Reduced power degradation in bifacial PERC modules by a rear silicon oxide additive layer

2021 ◽  
Author(s):  
Tian Pu ◽  
Honglie Shen ◽  
Kuang Hong Neoh ◽  
Fei Ye ◽  
Quntao Tang
Keyword(s):  
Silicon Oxide ◽  
Oxide Additive

Analytical Electron Microscopy Study of Second-Phase Particles in 7075 and 7475 Aluminum Alloys

1985 ◽  
Vol 43 ◽  
pp. 348-349
Author(s):  
M. Raghavan ◽  
J. Y. Koo ◽  
J. W. Steeds ◽  
B. K. Park
Keyword(s):  
Aluminum Alloys ◽  
Silicon Oxide ◽  
Analytical Electron Microscopy ◽  
Microscopy Study ◽  
Electron Microscopy Study ◽  
Partial Substitution ◽  
Second Phase ◽  
X Ray ◽  
Second Phase Particles ◽  
Almost All

X-ray microanalysis and Convergent Beam Electron Diffraction (CBD) studies were conducted to characterize the second phase particles in two commercial aluminum alloys -- 7075 and 7475. The second phase particles studied were large (approximately 2-5μm) constituent phases and relatively fine ( ∼ 0.05-1μn) dispersoid particles, Figures 1A and B. Based on the crystal structure and chemical composition analyses, the constituent phases found in these alloys were identified to be Al7Cu2Fe, (Al,Cu)6(Fe,Cu), α-Al12Fe3Si, Mg2Si, amorphous silicon oxide and the modified 6Fe compounds, in decreasing order of abundance. The results of quantitative X-ray microanalysis of all the constituent phases are listed in Table I. The data show that, in almost all the phases, partial substitution of alloying elements occurred resulting in small deviations from the published stoichiometric compositions of the binary and ternary compounds.

LVSEM: Past Present and Future

1990 ◽  
Vol 48 (1) ◽  
pp. 364-365
Author(s):  
James B. Pawley
Keyword(s):  
Field Emission ◽  
Line Width ◽  
Time Scales ◽  
Silicon Oxide ◽  
Beam Current ◽  
High Brightness ◽  
High Beam ◽  
Fixed Charges ◽  
Beam Voltage ◽  
Deposited Metal

Past: In 1960 Thornley published the first description of SEM studies carried out at low beam voltage (LVSEM, 1-5 kV). The aim was to reduce charging on insulators but increased contrast and difficulties with low beam current and frozen biological specimens were also noted. These disadvantages prevented widespread use of LVSEM except by a few enthusiasts such as Boyde. An exception was its use in connection with studies in which biological specimens were dissected in the SEM as this process destroyed the conducting films and produced charging unless LVSEM was used.In the 1980’s field emission (FE) SEM’s came into more common use. The high brightness and smaller energy spread characteristic of the FE-SEM’s greatly reduced the practical resolution penalty associated with LVSEM and the number of investigators taking advantage of the technique rapidly expanded; led by those studying semiconductors. In semiconductor research, the SEM is used to measure the line-width of the deposited metal conductors and of the features of the photo-resist used to form them. In addition, the SEM is used to measure the surface potentials of operating circuits with sub-micrometer resolution and on pico-second time scales. Because high beam voltages destroy semiconductors by injecting fixed charges into silicon oxide insulators, these studies must be performed using LVSEM where the beam does not penetrate so far.

G Optimal Design in Non linear Models to Increase Silicon Oxide Purity Levels and Electrical Conductivity

2018 ◽  
pp. 150-155
Author(s):  
Muklas Rivai
Keyword(s):  
Electrical Conductivity ◽  
Optimal Design ◽  
Linear Models ◽  
Silicon Oxide ◽  
Information Matrix ◽  
Relevant Information ◽  
Non Linear

Optimal design is a design which required in determining the points of variable factors that would be attempted to optimize the relevant information so that fulfilled the desired criteria. The optimal fulfillment criteria based on the information matrix of the selected model.

