Elastic-plastic shear deformation of frictional granular materials

Author(s):  
M. B. Szymanski
1996 ◽  
Vol 428 ◽  
Author(s):  
D. Beckers ◽  
H. Schroeder ◽  
I. Eppler ◽  
W. Schilling

AbstractAl and Al- alloys are commonly used as interconnect materials in integrated electronic devices. Stress induced voiding and degradation of metal lines by electromigration are closely related to the stresses in the lines.We have studied the strain and stress evolution during thermal cycling, isothermal relaxation and due to electromigration in passivated Al and AlSi(1%)Cu(0.5%) lines by Xray diffraction with variation of experimental parameters such as the aspect ratio and the electrical current density. Furthermore the extent of voiding and plastic shear deformation has been determined from the experimental metal strains with the help of finite element calculations.Main results are: 1) During thermal cycling the voiding is less than 2.10-3. The extent of plastic shear deformation increases with increasing line width and with decreasing flowstress. 2) During isothermal relaxation void growth occurs but no significant change in the plastic shear deformation. 3) An electric current in the lines causes no measurable additional change of the volume averaged stresses up to line failure.


Géotechnique ◽  
1970 ◽  
Vol 20 (3) ◽  
pp. 277-307 ◽  
Author(s):  
G. Mandl ◽  
R. Fernández Luque

2019 ◽  
Vol 189 ◽  
pp. 48-61 ◽  
Author(s):  
Jin-Xing Shi ◽  
Sho Kozono ◽  
Masatoshi Shimoda ◽  
Masahiro Takino ◽  
Daiki Wada ◽  
...  

Author(s):  
V. N. Dolgunin ◽  
O. O. Ivanov ◽  
S. A. Akopyan

Phenomenological approaches to describing the rheological behavior of granular materials under conditions of rapid and quasi-plastic shear deformations are considered. A unified approach to the phenomenological-logical description of the physical parameter, called the temperature of the granular medium, and the mechanisms of shear stress generation is proposed. A description is given of the mechanism for generating shear stresses under the action of a flow of pulses directed along the shear rate gradient and caused by transverse quasi-diffusion of particles. This mechanism is taken into account in the rheological model in addition to the traditional mechanism of generating kinetic shear stresses under the action of tangential shock pulses.


Nature ◽  
1988 ◽  
Vol 336 (6194) ◽  
pp. 52-54 ◽  
Author(s):  
T. Dunstan ◽  
J. R. F. Arthur ◽  
A. Dalili ◽  
O. O. Ogunbekun ◽  
R. K. S. Wong

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