Finite Element Modeling of a Semi‐Cylinder Polymeric Composite Product Under Impact and Thermal Conditions

2021 ◽  
Vol 396 (1) ◽  
pp. 2000319
Author(s):  
Sorin Ion ◽  
Dan Niṭoi ◽  
Oana Chivu ◽  
Constantin Gheorghe Opran
Keyword(s):  
Finite Element ◽  
Finite Element Modeling ◽  
Thermal Conditions ◽  
Polymeric Composite ◽  
Element Modeling ◽  
Composite Product

Underfill Induced Tensile Strain Ratcheting and its Effect on Flip Chip Solder Bump Fatigue

2010 ◽  
Vol 2010 (DPC) ◽  
pp. 000737-000758 ◽  
Author(s):  
Craig D. Hillman ◽  
Randy Schueller ◽  
Greg Caswell
Keyword(s):  
Finite Element ◽  
Tensile Stress ◽  
Finite Element Modeling ◽  
Flip Chip ◽  
Solder Bump ◽  
Coefficient Of Thermal Expansion ◽  
Thermal Conditions ◽  
Temperature Dependent ◽  
Element Modeling ◽  
Stress States

The effects of low Tg underfill material on the reliability of high-Pb first level interconnects were assessed through elastic-plastic finite element modeling and inspection of failure sites at the first-level interconnect. Temperature-dependent changes in specific underfill parameters (elastic modulus and coefficient of thermal expansion) induced a primary tensile stress within the solder bump. The presence and magnitude of this tensile stress were highly dependent upon the maximum and minimum temperature of exposure. Under certain specific thermal conditions, a form of tensile ratcheting was identified through finite element modeling. The application of tensile stress was found to induce a change in degradation behavior and rates relative to the nominal shear stress state (see Figure). This effectively eliminated distance-to-neutral point as a predictor of first-level interconnects performance and required the development of new models to predict solder bump behavior. A discussion on this transformation in stress states and the potential influence on changes in part qualification procedures are provided.

Exact First Order Finite Element Modeling for Eddy Current NDE

1991 ◽  
Vol 3 (1) ◽  
pp. 235-253 ◽  
Author(s):  
L. D. Philipp ◽  
Q. H. Nguyen ◽  
D. D. Derkacht ◽  
D. J. Lynch ◽  
A. Mahmood
Keyword(s):  
Finite Element ◽  
Finite Element Modeling ◽  
Eddy Current ◽  
Element Modeling ◽  
First Order ◽  
Eddy Current Nde

Tire Vibration Modes and Effects on Vehicle Ride Quality

1993 ◽  
Vol 21 (1) ◽  
pp. 23-39 ◽  
Author(s):  
R. W. Scavuzzo ◽  
T. R. Richards ◽  
L. T. Charek
Keyword(s):  
Finite Element ◽  
Finite Element Modeling ◽  
Operating Conditions ◽  
Modal Testing ◽  
Ride Quality ◽  
Vibration Modes ◽  
Inflation Pressure ◽  
Passenger Cars ◽  
Element Modeling ◽  
Road Surfaces

Abstract Tire vibration modes are known to play a key role in vehicle ride, for applications ranging from passenger cars to earthmover equipment. Inputs to the tire such as discrete impacts (harshness), rough road surfaces, tire nonuniformities, and tread patterns can potentially excite tire vibration modes. Many parameters affect the frequency of tire vibration modes: tire size, tire construction, inflation pressure, and operating conditions such as speed, load, and temperature. This paper discusses the influence of these parameters on tire vibration modes and describes how these tire modes influence vehicle ride quality. Results from both finite element modeling and modal testing are discussed.

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