Mechanoactivation Of Rice Husk Ash In Laboratory Conditions

2019 ◽  
pp. 20-26
Keyword(s):  
Mechanical Activation ◽  
Rice Husk ◽  
Amorphous Silica ◽  
Silicon Oxide ◽  
Rice Husk Ash ◽  
Pozzolanic Activity ◽  
Maximum Solubility ◽  
Laboratory Conditions ◽  
Before And After ◽  
Mineral Additive

In many rice producing countries of the world, including in Vietnam, various research aimed at using rice husk ash (RHA) as a finely dispersed active mineral additive in cements, concrete and mortars are being conducted. The effect of the duration of the mechanoactivation of the RHA, produced under laboratory conditions in Vietnam, on its pozzolanic activity were investigated in this study. The composition of ash was investigated by laser granulometry and the values of indicators characterizing the dispersion of its particles before and after mechanical activation were established. The content of soluble amorphous silicon oxide in rice husk ash samples was determined by photocolorimetric analysis. The pizzolanic activity of the RHA, fly ash and the silica fume was also compared according to the method of absorption of the solution of the active mineral additive. It is established that the duration of the mechanical activation of rice husk ash by grinding in a vibratory mill is optimal for increasing its pozzolanic activity, since it simultaneously results in the production of the most dispersed ash particles with the highest specific surface area and maximum solubility of the amorphous silica contained in it. Longer grinding does not lead to further reduction in the size of ash particles, which can be explained by their aggregation, and also reduces the solubility of amorphous silica in an aqueous alkaline medium.

Hot electrons in silicon oxide

2016 ◽  
Vol 187 (09) ◽  
pp. 971-979
Author(s):  
Vladimir A. Gritsenko
Keyword(s):  
Silicon Oxide ◽  
Hot Electrons

Studies on Chemical Methods to Expose Gate/Tunnel Oxide and Identification of Gate/Tunnel Oxide Defects in Wafer Fabrication

2002 ◽  
Author(s):  
Y. N. Hua ◽  
G. B. Ang ◽  
S. Redkar ◽  
Yogaspari ◽  
Wilma Richter
Keyword(s):  
Acetic Acid ◽  
Silicon Oxide ◽  
Wafer Fabrication ◽  
Chemical Methods ◽  
Advantages And Disadvantages ◽  
Different Types ◽  
Capacitor Structure ◽  
Oxide Defects ◽  
Buffer Oxide Etchant ◽  
Etch Time

Abstract In failure analysis of wafer fabrication, currently, three different types of chemical methods including 6:6:1 (Acetic Acid/HNO3/HF), NaOH and Choline are used in removing polysilicon (poly) layer and exposing the gate/tunnel oxide underneath. However, usage is limited due to their disadvantages. For example, 6:6:1 is a relatively fast etchant, but it is difficult to control the etch time and keep the oxide layer intact. Also, while using NaOH to remove poly and expose the silicon oxide, the solution needs to be heated. It is also difficult to etch a poly layer with a WSix or a CoSix silicide using NaOH. In this paper, we will discuss these 3 etchants in terms of their advantages and disadvantages. We will then introduce a new poly etchant, called HB91. HB91 is useful for removing poly to expose the gate/tunnel oxide for identification of related defects. HB91 is actually a mixture of two chemicals namely nitric acid (HNO3) and buffer oxide etchant (BOE) in a 9:1 ratio. The experimental results show that it is highly selective in poly removal with respect to the gate/tunnel oxide and is a suitable poly etchant especially for removing polysilicon with/without WSix and CoSix in the large capacitor structure. Application results of this poly etchant (HB91) will be presented.

Dendritic Growth Failure of a Mesa Diode

1997 ◽  
Author(s):  
P. Singh ◽  
V. Cozzolino ◽  
G. Galyon ◽  
R. Logan ◽  
K. Troccia ◽  
...  
Keyword(s):  
Electric Fields ◽  
Dendritic Growth ◽  
Silicon Oxide ◽  
Impact Ionization ◽  
Electron Tunneling ◽  
Growth Failure ◽  
Side Wall ◽  
Oxide Interface ◽  
Band Bending ◽  
Cross Section Area

Abstract The time delayed failure of a mesa diode is explained on the basis of dendritic growth on the oxide passivated diode side walls. Lead dendrites nucleated at the p+ side Pb-Sn solder metallization and grew towards the n side metallization. The infinitesimal cross section area of the dendrites was not sufficient to allow them to directly affect the electrical behavior of the high voltage power diodes. However, the electric fields associated with the dendrites caused sharp band bending near the silicon-oxide interface leading to electron tunneling across the band gap at velocities high enough to cause impact ionization and ultimately the avalanche breakdown of the diode. Damage was confined to a narrow path on the diode side wall because of the limited influence of the electric field associated with the dendrite. The paper presents experimental details that led to the discovery of the dendrites. The observed failures are explained in the context of classical semiconductor physics and electrochemistry.

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