scholarly journals Spin‐thermoelectric voltage in longitudinal SSE elements incorporating LPE YIG films and polycrystalline YIG slabs with an ultrathin Pt layer

2019 ◽  
Author(s):  
Masaaki Imamura ◽  
Hironori Asada ◽  
Daisuke Tashima ◽  
Jiro Kitagawa
Keyword(s):  
Thermoelectric Voltage

Thermoelectric voltage measurements of atomic and molecular wires using microheater-embedded mechanically-controllable break junctions

Nanoscale ◽  
2014 ◽  
Vol 6 (14) ◽  
pp. 8235-8241 ◽  
Author(s):  
Takanori Morikawa ◽  
Akihide Arima ◽  
Makusu Tsutsui ◽  
Masateru Taniguchi
Keyword(s):  
Molecular Wires ◽  
Break Junctions ◽  
Thermoelectric Voltage

scholarly journals Thickness dependence of transverse thermoelectric voltage in Co40Fe60/YIG magnetic junctions

2019 ◽  
Vol 471 ◽  
pp. 439-443
Author(s):  
P. Wongjom ◽  
R. Ramos ◽  
S. Pinitsoontorn ◽  
K. Uchida ◽  
E. Saitoh
Keyword(s):  
Thickness Dependence ◽  
Thermoelectric Voltage

Waste Heat Recovery for Powering Mobile Devices Using Thermoelectric Generators and Evaporatively-Cooled Heat Sink

2018 ◽  
Author(s):  
Michael Ozeh ◽  
A. G. Agwu Nnanna
Keyword(s):  
Heat Pipe ◽  
Mobile Devices ◽  
Heat Recovery ◽  
Waste Heat Recovery ◽  
Waste Heat ◽  
Heat Pipes ◽  
Loop Heat Pipe ◽  
Thermoelectric Voltage ◽  
Voltage Generation ◽  
Alternate Source

Powering small electronics like mobile devices off-grid has remained a challenge; hence, there exists a need for an alternate source of powering these devices. This paper examines the efficacy of a novel nanoparticle-immobilized polyethylene wick in maintaining sufficient thermal gradient across a thermoelectric generator to power these devices with energy from waste heat. The work examines several other heat exchangers including heat pipes and loop heat pipe setups. The experimental evidence reveals that the nanoparticle-immobilized polyethylene wick is capable of generating sufficient thermal potential resulting in 5V, which is the minimum voltage required to power small mobile devices. In the opinion of the authors, this is the first ever recorded account of utilizing waste heat to generate enough voltage to power a mobile device. Experiment demonstrated that the nanoparticle-immobilized polyethylene wick showed over 40% thermoelectric voltage generation increment over a plain polyethylene wick and a metal wick in a loop heat pipe setup.

Hc2 enhancement and giant Nernst effect in (TMTSF)2(PF)6

2002 ◽  
Vol 12 (9) ◽  
pp. 189-195
Author(s):  
I. J. Lee ◽  
W. Wu ◽  
M. J. Naughton ◽  
P. M. Chaikin
Keyword(s):  
Lorentz Force ◽  
Critical Field ◽  
Applied Field ◽  
Critical Pressure ◽  
Transport Theory ◽  
Magic Angle ◽  
Giant Resonances ◽  
Thermoelectric Voltage ◽  
Voltage Resonance ◽  
Near Degeneracy

We discuss two recent discoveries in the title compound: 1) A strong enhancement in the critical field as the critical pressure for the SDW-superconductor phase boundary is approached and 2) the existence of giant resonances in the thermoelectric voltage as an applied magnetic field is rotated through the “Lebed Magic Angles". 1) Hc2 is highly anisotropic in this salt, but the enhancement is present for all field orientations. We suggest a model in which the near degeneracy of the superconducting and SDW states leads to a coexistence. The critical field is enhanced by the formation of thin slabs of superconductor (less than the penetration depth) parallel to the applied field and sandwiched by insulating SDW layers. As the temperature is lowered the slabs become thinner allowing a higher Hc2. 2) The thermoelectric voltage resonance indicates that the currents generated are “locked-in" to the interchain direction (“magic angle") nearest parallel with the applied field. With the field to one side of the magic angle there is a Lorentz force up, on the other side of the magic angle the Lorentz force is down. The size of the thermoelectric voltage is 104 larger than might be expected from conventional transport theory.

