Fabrication of a 17 × 17 polymer arrayed waveguide grating with flat spectral response

2010 ◽  
Vol 52 (7) ◽  
pp. 1653-1655 ◽  
Author(s):  
Zheng-Kun Qin ◽  
Chun-Sheng Ma
2013 ◽  
Vol 2013 ◽  
pp. 1-6 ◽  
Author(s):  
Hongqiang Li ◽  
Yaoting Bai ◽  
Xiaye Dong ◽  
Enbang Li ◽  
Yang Li ◽  
...  

Four methods based on a multimode interference (MMI) structure are optimally designed to flatten the spectral response of silicon-on-insulator- (SOI-) based arrayed-waveguide grating (AWG) applied in a demodulation integration microsystem. In the design for each method, SOI is selected as the material, the beam propagation method is used, and the performances (including the 3 dB passband width, the crosstalk, and the insertion loss) of the flat-top AWG are studied. Moreover, the output spectrum responses of AWGs with or without a flattened structure are compared. The results show that low insertion loss, crosstalk, and a flat and efficient spectral response are simultaneously achieved for each kind of structure. By comparing the four designs, the design that combines a tapered MMI with tapered input/output waveguides, which has not been previously reported, was shown to yield better results than others. The optimized design reduced crosstalk to approximately −21.9 dB and had an insertion loss of −4.36 dB and a 3 dB passband width, that is, approximately 65% of the channel spacing.


2013 ◽  
Vol 52 (6) ◽  
pp. 064601 ◽  
Author(s):  
Zhengkun Qin ◽  
Huiping Zhang ◽  
Guofeng Wang ◽  
Yuhai Wang ◽  
Chunsheng Ma

Author(s):  
Amelia G. Grobnic ◽  
Claire L. Callender ◽  
Robert James ◽  
Julian P. Noad

This paper focuses on the optical alignment, packaging and subsequent characterization of a low-loss acrylate polymer arrayed waveguide grating (AWG) multiplexer/demultiplexer. Process, equipment and set-ups used for optical alignment and packaging of the AWG device are presented. The AWG itself was used as a vehicle for the package characterization. The variation of the output optical power versus wavelength for the packaged AWG channels is presented, analyzed and compared with theoretical calculation results. The variation of the packaged AWG center wavelength for each channel with temperature (peak wavelength thermal shift) over a range of temperatures between 18°C and 42°C is analyzed and the test results discussed. The thermal stability of the packaged AWG device, determined by the spectral response measurements over a similar range of temperatures is investigated. During the heating and cooling processes the packaged AWG is subjected to thermal stress. These phenomena are investigated and a thermal analysis (temperature distribution simulation) performed. Finally, conclusions and recommendations for future AWG packaging are presented.


2013 ◽  
Vol 42 (4) ◽  
pp. 379-385
Author(s):  
张俪耀 ZHANG Li-yao ◽  
吴远大 WU Yuan-da ◽  
安俊明 AN Jun-ming ◽  
王玥 WANG Yue ◽  
王亮亮 WANG Liang-liang ◽  
...  

2015 ◽  
Vol 32 (5) ◽  
pp. 054202 ◽  
Author(s):  
Xi-Lin Zhang ◽  
Song-Tao Liu ◽  
Dan Lu ◽  
Rui-Kang Zhang ◽  
Chen Ji

2002 ◽  
Author(s):  
Thomas Kamalakis ◽  
Thomas Sphicopoulos ◽  
Dimitrios Syvridis

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