This paper presents a low loss fully embedded bandpass filter (BPF) using low temperature co-fired ceramic (LTCC) for multilayer System-in-Package (SiP) and Multi-Chip-Module (MCM) applications, e.g. wireless applications for the unlicensed 60 GHz band. The measured insertion loss was 1.5 dB at the center frequency 58 GHz, and a return loss of less than −10 dB was achieved, including two grounded coplanar waveguide transmission line (CPWg) to stripline transitions. The four layers BPF has a 3 dB bandwidth of about 11 GHz which supplies e.g. broadband and high data rate applications. The whole BPF requires a substrate area of 5.6 × 2.1 × 0.42 mm3 with transitions and a shielding via fence. This BPF suits well for V-band applications in a LTCC package because of the compact dimensions and the good performance.
DUAL-BAND BANDPASS FILTER DESIGN USING STUB-LOADED HAIRPIN RESONATOR AND MEANDERING UNIFORM IMPEDANCE RESONATOR