Bioaccumulation of Selected Halogenated Organic Flame Retardants in Lake Ontario

2019 ◽  
Vol 38 (6) ◽  
pp. 1198-1210 ◽  
Author(s):  
Perihan B. Kurt‐Karakus ◽  
Derek C.G. Muir ◽  
Benjamin de Jourdan ◽  
Camilla Teixeira ◽  
Jessica Epp Martindale ◽  
...  
Keyword(s):  
Flame Retardants ◽  
Lake Ontario

BROMINATED AND CHLORINATED FLAME RETARDANTS IN LAKE ONTARIO, CANADA, LAKE TROUT (SALVELINUS NAMAYCUSH) BETWEEN 1979 AND 2004 AND POSSIBLE INFLUENCES OF FOOD-WEB CHANGES

2009 ◽  
Vol 28 (5) ◽  
pp. 910 ◽  
Author(s):  
Nargis Ismail ◽  
Sarah B. Gewurtz ◽  
Kerri Pleskach ◽  
D. Michael Whittle ◽  
Paul A. Helm ◽  
...  
Keyword(s):  
Food Web ◽  
Flame Retardants ◽  
Lake Trout ◽  
Lake Ontario ◽  
Salvelinus Namaycush

Dechlorane Plus and Other Flame Retardants in a Sediment Core from Lake Ontario

2007 ◽  
Vol 41 (17) ◽  
pp. 6014-6019 ◽  
Author(s):  
Xinghua Qiu ◽  
Chris H. Marvin ◽  
Ronald A. Hites
Keyword(s):  
Sediment Core ◽  
Flame Retardants ◽  
Lake Ontario ◽  
Dechlorane Plus

Conductive Filament Formation in Printed Circuit Boards – Effects of Reflow Conditions and Flame Retardants

2009 ◽  
Author(s):  
Bhanu Sood ◽  
Michael Pecht
Keyword(s):  
Flame Retardants ◽  
Printed Circuit Boards ◽  
Electrochemical Process ◽  
Lead Free ◽  
Circuit Boards ◽  
Filament Formation ◽  
Conductive Filament ◽  
Printed Circuit ◽  
Free Solder ◽  
Halogen Free

Abstract Failures in printed circuit boards account for a significant percentage of field returns in electronic products and systems. Conductive filament formation is an electrochemical process that requires the transport of a metal through or across a nonmetallic medium under the influence of an applied electric field. With the advent of lead-free initiatives, boards are being exposed to higher temperatures during lead-free solder processing. This can weaken the glass-fiber bonding, thus enhancing conductive filament formation. The effect of the inclusion of halogen-free flame retardants on conductive filament formation in printed circuit boards is also not completely understood. Previous studies, along with analysis and examinations conducted on printed circuit boards with failure sites that were due to conductive filament formation, have shown that the conductive path is typically formed along the delaminated fiber glass and epoxy resin interfaces. This paper is a result of a year-long study on the effects of reflow temperatures, halogen-free flame retardants, glass reinforcement weave style, and conductor spacing on times to failure due to conductive filament formation.

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