Dimensional metrology of additively manufactured lattice structures by combined tactile probe and X‐ray tomography

2020 ◽  
Author(s):  
Anton Plessis ◽  
Gerd Schwaderer ◽  
Ilaria Cristofolini ◽  
Marco Zago ◽  
Matteo Benedetti
Keyword(s):  
Lattice Structures ◽  
Dimensional Metrology ◽  
X Ray ◽  
Tactile Probe

scholarly journals X-ray Metrology for the SemiconductorIndustry Tutorial

2019 ◽  
Vol 124 ◽  
Author(s):  
Daniel F. Sunday ◽  
Wen-li Wu ◽  
Scott Barton ◽  
R. Joseph Kline
Keyword(s):  
Data Processing ◽  
Small Angle ◽  
Semiconductor Industry ◽  
Critical Dimension ◽  
Next Generation ◽  
Dimensional Metrology ◽  
X Ray ◽  
X Ray Scattering ◽  
Short Course ◽  
Ray Scattering

The semiconductor industry is in need of new, in-line dimensional metrology methods with higherspatial resolution for characterizing their next generation nanodevices. The purpose of this short course is to train the semiconductor industry on the NIST-developed critical dimension small angle X-ray scattering (CDSAXS) method. The topics will include both data processing and instrumentation. The short course will also provide an opportunity for discussion of the requirements for CDSAXS and the necessary improvements in X-ray source technology. Expected audience include semiconductor manufacturers, equipment manufacturers, and component manufacturers. The presentations were made at “X-ray Metrology for the Semiconductor Industry” short course at the National Institute of Standards and Technology on Aug. 25, 2016.

scholarly journals OBSERVATIONS ON THE PERFORMANCE OF X-RAY COMPUTED TOMOGRAPHY FOR DIMENSIONAL METROLOGY

2016 ◽  
Vol XLI-B5 ◽  
pp. 25-31
Author(s):  
H. C. Corcoran ◽  
S. B. Brown ◽  
S. Robson ◽  
R. D. Speller ◽  
M. B. McCarthy
Keyword(s):  
Computed Tomography ◽  
Reverse Engineering ◽  
X Rays ◽  
Dimensional Metrology ◽  
Beam Hardening ◽  
X Ray ◽  
Accuracy And Precision ◽  
Dimensional Measurements ◽  
X Ray Computed

X-ray computed tomography (XCT) is a rising technology within many industries and sectors with a demand for dimensional metrology, defect, void analysis and reverse engineering. There are many variables that can affect the dimensional metrology of objects imaged using XCT, this paper focusses on the effects of beam hardening due to the orientation of the workpiece, in this case a holeplate, and the volume of material the X-rays travel through. Measurements discussed include unidirectional and bidirectional dimensions, radii of cylinders, fit point deviations of the fitted shapes and cylindricity. Results indicate that accuracy and precision of these dimensional measurements are affected in varying amounts, both by the amount of material the X-rays have travelled through and the orientation of the object.

X-ray characterization of contact holes for block copolymer lithography

2019 ◽  
Vol 52 (1) ◽  
pp. 106-114
Author(s):  
Daniel F. Sunday ◽  
Florian Delachat ◽  
Ahmed Gharbi ◽  
Guillaume Freychet ◽  
Christopher D. Liman ◽  
...  
Keyword(s):  
Self Assembly ◽  
Low Cost ◽  
Ion Beam ◽  
Three Dimensional ◽  
Incident Beam ◽  
Residual Layer ◽  
Processing Conditions ◽  
Dimensional Metrology ◽  
Grid Pattern ◽  
X Ray

The directed self-assembly (DSA) of block copolymers (BCPs) is a promising low-cost approach to patterning structures with critical dimensions (CDs) which are smaller than can be achieved by traditional photolithography. The CD of contact holes can be reduced by assembling a cylindrical BCP inside a patterned template and utilizing the native size of the cylinder to dictate the reduced dimensions of the hole. This is a particularly promising application of the DSA technique, but in order for this technology to be realized there is a need for three-dimensional metrology of the internal structure of the patterned BCP in order to understand how template properties and processing conditions impact BCP assembly. This is a particularly challenging problem for traditional metrologies owing to the three-dimensional nature of the structure and the buried features. By utilizing small-angle X-ray scattering and changing the angle between the incident beam and sample we can reconstruct the three-dimensional shape profile of the empty template and the residual polymer after self-assembly and removal of one of the phases. A two-dimensional square grid pattern of the holes results in scattering in both in-plane directions, which is simplified by converting to a radial geometry. The shape is then determined by simulating the scattering from a model and iterating that model until the simulated and experimental scattering profiles show a satisfactory match. Samples with two different processing conditions are characterized in order to demonstrate the ability of the technique to evaluate critical features such as residual layer thickness and sidewall height. It was found that the samples had residual layer thicknesses of 15.9 ± 3.2 nm and 4.5 ± 2.2 nm, which were clearly distinguished between the two different DSA processes and in good agreement with focused ion beam scanning transmission electron microscopy (FIBSTEM) observations. The advantage of the X-ray measurements is that FIBSTEM characterizes around ten holes, while there are of the order of 800 000 holes illuminated by the X-ray beam.

X-ray computed tomography: from medical imaging to dimensional metrology

2019 ◽  
Vol 60 ◽  
pp. 544-569 ◽  
Author(s):  
Herminso Villarraga-Gómez ◽  
Ericka L. Herazo ◽  
Stuart T. Smith
Keyword(s):  
Computed Tomography ◽  
Medical Imaging ◽  
Dimensional Metrology ◽  
X Ray ◽  
X Ray Computed
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