Synthesis and properties of two novel silicon-containing cycloaliphatic epoxy resins for electronic packaging application

2011 ◽  
Vol 23 (3) ◽  
pp. 367-374 ◽  
Author(s):  
Wanshuang Liu ◽  
Zhonggang Wang ◽  
Zhuo Chen ◽  
Jianfeng Li ◽  
Linni Zhao
Keyword(s):  
Electronic Packaging ◽  
Epoxy Resins ◽  
Cycloaliphatic Epoxy ◽  
Cycloaliphatic Epoxy Resins

Contact Allergy to Cycloaliphatic Epoxy Resins

1989 ◽  
pp. 360-367 ◽  
Author(s):  
R. Jolanki ◽  
M.-L. Sysilampi ◽  
L. Kanerva ◽  
T. Estlander
Keyword(s):  
Epoxy Resins ◽  
Contact Allergy ◽  
Cycloaliphatic Epoxy ◽  
Cycloaliphatic Epoxy Resins

Synthesis and properties of cycloaliphatic epoxy resins containing imide and diphenyl sulfone

2018 ◽  
Vol 31 (4) ◽  
pp. 380-387 ◽  
Author(s):  
Renxin Xu ◽  
Detian Meng ◽  
Huajun Sun ◽  
Jing Zhou ◽  
Shixin Cheng ◽  
...  
Keyword(s):  
Epoxy Resins ◽  
Chemical Structure ◽  
Proton Nuclear Magnetic Resonance ◽  
Mass Ratio ◽  
Cycloaliphatic Epoxy ◽  
Diphenyl Sulfone ◽  
Heat Distortion Temperature ◽  
Step Procedure ◽  
The Impact ◽  
Cycloaliphatic Epoxy Resins

A novel variety of cycloaliphatic epoxy resins containing imide and diphenyl sulfone (named as 4,4′-bis[4-(4,5-epoxy-1,2,3,6-tetrahydro-phthalimido) phenoxy] diphenyl sulfone, BIES) is designed and synthesized through the three-step procedure. The mixtures of BIES and diglycidyl 4,5-epoxycyclohexane-1,2-dicarboxylate (TDE-85) are cured with methyl tetrahydrophthalic anhydride. Fourier transform infrared spectrum and proton nuclear magnetic resonance spectrum confirm that the BIES contains the chemical structure of imide and diphenyl sulfone. The measurements of glass transition temperature ( Tg), heat distortion temperature (HDT), and the 5% weight loss temperature ( T5%) show that the co-cured BIES/TDE-85 exhibits excellent heat resistance. For the BIES/TDE-85 with mass ratio of 0.2, Tg, HDT, and T5% of the co-cured epoxy are 175°C, 162°C, and 290°C, respectively. The impact strength increases from 117 J m−1 to 139 J m−1 with the increasing of the mass ratios of the BIES/TDE-85 from 0 to 0.2.

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