scholarly journals Utility of a Next Generation Framework for Assessment of Genomic Damage: A Case Study Using the Pharmaceutical Drug Candidate Etoposide

2021 ◽  
Author(s):  
John Nicolette ◽  
Mirjam Luijten ◽  
Jennifer C. Sasaki ◽  
Laura Custer ◽  
Michelle Embry ◽  
...  
Keyword(s):  
Drug Candidate ◽  
Next Generation ◽  
Pharmaceutical Drug ◽  
Genomic Damage

scholarly journals Utility of a next generation framework for assessment of genomic damage: A case study using the industrial chemical benzene

2019 ◽  
Vol 61 (1) ◽  
pp. 94-113 ◽  
Author(s):  
Mirjam Luijten ◽  
Nicholas S. Ball ◽  
Kerry L. Dearfield ◽  
B. Bhaskar Gollapudi ◽  
George E. Johnson ◽  
...  
Keyword(s):  
Next Generation ◽  
Industrial Chemical ◽  
Genomic Damage

The Next Generation of Service Agreements for Publicly Owned Waste-to-Energy Facilities: Pinellas County Case Study

2007 ◽  
Author(s):  
Paul J. Stoller ◽  
Anthony LoRe ◽  
William Crellin ◽  
Robert Hauser
Keyword(s):  
First Generation ◽  
Lessons Learned ◽  
Waste To Energy ◽  
Next Generation ◽  
Procurement Process ◽  
Pinellas County ◽  
The Past ◽  
Operation And Maintenance ◽  
Service Agreement

This paper discusses one of the key lessons learned from administering the first generation of service agreements for public owners of waste-to-energy (WTE) facilities over the past 22 years and how those experiences were incorporated into a new service agreement for the operation and maintenance of Pinellas County’s 24 year old, 3,000 tpd WTE Facility to better protect the county’s interests. Additionally, a major issue raised by the operating companies during the competitive procurement process for continue operation of the facility is discussed and how that concern was addressed in the new service agreement is also presented. Capitalized words or terms used in this paper are defined within the new service agreement.

scholarly journals Next-generation lineage discovery: A case study of tuberous Claytonia L.

2018 ◽  
Vol 105 (3) ◽  
pp. 536-548 ◽  
Author(s):  
Thomas R. Stoughton ◽  
Ricardo Kriebel ◽  
Diana D. Jolles ◽  
Robin L. O'Quinn
Keyword(s):  
Next Generation

scholarly journals Toward a next generation particle precipitation model: Mesoscale prediction through machine learning (a case study and framework for progress)

Space Weather ◽  
2021 ◽  
Author(s):  
Ryan M. McGranaghan ◽  
Jack Ziegler ◽  
Téo Bloch ◽  
Spencer Hatch ◽  
Enrico Camporeale ◽  
...  
Keyword(s):  
Machine Learning ◽  
Next Generation ◽  
Particle Precipitation ◽  
Precipitation Model

Complex optical elements for scanning helium microscopy through 3D printing

2021 ◽  
Author(s):  
Matthew Bergin ◽  
Thomas Myles ◽  
Aleksandar Radić ◽  
Christopher Hatchwell ◽  
Sam Lambrick ◽  
...  
Keyword(s):  
3D Printing ◽  
Multiple Scattering ◽  
Low Cost ◽  
Optical Element ◽  
Next Generation ◽  
Background Signal ◽  
Optical Elements ◽  
Cost Components

Abstract Developing the next generation of scanning helium microscopes requires the fabrication of optical elements with complex internal geometries. We show that resin stereolithography (SLA) 3D printing produces low-cost components with the requisite convoluted structures whilst achieving the required vacuum properties, even without in situ baking. As a case study, a redesigned pinhole plate optical element of an existing scanning helium microscope was fabricated using SLA 3D printing. In comparison to the original machined component, the new optical element minimised the key sources of background signal, in particular multiple scattering and the secondary effusive beam.

Z-axis Interconnections for Next Generation Packaging

2011 ◽  
Vol 2011 (1) ◽  
pp. 000469-000475
Author(s):  
Rabindra N. Das ◽  
Frank D. Egitto ◽  
John M. Lauffer ◽  
Tim Antesberger ◽  
Voya R. Markovich
Keyword(s):  
Flip Chip ◽  
Electrical Performance ◽  
Next Generation ◽  
Low Loss ◽  
Electrically Conducting ◽  
S Parameter ◽  
Plastic Ball ◽  
Materials Used ◽  
Electrically Conducting Adhesives

In this paper, the use of electrically conducting adhesives (ECA) to form z-axis interconnections for next generation packaging is discussed. In particular, current efforts related to Z-axis interconnections for device level fabrication, integration, and electrical performance are highlighted. A few optimized ECAs were used for hole fill applications to fabricate Z-axis interconnections in laminates. Conductive joints were formed during composite lamination using the ECA. Around 5,000 to 200,000 through holes in the joining cores, formed by laser or mechanical drilling, and having diameters ranging from 50 μm to 750 μm, were filled with an optimized conducting adhesive. The adhesive-filled joining cores/layers were laminated with circuitized subcomposites to produce a composite structure. As a case study, a variety of z-axis interconnect constructions for a flip-chip plastic ball grid array package, rigid-flex, rigid-rigid, package-interposer-package (PIP), RF structures, and PWBs were fabricated and evaluated at both the subcomposite and composite levels to understand structural and electrical integrity. Electrically, S-parameter measurements showed very low loss at multi-gigahertz frequencies. The losses were low enough to support typical SERDES up to 15 Gbps over 750 mm. The present process allows fabrication of z-interconnect conductive joints having diameters in the range of 55 to 500 μm. The processes and materials used to achieve smaller feature dimensions, satisfy stringent registration requirements, and achieve robust electrical interconnections are discussed.

Sign in / Sign up

Export Citation Format

Share Document