Method of Measuring Anisotropy Seeback Coefficient of Thin Film Based on Laser Induced Thermoelectric Voltage Effect

2009 ◽  
Vol 36 (5) ◽  
pp. 1214-1217 ◽  
Author(s):  
胡俊涛 Hu Juntao ◽  
李洪山 Li Hongshan ◽  
朱杰 ZuJie ◽  
张国勇 Zhang Guoyong ◽  
张鹏翔 Zhang Pengxiang
Keyword(s):  
Thin Film ◽  
Thermoelectric Voltage

Preparation of PZT Thin Films and Research of Laser-Induced Thermoelectric Voltage

2010 ◽  
Vol 37 (12) ◽  
pp. 3127-3132
Author(s):  
尚杰 Shang Jie ◽  
张辉 Zhang Hui ◽  
曹明刚 Cao Minggang ◽  
张鹏翔 Zhang Pengxiang
Keyword(s):  
Thin Films ◽  
Pzt Thin Films ◽  
Thermoelectric Voltage

Experimental Analysis of Thermal and Electric Transport Characteristics of Nano-Gaps

2011 ◽  
Author(s):  
Kohei Ito ◽  
Tomoaki Hagio ◽  
Akira Matsuo ◽  
Yasushi Iwaisako ◽  
Osamu Nakabeppu
Keyword(s):  
Heat Flow ◽  
Low Temperature ◽  
High Performance ◽  
Theoretical Study ◽  
Tunneling Current ◽  
Conductive Heat ◽  
Electric Transport ◽  
Probe Diameter ◽  
Thermoelectric Voltage ◽  
Conductive Heat Flow

We conducted an experiment to demonstrate the thermoelectric nano-gap, which is recently expected to own high performance, in principle, because it does not have conductive heat flow between the high and low temperature region. In this study, the thermoelectric nano-gap is realized with a pair of probe and substrate where they are finely positioned. A temperature difference of ca. 10 K is imposed to the nano-gap under vacuum circumstances. A representative thermoelectric voltage, tunneling-current and gap were 250 μV, 0.3 nA and 50 nm. The obtained voltage and current, with assuming an effective probe-diameter of 10 nm, roughly agreed to a theoretical study (G. Despesse and T. Jager, J. Appl. Phys., Vol.96, p.5026-, 2004). However, the obtained gap was 25 times larger than that from the theoretical study.

Micro-Scale Thermal Sensor Manufacturing for Semiconductor Furnace Chamber

2012 ◽  
Author(s):  
Hongcheon Yang ◽  
Jun Young Kim ◽  
Kwang-Sun Kim
Keyword(s):  
Semiconductor Device ◽  
Furnace Chamber ◽  
Small Scale ◽  
Thermal Sensor ◽  
Micro Scale ◽  
Thermoelectric Voltage ◽  
Scale Temperature ◽  
Pattern Size ◽  
Different Temperatures ◽  
Analog Voltage

As the demand of complex and small scale semiconductor devices has been increased, the measurement technologies were developed to meet the accurate requirement in semiconductor manufacturing process. The uniform temperature requirement on the wafer is the major factor related to the semiconductor device yield. It is normally acquired from the thermocouples following the inner wall of the chamber. However, since the temperature difference between the wall of equipment and the surface of wafer is existed, the actual wafer temperature is commonly measured by a thermocouple wafer to calibrate the temperature measurement accuracy of the equipment. However, as the diameter of the commercial thermocouple wires is larger than the recently demanded pattern size, the TC wafer has not been able to measure the micro scale temperature differences on the micro patterned wafer. We, therefore, designed a micro-scale thermal sensor. The developed sensor has 37 sets of the measurement points on a 4-inch silicon wafer. The size of the measurement point is approximate to 16 um2. Two alloys, chromel and alumel which are as same as the materials of the K-type thermocouple are used to generate the thermoelectric voltage. The sensor has the temperature range of −200°C to 1300°C. The commercial K-type thermocouple extension wires are connected to the pads of the sensor array and they transfer the analog voltage data to a data acquisition device (DAQ). The sensor was calibrated by comparing the EMF voltage at different temperatures to the standard thermocouple EMF voltage. With the developed micro-scale thermal sensor system, the temperature distribution of the wafer in the furnace chamber is obtained.

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