Noise estimation system for board-level electrical circuit–calculation of capacitance coefficient of multiconductor system by calcap

1985 ◽  
Vol 68 (5) ◽  
pp. 75-84
Author(s):  
Haruo Takagi ◽  
Noboru Schibuya ◽  
Kenichi Ito
Keyword(s):  
Electrical Circuit ◽  
Noise Estimation ◽  
Estimation System ◽  
Board Level ◽  
Capacitance Coefficient

Noise estimation system for use in speech analysis

1984 ◽  
Vol 76 (5) ◽  
pp. 1602-1602
Author(s):  
Arthur L. Wilkes ◽  
Fred B. Wade ◽  
Robert L. Thompson
Keyword(s):  
Noise Estimation ◽  
Speech Analysis ◽  
Estimation System

Energy Detection Based Estimation of Channel Occupancy Rate with Adaptive Noise Estimation

2012 ◽  
Vol E95-B (4) ◽  
pp. 1076-1084 ◽  
Author(s):  
Janne J. LEHTOMÄKI ◽  
Risto VUOHTONIEMI ◽  
Kenta UMEBAYASHI ◽  
Juha-Pekka MÄKELÄ
Keyword(s):  
Energy Detection ◽  
Noise Estimation ◽  
Occupancy Rate ◽  
Adaptive Noise ◽  
Channel Occupancy

Mathematical views of the fractional Chua's electrical circuit described by the Caputo-Liouville derivative

2021 ◽  
Vol 67 (1 Jan-Feb) ◽  
pp. 91
Author(s):  
N. Sene
Keyword(s):  
Caputo Derivative ◽  
Local Stability ◽  
Numerical Scheme ◽  
Equilibrium Points ◽  
Electrical Circuit ◽  
Maximal Lyapunov Exponent ◽  
Electrical Circuits ◽  
Adaptive Controls ◽  
Liouville Derivative

This paper revisits Chua's electrical circuit in the context of the Caputo derivative. We introduce the Caputo derivative into the modeling of the electrical circuit. The solutions of the new model are proposed using numerical discretizations. The discretizations use the numerical scheme of the Riemann-Liouville integral. We have determined the equilibrium points and study their local stability. The existence of the chaotic behaviors with the used fractional-order has been characterized by the determination of the maximal Lyapunov exponent value. The variations of the parameters of the model into the Chua's electrical circuit have been quantified using the bifurcation concept. We also propose adaptive controls under which the master and the slave fractional Chua's electrical circuits go in the same way. The graphical representations have supported all the main results of the paper.

Failure Localization in a Multistage S-Band Power Amplifier

2016 ◽  
Author(s):  
Clarence Rebello ◽  
Ted Kolasa ◽  
Parag Modi
Keyword(s):  
Output Power ◽  
Power Amplifier ◽  
Fault Tree ◽  
Root Cause ◽  
Failure Investigation ◽  
Band Power ◽  
Cause Of Failure ◽  
Design Materials ◽  
Board Level ◽  
Failure Localization

Abstract During the search for the root cause of a board level failure, all aspects of the product must be revisited and investigated. These aspects encompass design, materials, and workmanship. In this discussion, the failure investigation involved an S-Band Power Amplifier assembly exhibiting abnormally low RF output power where initial troubleshooting did not provide a clear cause of failure. A detailed fault tree drove investigations that narrowed the focus to a few possible root causes. However, as the investigation progressed, multiple contributors were eventually discovered, some that were not initially considered.

In-Situ Mechanical Sample Preparation of Selected Sites and Components on Large Modules and Boards

2016 ◽  
Author(s):  
Jim Colvin ◽  
Timothy Hazeldine ◽  
Heenal Patel
Keyword(s):  
Sample Preparation ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Tilt Table ◽  
Standard Requirement ◽  
Open Design ◽  
Bga Packages ◽  
Silicon Thickness ◽  
Board Level

Abstract The standard requirement for FA Engineers needing to remove components from a board, prior to decapsulation or sample preparation, is shown to be greatly reduced, by the methods discussed here. By using a mechanical selected area preparation system with an open-design it is possible to reach all required areas of a large printed circuit board (PCB) or module to prepare a single component ‘in situ’. This makes subsequent optical or electrical testing faster and often more convenient to accomplish. Electronic End-pointing and 3D curvature compensation methods can often be used in parallel with sample prep techniques to further improve the consistency and efficacy of the decapsulation and thinning uniformity and final remaining silicon thickness (RST). Board level prep eliminates the worry of rework removal of BGA packages and the subsequent risk of damage to the device. Since the entire board is mounted, the contamination is restricted to the die surface and can be kept from the underside ball connections unlike current liquid immersion methods of package thinning or delayering. Since the camera is in line with the abrasion interface, imaging is real time during the entire milling and thinning process. Recent advances in automated tilt-table design have meant that a specific component’s angular orientation can be optimized for sample preparation. Improved tilt table technology also allows for improved mounting capability for boards of many types and sizes. The paper describes methods for decapsulation, thinning and backside polishing of a part ‘in situ’ on the polishing machine and allows the system to operate as a probe station for monitoring electrical characteristics while thinning. Considerations for designing board-level workholders are described – for boards that that are populated with components on one or even both sides. Using the techniques described, the quality of sample preparation and control is on a par with the processing of single package-level devices.

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