Kinetic evidence for the copper peroxide intermediate with two copper ions in proximity

2006 ◽  
Vol 38 (7) ◽  
pp. 439-443 ◽  
Author(s):  
S. Selvarani ◽  
B. Medona ◽  
M. S. Ramachandran
Keyword(s):  
Copper Ions ◽  
Copper Peroxide

The Effect of Copper Ions on Clot Lysis Time in the Fibrinolytic Assay of Streptokinase

1965 ◽  
Vol 13 (02) ◽  
pp. 477-483
Author(s):  
Alwin B. Bogert
Keyword(s):  
Copper Ions ◽  
Borate Buffer ◽  
Fibrinolytic System ◽  
Clot Lysis ◽  
Distilled Water ◽  
Naturally Occurring ◽  
Lysis Time ◽  
Low Levels ◽  
Effect Of Copper ◽  
Clot Lysis Time

SummaryExperiments were conducted to determine why different lots of Borate Buffer reagent affect the clot lysis times obtained in the fibrinolytic assay of Streptokinase. Minerals naturally occurring in distilled water were screened individually to determine their influence on lysis. Copper was found to have a very pronounced effect in this regard on the fibrinolytic system in that low levels reduce the lysis time and high levels increase it.

The role of copper ions in hydrogen peroxide bleaching: Their origin, removal, and effect on pulp quality

TAPPI Journal ◽  
2012 ◽  
Vol 11 (7) ◽  
pp. 37-46 ◽  
Author(s):  
PEDRO E.G. LOUREIRO ◽  
SANDRINE DUARTE ◽  
DMITRY V. EVTUGUIN ◽  
M. GRAÇA V.S. CARVALHO
Keyword(s):  
Hydrogen Peroxide ◽  
Copper Ions ◽  
Peroxide Bleaching ◽  
Metals Removal ◽  
Peroxide Decomposition ◽  
Equipment Corrosion ◽  
And Performance ◽  
And Control ◽  
Main Effects

This study puts particular emphasis on the role of copper ions in the performance of hydrogen peroxide bleaching (P-stage). Owing to their variable levels across the bleaching line due to washing filtrates, bleaching reagents, and equipment corrosion, these ions can play a major role in hydrogen peroxide decomposition and be detrimental to polysaccharide integrity. In this study, a Cu-contaminated D0(EOP)D1 prebleached pulp was subjected to an acidic washing (A-stage) or chelation (Q-stage) before the alkaline P-stage. The objective was to understand the isolated and combined role of copper ions in peroxide bleaching performance. By applying an experimental design, it was possible to identify the main effects of the pretreatment variables on the extent of metals removal and performance of the P-stage. The acid treatment was unsuccessful in terms of complete copper removal, magnesium preservation, and control of hydrogen peroxide consumption in the following P-stage. Increasing reaction temperature and time of the acidic A-stage improved the brightness stability of the D0(EOP)D1AP bleached pulp. The optimum conditions for chelation pretreatment to maximize the brightness gains obtained in the subsequent P-stage with the lowest peroxide consumption were 0.4% diethylenetriaminepentaacetic acid (DTPA), 80ºC, and 4.5 pH.

Assessment of Reliability of cap layers used in Cu-Black DiamondTM Interconnects

2003 ◽  
Vol 766 ◽  
Author(s):  
Ahila Krishnamoorthy ◽  
N.Y. Huang ◽  
Shu-Yunn Chong
Keyword(s):  
Dielectric Layer ◽  
Dielectric Breakdown ◽  
Copper Ions ◽  
Dielectric Strength ◽  
Time Dependent ◽  
Breakdown Field ◽  
Field Range ◽  
Time Dependent Dielectric Breakdown ◽  
Voltage Ramp ◽  
Low K

AbstractBlack DiamondTM. (BD) is one of the primary candidates for use in copper-low k integration. Although BD is SiO2 based, it is vastly different from oxide in terms of dielectric strength and reliability. One of the main reliability concerns is the drift of copper ions under electric field to the surrounding dielectric layer and this is evaluated by voltage ramp (V-ramp) and time dependent dielectric breakdown (TDDB). Metal 1 and Metal 2 intralevel comb structures with different metal widths and spaces were chosen for dielectric breakdown studies. Breakdown field of individual test structures were obtained from V-ramp tests in the temperature range of 30 to 150°C. TDDB was performed in the field range 0.5 – 2 MV/cm. From the leakage between combs at the same level (either metal 1 or metal 2) Cu drift through SiC/BD or SiN/BD interface was characterized. It was found that Cu/barrier and barrier/low k interfaces functioned as easy paths for copper drift thereby shorting the lines. Cu/SiC was found to provide a better interface than Cu/SiN.

