Experiments on relationship between metallic phase and gaseous phase arc and contact resistance in ag contacts with opening arc

1995 ◽  
Vol 78 (3) ◽  
pp. 106-112 ◽  
Author(s):  
Hitoshi Sugimoto ◽  
Tasuku Takagi ◽  
Hideaki Sone
Keyword(s):  
Contact Resistance ◽  
Gaseous Phase ◽  
Metallic Phase

Influence of Contact Materials on Phenomena in a Short Electrical Arc

2012 ◽  
Vol 510-511 ◽  
pp. 321-329 ◽  
Author(s):  
S.N. Kharin ◽  
M. Sarsengeldin
Keyword(s):  
Mathematical Model ◽  
Gaseous Phase ◽  
Thermionic Emission ◽  
Metallic Phase ◽  
Arc Length ◽  
Material Transfer ◽  
Contact Materials ◽  
Contact Erosion ◽  
Flux Evaporation ◽  
Gas Ionization

Investigation of transition phenomena accompanying the evolution of metallic phase of electric arc into gaseous phase is very important for the further progress in such fields as plasma technologies, electrical apparatus, plasmatrons and other technical applications. Some aspects of this transition are considered in presented paper on the base of mathematical model described dynamics of phenomena in the arc column, near-electrode zones, anode and cathode solids. Cathode and anode phenomena such as ion bombardment, thermionic emission, inverse electron flux, evaporation, radiation, heat conduction etc. are considered in dependence on time, current, opening velocity, parameters of the gas and contact materials. The conditions of the arc transition from one phase to another are formulated in terms of above characteristics and increasing of gas ionization level. Special experiments with two contacts materials, and have been carried to verify the mathematical model. The results of calculation and experimental data enables us to conclude that in metallic arc phase (short arc length), which is characterized by material transfer from the anode to the cathode, the erosion of contacts is considerably small than erosion of contacts both for resistive and inductive circuits, while in gaseous arc phase (long arc length) with opposite material transfer the rate of erosion depends on the inductance. If the inductance, then contacts have smaller erosion in comparison with contacts, however for inductive circuits situation is quite different, thus use of contacts in the case of long arcs burning in gaseous phase is more preferable. It was found also that the addition of niobium diselenide (1%) and tantalum (5%) into silver contact material which are sublimating into arc plasma enables to change ionization potential, that leads to decreasing of the arc temperature, arc duration and contact erosion.

Dynamic studies of silicide-mediated crystallization of amorphous silicon

1992 ◽  
Vol 50 (2) ◽  
pp. 1352-1353
Author(s):  
C. Hayzelden ◽  
J. L. Batstone
Keyword(s):  
Ion Implantation ◽  
Solid Phase ◽  
Metallic Phase ◽  
Single Crystal Substrate ◽  
Free Electrons ◽  
Melt Temperature ◽  
Transmission Electron ◽  
Crystal Substrate ◽  
High Resolution Tem

Epitaxial reordering of amorphous Si(a-Si) on an underlying single-crystal substrate occurs well below the melt temperature by the process of solid phase epitaxial growth (SPEG). Growth of crystalline Si(c-Si) is known to be enhanced by the presence of small amounts of a metallic phase, presumably due to an interaction of the free electrons of the metal with the covalent Si bonds near the growing interface. Ion implantation of Ni was shown to lower the crystallization temperature of an a-Si thin film by approximately 200°C. Using in situ transmission electron microscopy (TEM), precipitates of NiSi2 formed within the a-Si film during annealing, were observed to migrate, leaving a trail of epitaxial c-Si. High resolution TEM revealed an epitaxial NiSi2/Si(l11) interface which was Type A. We discuss here the enhanced nucleation of c-Si and subsequent silicide-mediated SPEG of Ni-implanted a-Si.Thin films of a-Si, 950 Å thick, were deposited onto Si(100) wafers capped with 1000Å of a-SiO2. Ion implantation produced sharply peaked Ni concentrations of 4×l020 and 2×l021 ions cm−3, in the center of the films.

Microstructural Characterization of Au-Ge-Ni based ohmic contacts to GaAs/AlGaAs modfet device

1987 ◽  
Vol 45 ◽  
pp. 326-327
Author(s):  
A.K. Rai ◽  
A.K. Petford-Long ◽  
A. Ezis ◽  
D.W. Langer
Keyword(s):  
Contact Resistance ◽  
Ohmic Contact ◽  
Ohmic Contacts ◽  
Microstructural Characterization ◽  
Almost Everywhere ◽  
Spacer Layer ◽  
Good Contact ◽  
The Relationship ◽  
Lower Contact

Considerable amount of work has been done in studying the relationship between the contact resistance and the microstructure of the Au-Ge-Ni based ohmic contacts to n-GaAs. It has been found that the lower contact resistivity is due to the presence of Ge rich and Au free regions (good contact area) in contact with GaAs. Thus in order to obtain an ohmic contact with lower contact resistance one should obtain a uniformly alloyed region of good contact areas almost everywhere. This can possibly be accomplished by utilizing various alloying schemes. In this work microstructural characterization, employing TEM techniques, of the sequentially deposited Au-Ge-Ni based ohmic contact to the MODFET device is presented.The substrate used in the present work consists of 1 μm thick buffer layer of GaAs grown on a semi-insulating GaAs substrate followed by a 25 Å spacer layer of undoped AlGaAs.

Metallic phase stabilization and phase diagram of (ET)3(HSO4)2

1991 ◽  
Vol 1 (10) ◽  
pp. 1365-1370 ◽  
Author(s):  
N. D. Kush ◽  
V. N. Laukhin ◽  
A. I. Schegolev ◽  
E. B. Yagubskii ◽  
E. Yu. Alikberova ◽  
...  
Keyword(s):  
Phase Diagram ◽  
Metallic Phase ◽  
Phase Stabilization

DEGREE OF VALENCE MIXING IN THE METALLIC PHASE OF SmS AND IN TmSe

1976 ◽  
Vol 37 (C4) ◽  
pp. C4-267-C4-270 ◽  
Author(s):  
B. BATLOGG ◽  
A. SCHLEGEL ◽  
P. WACHTER
Keyword(s):  
Metallic Phase ◽  
Valence Mixing

TEM Studies and Contact Resistance of Au/Ni/Ti/Ta/n-GaN Ohmic Contacts

2003 ◽  
Vol 764 ◽  
Author(s):  
D.N. Zakharov ◽  
Z. Liliental-Weber ◽  
A. Motayed ◽  
S.N. Mohammad
Keyword(s):  
Contact Resistance ◽  
Ohmic Contacts ◽  
High Resolution Electron Microscopy ◽  
X Ray ◽  
Electron Energy Loss Spectrometry ◽  
Resolution Electron ◽  
Order Of Magnitude ◽  
Contact Surfaces ◽  
Electron Energy Loss ◽  
Magnitude Difference

AbstractOhmic Ta/Ti/Ni/Au contacts to n-GaN have been studied using high resolution electron microscopy (HREM), energy dispersive X-ray spectrometry (EDX) and electron energy loss spectrometry (EELS). Two different samples were used: A - annealed at 7500C withcontact resistance 5×10-6 Ω cm2 and B-annealed at 7750C with contact resistance 6×10-5 Ω cm2. Both samples revealed extensive in- and out-diffusion between deposited layers with some consumption ofGaNlayerand formation of TixTa1-xN50 (0<x<25) at the GaN interface. Almost an order of magnitude difference in contact resistances can be attributed to structure and chemical bonding of Ti-O layers formed on the contact surfaces.

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