scholarly journals Long wavy copper stretchable interconnects fabricated by continuous microcorrugation process for wearable applications

2020 ◽  
Vol 2 (3) ◽  
Author(s):  
Michitaka Yamamoto ◽  
Ryu Karasawa ◽  
Shinji Okuda ◽  
Seiichi Takamatsu ◽  
Toshihiro Itoh
Keyword(s):  
Stretchable Interconnects

Assessing the Reliability of Highly Stretchable Interconnects for Flexible Hybrid Electronics

2019 ◽  
Author(s):  
Rajesh Sharma Sivasubramony ◽  
Ashwin Varkey Zachariah ◽  
Mohammed Alhendi ◽  
Manu Yadav ◽  
Peter Borgesen ◽  
...  
Keyword(s):  
Highly Stretchable ◽  
Stretchable Interconnects

Electromechanical modeling of stretchable interconnects

2017 ◽  
Vol 16 (1) ◽  
pp. 202-209 ◽  
Author(s):  
Ziming Dong ◽  
Baoxing Duan ◽  
Zhen Cao ◽  
Yintang Yang
Keyword(s):  
Electromechanical Modeling ◽  
Stretchable Interconnects

Novel Strain Relief Design for Multilayer Thin Film Stretchable Interconnects

2013 ◽  
Vol 60 (7) ◽  
pp. 2338-2345 ◽  
Author(s):  
Yung-Yu Hsu ◽  
Kylie Lucas ◽  
Dan Davis ◽  
Brian Elolampi ◽  
Roozbeh Ghaffari ◽  
...  
Keyword(s):  
Thin Film ◽  
Multilayer Thin Film ◽  
Strain Relief ◽  
Stretchable Interconnects

Conductive films based on sandwich structures of carbon nanotubes/silver nanowires for stretchable interconnects

2019 ◽  
Vol 30 (23) ◽  
pp. 235201 ◽  
Author(s):  
Li-Cheng Jheng ◽  
Chi-Hui Hsiao ◽  
Wen-Ching Ko ◽  
Steve Lien-Chung Hsu ◽  
Yu-Lun Huang
Keyword(s):  
Carbon Nanotubes ◽  
Sandwich Structures ◽  
Silver Nanowires ◽  
Conductive Films ◽  
Stretchable Interconnects

Highly Stretchable Interconnects for Flexible Electronics Applications

2015 ◽  
Author(s):  
Yeasir Arafat ◽  
Rahul Panat ◽  
Indranath Dutta
Keyword(s):  
Flexible Electronics ◽  
Large Strain ◽  
Repeated Loading ◽  
Manufacturing Method ◽  
New Class ◽  
Commercial Viability ◽  
Highly Stretchable ◽  
Cost Competitiveness ◽  
Stretchable Interconnects ◽  
The Cost

Interconnects that can deform under monotonous and/or repeated loading are increasingly important to a new class of electronic devices used for wearable applications. Such interconnects integrate different material sets such as polymers and metallic conductors and are subjected to large strain levels. A typical method to overcome the material incompatibility involves the conductor in the form of a serpentine or an out-of-the plane buckled geometry. In this paper, we demonstrate a novel combination of interconnect materials that enables significant improvement in the interconnect stretchability using Indium over the state-of-the-art without affecting the system performance. This was achieved without the necessity of the serpentine interconnects geometry that significantly improves the routing density. The manufacturing method used for this approach is also described. Finally, we discuss the cost competitiveness of the materials and the manufacturing method to assess the commercial viability of this approach. (5nm)

Spontaneous Buckling of Multiaxially Flexible and Stretchable Interconnects Using PDMS/Fibrous Composite Substrates

2016 ◽  
Vol 4 (3) ◽  
pp. 1600946 ◽  
Author(s):  
Régis Rogel ◽  
Brice Le Borgne ◽  
Tayeb Mohammed-Brahim ◽  
Emmanuel Jacques ◽  
Maxime Harnois
Keyword(s):  
Fibrous Composite ◽  
Stretchable Interconnects ◽  
Composite Substrates

Mechanics of Buckled Kirigami Membranes for Stretchable Interconnects in Island-Bridge Structures

2020 ◽  
Vol 87 (5) ◽  
Author(s):  
Ruitao Tang ◽  
Haoran Fu
Keyword(s):  
Scaling Laws ◽  
High Surface ◽  
Design Guidelines ◽  
Stretchable Electronics ◽  
Postbuckling Behavior ◽  
Critical Height ◽  
Element Analysis ◽  
Bridge Structures ◽  
Stretchable Interconnects ◽  
Novel Design

Abstract Island-bridge structures incorporated with kirigami membranes emerge as a novel design strategy for flexible/stretchable electronics, taking advantages of large stretchability, high-surface filling ratio and low resistance. However, it is hard to determine the mechanical properties of this design due to its complex geometries and nonlinear deformation configuration, thereby limiting its further applications. In this paper, we present a model for the postbuckling behavior of kirigami membranes through a combination of theoretical modeling, finite element analysis, and experiments. Scaling laws for elastic stretchability are developed, showing good agreement with numerical results and experimental images. Investigations on the critical height of post array are conducted to ensure the boundary condition of the kirigami membranes in the analytical model. These results can serve as design guidelines for kirigami structures and facilitate their applications in flexible/stretchable electronics.

A hierarchical computational model for stretchable interconnects with fractal-inspired designs

2014 ◽  
Vol 72 ◽  
pp. 115-130 ◽  
Author(s):  
Yihui Zhang ◽  
Haoran Fu ◽  
Sheng Xu ◽  
Jonathan A. Fan ◽  
Keh-Chih Hwang ◽  
...  
Keyword(s):  
Computational Model ◽  
Stretchable Interconnects

Design of aluminum/polyimide stretchable interconnects investigated through in-situ testing

2015 ◽  
Author(s):  
Emanuele Cattarinuzzi ◽  
Riccardo Lucchini ◽  
Dario Gastaldi ◽  
Pasquale Vena ◽  
Andrea Adami ◽  
...  
Keyword(s):  
In Situ Testing ◽  
Stretchable Interconnects
Sign in / Sign up

Export Citation Format

Share Document