STUDY OF THE ADSORPTION ACTIVITY OF THE BIOFILMS OF THE IRONAND MANGANESE-OXIDIZING BACTERIA IN RELATING TO COPPER IONS CU2+ AND LEAD PB2+

2020 ◽  
Vol 21 (2) ◽  
pp. 73-76
Author(s):  
V.S. SHIMANOVA ◽  
◽  
L.V. LEONOVA ◽  
I.A. BULATOV ◽  
I.V. ANANINA ◽  
...  
Keyword(s):  
Copper Ions ◽  
Adsorption Activity

Long-Term Copper Toxicity on Scenedesmus quadricauda and Complexing Polypeptides

1995 ◽  
Vol 30 (2) ◽  
pp. 265-276 ◽  
Author(s):  
Denis Bussières ◽  
Raynald Côté ◽  
Clément Richard ◽  
Édith St-Pierre
Keyword(s):  
Heavy Metal ◽  
Sharp Increase ◽  
Copper Ions ◽  
Copper Toxicity ◽  
Scenedesmus Quadricauda ◽  
Continuous Exposure ◽  
Exponential Curve ◽  
Negative Exponential

Abstract Long-term copper toxicity has been demonstrated in Scenedesmus quadricauda. Upon continuous exposure to copper ions at 250 μg/L, the algae responded by a sharp increase in the synthesis of complexing polypeptides to chelate Cu. Complexing polypeptides gradually decreased, as observed by six sampling tests over 732 h, resembling to a negative exponential curve. This gradual diminution is considered to be a prime mechanism of acclimation or of adaptation to a heavy metal contaminated environment.

scholarly journals Complexation of copper ions in atmospheric precipitation in Croatia

2008 ◽  
Vol 87 (1) ◽  
pp. 80-87 ◽  
Author(s):  
Marta Plavšić ◽  
Palma Orlović-Leko ◽  
Zlatica Kozarac ◽  
Elvira Bura-Nakić ◽  
Slađana Strmečki ◽  
...  
Keyword(s):  
Copper Ions ◽  
Atmospheric Precipitation

scholarly journals Antimicrobial Property of Polypropylene Composites and Functionalized Copper Nanoparticles

Polymers ◽  
2021 ◽  
Vol 13 (11) ◽  
pp. 1694
Author(s):  
Noemi Jardón-Maximino ◽  
Gregorio Cadenas-Pliego ◽  
Carlos A. Ávila-Orta ◽  
Víctor Eduardo Comparán-Padilla ◽  
Luis E. Lugo-Uribe ◽  
...  
Keyword(s):  
Copper Nanoparticles ◽  
Crystallization Process ◽  
Copper Ions ◽  
Antimicrobial Property ◽  
Aminobutyric Acid ◽  
New Materials ◽  
Melt Mixing ◽  
Polypropylene Composites ◽  
And Staphylococcus Aureus ◽  
Thermal Stability Of

Copper nanoparticles (CuNPs) functionalized with polyethyleneimine (PEI) and 4-aminobutyric acid (GABA) were used to obtain composites with isotactic polypropylene (iPP). The iPP/CuNPs composites were prepared at copper concentrations of 0.25–5.0 wt % by melt mixing, no evidence of oxidation of the CuNP was observed. Furthermore, the release of copper ions from iPP/CuNPs composites in an aqueous medium was studied. The release of cupric ions was higher in the composites with 2.5 and 5.0 wt %. These composites showed excellent antibacterial activity (AA) toward Pseudomona aeruginosa (P. aeruginosa) and Staphylococcus aureus (S. aureus). The incorporation of CuNP into the iPP polymeric matrix slightly decreased the thermal stability of the composite material but improved the crystallinity and the storage modulus. This evidence suggests that CuNPs could work as nucleating agents in the iPP crystallization process. The iPP/CuNPs composites presented better AA properties compared to similar composites reported previously. This behavior indicates that the new materials have great potential to be used in various applications that can be explored in the future.

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