Influence of temperature on electrochemical behavior and oxide film property of Alloy 800 in hydrogenated high temperature water

2015 ◽  
Vol 67 (8) ◽  
pp. 796-803 ◽  
Author(s):  
J.-Z. Wang ◽  
J.-Q. Wang ◽  
E.-H. Han
Keyword(s):  
High Temperature ◽  
Oxide Film ◽  
Electrochemical Behavior ◽  
Film Property ◽  
Influence Of Temperature ◽  
Alloy 800 ◽  
High Temperature Water ◽  
Influence Of Temperature On ◽  
Temperature Water

Identification of the Initial Oxide Films on 18-8 Stainless Steel in High Temperature Water

CORROSION ◽  
1968 ◽  
Vol 24 (10) ◽  
pp. 336-337 ◽  
Author(s):  
T. NAKAYAMA ◽  
Y. OSHIDA
Keyword(s):  
Stainless Steel ◽  
High Temperature ◽  
Oxide Film ◽  
Oxide Films ◽  
Spinel Type ◽  
High Temperature Water ◽  
Temperature Water

Abstract Initial oxide film formed on 18–8 stainless steel in high temperature water at 300 C (572 F) for 1 hour was identical with corundum type crystals like (Cr, Fe)2O3 alone or its coexistence with α-Fe2O3. On the contrary, the oxide film produced by prolonged oxidation (24 hours) consisted mainly of the spinel type crystals containing nickel.

Transient Photoelectrochemical Analysis of the Semiconductor Properties of Oxide Films on Alloys

2014 ◽  
Vol 1015 ◽  
pp. 513-516
Author(s):  
Yu Tan ◽  
Wan Wan Wang ◽  
Sheng Han Zhang ◽  
Ke Xin Liang
Keyword(s):  
Stainless Steel ◽  
High Temperature ◽  
Oxide Film ◽  
Oxide Films ◽  
Analysis Method ◽  
Stainless Steel 316L ◽  
Minute Amount ◽  
High Temperature Water ◽  
Temperature Water ◽  
Semiconductor Properties

A transient photoelectrochemical analysis method is improved to investigate the semiconductor properties of oxide films on stainless steel 316L oxidized in high-temperature water. A minute amount of ZnO was added to the high-temperature water environment to alter the semiconductor properties of the oxide film deposited on stainless steel 316L. Characteristic phases in the oxide were investigated using the improved photoelectrochemical analysis method, and the semiconductor properties of the oxide film on stainless steel 316L suggested the presence of an n-type semiconductor. The photoelectrochemical dephasing angle showed movement of the flat band potential in the negative direction after ZnO addition.

Effects of Environmental Factors on the Electronic Properties of Interfacial Oxide Film on 304L Stainless Steel in High Temperature Pure Water

2004 ◽  
Vol 261-263 ◽  
pp. 919-924 ◽  
Author(s):  
Zhan Peng Lu ◽  
Yo-ichi Takeda ◽  
Tetsuo Shoji
Keyword(s):  
Stainless Steel ◽  
High Temperature ◽  
Oxide Film ◽  
Electronic Properties ◽  
Pure Water ◽  
Oxide Films ◽  
304L Stainless Steel ◽  
Film Properties ◽  
High Temperature Water ◽  
Temperature Water

The electronic properties of the interfacial oxide film formed on 304L stainless steel in high temperature water are investigated by contact electric resistance (CER) measurements. Tests are performed in pure water with a wide range of dissolved oxygen (DO) content at 200, 250, and 288°C. The electrochemical potential (ECP) moves in the noble direction and CER increases when increasing DO. Results show that DO content has a dominant effect on the electronic properties of oxide film. The change of oxide film properties can also be attributed to the variation of the electrochemical potential, which is directly affected by DO content. Critical potentials exist for the formation and reduction of oxide films in high temperature water. Multiple steps are found for the reduction of oxide films due to de-aeration in 200, 250, and 288°C water, implying the presence of multiple-layer interfacial oxide films. The film reduction process is relatively slower than the film formation process. Present results show that even in high purity water, a moderate change of DO content can result in different surface conditions. Dissolved hydrogen has a moderate effect on interfacial surface films in deaerated water. In-situ monitoring of the oxide film properties by CER technique provides information on the interfacial reactions that are related to the SCC behavior of materials in high temperature water environments.

Effect of Oxide Film Thickness on Stress-Strain Field at the Tip of Stress Corrosion Cracking

2011 ◽  
Vol 474-476 ◽  
pp. 1128-1131
Author(s):  
Wei Tang ◽  
He Xue ◽  
Dan Zhao
Keyword(s):  
High Temperature ◽  
Oxide Film ◽  
Film Thickness ◽  
Strain Field ◽  
Water Environment ◽  
Structural Materials ◽  
Stress Strain ◽  
High Temperature Water ◽  
Oxide Film Thickness ◽  
Temperature Water

Environmentally assisted cracking (EAC) or stress corrosion cracking (SCC) of key structural materials in the environments of the light water reactor is one of the main problems for the management of the structural safety and service life of nuclear power plants. To understand the effect of oxide film thickness on SCC growth in structural materials in a high temperature water environment, the stress-strain field at the tip of a SCC in nickel base alloy constituted by base metal and oxide film was analyzed in this paper by finite element method using commercial software. The effects of oxide film thickness on the stress-strain field at the tip of the SCC was obtained, which provides a new insight into the research of the mechanism of SCC growth in structural materials in a high temperature water environment.

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