrid Fillers ◽  
Enhanced Thermal Conductivity

Remarkable Mechanical and Thermal Increments of Epoxy Composites by Graphene Nanosheets and Carbon Nanotubes Synergetic Reinforcement

2017 ◽  
Vol 727 ◽  
pp. 546-552
Author(s):  
Xia Jun Wang ◽  
Dong Lin Zhao ◽  
Dong Dong Zhang ◽  
Cheng Li ◽  
Ran Ran Yao
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Carbon Nanotubes ◽  
Epoxy Matrix ◽  
Graphene Nanosheets ◽  
Synergetic Effect ◽  
Epoxy Composites ◽  
Matrix Composites ◽  
Conductivity Enhancement ◽  
Hybrid Fillers

Graphene nanosheets (GNSs) were modified with aqueous ammonia and hydrogen peroxide, to obtain amine (–NH2) functionalized GNSs (AFGNSs) and enhance the bondings between the GNSs and epoxy matrix. We report an easy and efficient approach to improve the mechanical properties and thermal conductivity of epoxy matrix composites by combining one dimensional multi-walled carbon nanotubes and two dimensional AFGNSs. The long and tortuous MWCNTs can bridge adjacent AFGNSs and inhibit their aggregation, resulting in an increased contact surface area between GNS/MWCNT structures and the polymer. A remarkable synergetic effect between the GNSs and MWCNTs on the enhanced mechanical properties and thermal conductivity of the epoxy composites was demonstrated. The addition of 2 wt.% MWCNT-GNS hybrid fillers improved the tensile strength and flexural strength of the pristine epoxy by 20.71% and 55.51%, respectively. Thermal conductivity increased by 93.71% using MWCNT-GNS hybrid fillers compared to non-derivatised epoxy. This study has demonstrated that 2-D GNSs and 1-D MWCNTs have an obvious synergetic reinforcing effect on the mechanical properties and a remarkable thermal conductivity enhancement in epoxy composites which provides an easy and effective way to design and improve the properties of composite materials.

Enhanced thermal conductivity of Cu matrix composites reinforced with Ag-coated β-Si3N4 whiskers

2014 ◽  
Vol 60 ◽  
pp. 282-288 ◽  
Author(s):  
Jinwei Yin ◽  
Dongxu Yao ◽  
Yongfeng Xia ◽  
Kaihui Zuo ◽  
Yuping Zeng
Keyword(s):  
Thermal Conductivity ◽  
Matrix Composites ◽  
Enhanced Thermal Conductivity

scholarly journals Synergistic Effects of Functional CNTs and h-BN on Enhanced Thermal Conductivity of Epoxy/Cyanate Matrix Composites

Nanomaterials ◽  
2018 ◽  
Vol 8 (12) ◽  
pp. 997 ◽  
Author(s):  
Mingzhen Xu ◽  
Yangxue Lei ◽  
Dengxun Ren ◽  
Sijing Chen ◽  
Lin Chen ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Conductivity Coefficient ◽  
Hexagonal Boron Nitride ◽  
Synergistic Effects ◽  
Decomposition Temperature ◽  
Resin Matrix ◽  
Matrix Composites ◽  
Initial Decomposition Temperature ◽  
Microelectronic Devices ◽  
Enhanced Thermal Conductivity

Epoxy/cyanate resin matrix composites (AG80/CE) with improved thermal conductivity and mechanical properties were obtained with synergetic enhancement with functional carbon nanotubes (f-CNTs) and hexagonal boron nitride (h-BN). AG80/CE performed as polymeric matrix and h-BN as conductivity filler which formed the main thermal conductivity channels. Small amounts of f-CNTs were introduced to repair defects in conductivity channels and networks. To confirm the synergetic enhancements, the thermal conductivity was investigated and analyzed with Agari’s model. Results indicated that with introduction of 0.5 wt% f-CNTs, the thermal conductivity coefficient (ƛ) increased to 0.745 W/mk, which is 1.38 times that of composites with just h-BN. Furthermore, the flexural strength and modulus of composites with 0.5 wt% f-CNTs were 85 MPa and 3.5 GPa. The glass transition temperature (Tg) of composites with 0.4 wt% was 285 °C and the initial decomposition temperature (T5%) was 385 °C, indicating outstanding thermal stability. The obtained h-BN/f-CNTs reinforced AG80/CE composites present great potential for packaging continuous integration and miniaturization of microelectronic devices.

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