WEB-spline based mesh-free finite element analysis for the heat equation and the time-dependent Navier-Stokes equation: A survey

2012 ◽  
Vol 29 (4) ◽  
pp. 1322-1340 ◽  
Author(s):  
Sudhakar Chaudhary ◽  
V.V.K. Srinivas Kumar
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Heat Equation ◽  
Stokes Equation ◽  
Time Dependent ◽  
Navier Stokes ◽  
Navier Stokes Equation ◽  
Element Analysis ◽  
Mesh Free

Energy Harvesting From Droplet Interface Bilayers

2015 ◽  
Author(s):  
Ashok K. Kancharala ◽  
Eric Freeman ◽  
Michael K. Philen
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Energy Harvesting ◽  
Nonlinear Finite Element ◽  
Time Dependent ◽  
External Excitation ◽  
Biologically Inspired ◽  
Element Analysis ◽  
Interfacial Membrane ◽  
Membrane Deflection

Biologically inspired droplet interface bilayers have found applications in the development of hair cell sensors and other mechanotransduction applications. In this research, the flexoelectric capability of the droplet bilayers under external excitation is explored for energy harvesting. Traditionally, membrane capacitance models are being used for inferring the magnitude of the membrane deflection which do not account for the relation between the applied force or deflection and the deflection of the interfacial membrane and time dependent variations. In this work, the dynamic behavior of the droplets under external excitation has been modeled using nonlinear finite element analysis. A flexoelectric model including mechanical, electrical, and chemical sensitivities has been developed and coupled with the calculated bilayer deformations to predict the mechanotransductive response of the droplets under excitation. Using the developed framework, the possibilities of energy harvesting for different droplet configurations have been investigated and reported.

A Nonlinear and Time Dependent Finite Element Analysis of Solder Joints in Surface Mounted Components Under Thermal Cycling

1991 ◽  
Vol 226 ◽  
Author(s):  
Yi-Hsin Pao ◽  
Kuan-Luen Chen ◽  
An-Yu Kuo
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Thermal Cycling ◽  
Solder Joints ◽  
Free Edge ◽  
Time Dependent ◽  
Element Analysis ◽  
Finite Element Program ◽  
Element Program ◽  
Peel Stress

AbstractA nonlinear and time dependent finite element analysis was performed on two surface mounted electronic devices subjected to thermal cycling. Constitutive equations accounting for both plasticity and creep for 37Pb/63Sn and 90Pb/10Sn solders were assumed and implemented in a finite element program ABAQUS with the aid of a user subroutine. The FE results of 37Pb/63Sn solder joints were in reasonably good agreement with the experimental data by Hall [19]. In the case of 9OPb/1OSn solder in a multilayered transistor stack, the FE results showed the existence of strong peel stress near the free edge of the joint, in addition to the anticipated shear stress. The effect of such peel stress on the crack initiation and growth as a result of thermal cycling was discussed, together with the singular behavior of both shear and peel stresses near the free edge.

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