scholarly journals Mechanically flexible viscosity sensor for real‐time monitoring of tubular architectures for industrial applications

2020 ◽  
Author(s):  
Maha A. Nour ◽  
Sherjeel M. Khan ◽  
Nadeem Qaiser ◽  
Saleh A. Bunaiyan ◽  
Muhammad M. Hussain
Sensors ◽  
2020 ◽  
Vol 20 (14) ◽  
pp. 3907 ◽  
Author(s):  
Maha A. Nour ◽  
Muhammad M. Hussain

The real-time monitoring of fluid properties in tubular systems, such as viscosity and flow rate, is essential for industries utilizing liquid mediums. Nowadays, most studies of the fluid characteristics are performed off-line using laboratory facilities that can provide accurate results, yet they do not match the demanded industrial pace. Off-line measurements are ineffective and time-consuming. The available real-time monitoring sensors for fluid properties are generally destructive methods that produce significant and persistent damage to the tubular systems during the installation process. Others use huge and bulky invasive instrument methods that generate considerable pressure reduction and energy loss in tubular systems. For these drawbacks, industries centered their attention on non-invasive and non-destructive testing (NDT) methodologies, which are installed on the outer tubular surface to avoid flow disturbance and desist shutting down systems for installations. Although these sensors showed excellent achievement for monitoring and inspecting pipe health conditions, the performance was not convincing for monitoring the properties of fluids. This review paper presents an overview of the real-time monitoring of fluid properties in tubular systems for industrial applications, particularly for pipe monitoring sensors, viscosity, and flow measurements. Additionally, the different available sensing mechanisms and their advantages, drawbacks, and potentials are discussed.


MRS Bulletin ◽  
1995 ◽  
Vol 20 (5) ◽  
pp. 49-55 ◽  
Author(s):  
Nikolaus Dietz ◽  
Klaus J. Bachmann

The engineering of advanced micro-electronic circuits, optoelectronic devices, and integrated optical circuits requires precise control of the lateral dimensions and thicknesses of device features and of the stoichiometry and doping of epitaxial semiconductor regions. This is preferably achieved by real-time monitoring and control of the individual deposition and etching processes that constitute the processing sequence. The use of optical probe techniques for the real-time monitoring of etching and/or growth processes is favored because of their nondestructive character and their potential use in real-time feedback control. Some of these methods are ideal in monitoring the overall growth process and/or substrate temperature in industrial applications, requiring low cost and maintenance. For example, in situ reflectance-spectroscopy methods, such as dynamic optical reflectivity (DOS), spectral-resolved normal incidence reflectance spectroscopy (MRS), or pyrometric interferometry (PI), are successfully applied to various deposition processes and provide information on both the growth rate and the composition of the deposits. However, small changes in the reflectance (because of chemical interactions at the surface of the films with the reactants supplied from the vapor phase) are of the order of 10−3 to 10−4 and are hardly observable with normal-incidence reflectance techniques because of the high reflectivity of substrate/film interface, which is typically of the order of 40%–60% for many semiconductors.In order to increase the sensitivity to surface- and interface-related growth properties, alternative optical-observation methods such as reflectance difference spectroscopy (RDS), surface photoabsorption (SPA), and spectral ellipsometry (SE) have been developed.


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