Distributed feedback grating fabricated from hybrid polymer precursor gel by employing short-pulse laser interference for photopumped polymer laser applications

2011 ◽  
Vol 23 (9) ◽  
pp. 1264-1270 ◽  
Author(s):  
Rahmat Hidayat ◽  
Sahrul Hidayat ◽  
Fitri Fitrilawati ◽  
Herman ◽  
May On Tjia ◽  
...  
Keyword(s):  
Pulse Laser ◽  
Short Pulse ◽  
Distributed Feedback ◽  
Polymer Precursor ◽  
Hybrid Polymer ◽  
Laser Interference ◽  
Laser Applications ◽  
Short Pulse Laser

Yb doped Fluorides for High Power and Short-Pulse Laser Applications

2011 ◽  
Author(s):  
Frédéric Druon ◽  
Sandrine Ricaud ◽  
Dimitris N. Papadopoulos ◽  
Alain Pellegrina ◽  
Marc Hanna ◽  
...  
Keyword(s):  
Pulse Laser ◽  
High Power ◽  
Short Pulse ◽  
Laser Applications ◽  
Short Pulse Laser

Generating Short-Pulse Laser by Using a Quenched Distributed Feedback Dye Laser

2008 ◽  
Vol 53 (9(6)) ◽  
pp. 3823-3826 ◽  
Author(s):  
D.Q. Hoa ◽  
V. Duong ◽  
P. Long ◽  
T.H. Nhung ◽  
T. Imasaka
Keyword(s):  
Pulse Laser ◽  
Short Pulse ◽  
Dye Laser ◽  
Distributed Feedback ◽  
Short Pulse Laser

scholarly journals Short Pulse Laser Applications Design

2008 ◽  
Author(s):  
R Town ◽  
D Clark ◽  
A Kemp ◽  
B Lasinski ◽  
M Tabak
Keyword(s):  
Pulse Laser ◽  
Short Pulse ◽  
Laser Applications ◽  
Short Pulse Laser

Silicon Thinning using Ultra-Short Pulse Laser Ablation

2004 ◽  
Author(s):  
F. Beaudoin ◽  
P. Perdu ◽  
C. DeNardi ◽  
R. Desplats ◽  
J. Lopez ◽  
...  
Keyword(s):  
Laser Ablation ◽  
Sample Preparation ◽  
Pulse Laser ◽  
Pulse Laser Ablation ◽  
Short Pulse ◽  
Special Care ◽  
Short Pulse Laser ◽  
Ultra Short Pulse ◽  
Ultra Short Pulse Laser

Abstract Ultra-short pulse laser ablation is applied to IC backside sample preparation. It is contact-less, non-thermal, precise and can ablate the various types of material present in IC packages. This study concerns the optimization of ultra-short pulse laser ablation for silicon thinning. Uncontrolled silicon roughness and poor uniformity of the laser thinned cavity needed to be tackled. Special care is taken to minimize the silicon RMS roughness to less than 1µm. Application to sample preparation of 256Mbit devices is presented.

Chromium oxide dissolution in steels via short pulse laser processing

2013 ◽  
Vol 115 (4) ◽  
pp. 1469-1477 ◽  
Author(s):  
Evgeny Kharanzhevskiy ◽  
Sergey Reshetnikov
Keyword(s):  
Pulse Laser ◽  
Chromium Oxide ◽  
Laser Processing ◽  
Short Pulse ◽  
Oxide Dissolution ◽  
Short Pulse Laser
Sign in / Sign up

Export Citation Format

Share Document