Detecting the presence of 180° phase discrepancies in transmission-coefficient measurements of lossless multiport rectangular-waveguide components

1995 ◽  
Vol 9 (5) ◽  
pp. 266-269 ◽  
Author(s):  
S. P. Yeo ◽  
M. Cheng ◽  
D. J. Bannister ◽  
J. P. Ide
2011 ◽  
Vol 8 (1) ◽  
pp. 63-71
Author(s):  
Miranda Mitrovic ◽  
Branka Jokanovic

In this paper we investigate the conditions for energy tunneling through narrow channel obtained by reducing the height of rectangular waveguide. Tunneling of the energy occurs at the frequency for which the effective dielectric permittivity of the channel becomes equal to zero, so it can be treated as an ENZ (epsilon-near-zero) metamaterial. We investigated how geometry of the channel and dielectric permittivity affect the transmission coefficient and field density in the channel. Adding slots in the channel, which are placed orthogonally to the wave propagation, we designed a small antenna with directivity of 5.44 dBi at the frequency of 3 GHz.


2020 ◽  
Vol 41 (3) ◽  
pp. 245-257
Author(s):  
Adrian Gomez-Torrent ◽  
Joachim Oberhammer

AbstractThis paper reports for the first time on a micromachined interposer platform for characterizing highly miniaturized multi-port sub-THz waveguide components. The reduced size of such devices does often not allow to connect them to conventional waveguide flanges. We demonstrate the micromachined interposer concept by characterizing a miniaturized, three-port, 220–330-GHz turnstile orthomode transducer. The interposer contains low-loss micromachined waveguides for routing the ports of the device under test to standard waveguide flanges and integrated micromachined matched loads for terminating the unused ports. In addition to the interposer, the measurement setup consists of a micromachined square-to-rectangular waveguide transition. These two devices enable the characterization of such a complex microwave component in four different configurations with a standard two-port measurement setup. In addition, the design of the interposer allows for independent characterization of its sub-components and, thus, for accurate de-embedding from the measured data, as demonstrated in this paper. The measurement setup can be custom-designed for each silicon micromachined device under test and co-fabricated in the same wafer due to the batch nature of this process. The solution presented here avoids the need of CNC-milled test-fixtures or waveguide pieces that deteriorate the performance of the device under test and reduce the measurement accuracy.


Author(s):  
W. Hauth ◽  
R. Keller ◽  
U. Papziner ◽  
R. Ihmels ◽  
T. Sieverding ◽  
...  

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