Role of Thin Sn Layer for Low Temperature Al-Al Thermo-compression Bonding of Wafer-Level Hermetic Sealing

2018 ◽  
Vol 101 (5) ◽  
pp. 33-40
Author(s):  
SHIRO SATOH ◽  
HIDEYUKI FUKUSHI ◽  
MASAYOSHI ESASHI ◽  
SHUJI TANAKA
Keyword(s):  
Low Temperature ◽  
Wafer Level ◽  
Hermetic Sealing

Role of Thin Sn Layer for Low Temperature Al-Al Thermo-compression Bonding of Wafer-level Hermetic Sealing

2017 ◽  
Vol 137 (12) ◽  
pp. 432-437 ◽  
Author(s):  
Shiro Satoh ◽  
Hideyuki Fukushi ◽  
Masayoshi Esashi ◽  
Shuji Tanaka
Keyword(s):  
Low Temperature ◽  
Wafer Level ◽  
Hermetic Sealing

Low Temperature Al-Al Thermo-compression Bonding with Sn Oxidation Protect Layer for Wafer-level Hermetic Sealing

2016 ◽  
Vol 136 (6) ◽  
pp. 237-243 ◽  
Author(s):  
Shiro Satoh ◽  
Hideyuki Fukushi ◽  
Masayoshi Esashi ◽  
Shuji Tanaka
Keyword(s):  
Low Temperature ◽  
Wafer Level ◽  
Hermetic Sealing

scholarly journals Low-Temperature Al-Al Thermocompression Bonding with Sn Oxidation Protect Layer for Wafer-Level Hermetic Sealing

2017 ◽  
Vol 100 (8) ◽  
pp. 43-50
Author(s):  
SHIRO SATOH ◽  
HIDEYUKI FUKUSHI ◽  
MASAYOSHI ESASHI ◽  
SHUJI TANAKA
Keyword(s):  
Low Temperature ◽  
Wafer Level ◽  
Hermetic Sealing ◽  
Thermocompression Bonding

Reliability of Hermetic RF MEMS Wafer Level Packaging Using Au-Sn Eutectic Bonding

2006 ◽  
Vol 326-328 ◽  
pp. 609-612
Author(s):  
Qian Wang ◽  
Sung Hoon Choa ◽  
Woon Bae Kim ◽  
Jun Sik Hwang ◽  
Suk Jin Ham ◽  
...  
Keyword(s):  
Shear Strength ◽  
Low Temperature ◽  
Insertion Loss ◽  
Rf Mems ◽  
Wafer Level ◽  
Eutectic Bonding ◽  
Wafer Level Packaging ◽  
Hermetic Sealing ◽  
Multilayer Metallization

In this paper, a low temperature hermetic wafer level packaging scheme for the RFMEMS devices is presented. For hermetic sealing, Au-Sn multilayer metallization with a square loop of 70 %m in width is performed. The size of the MEMS package is 1mm × 1mm × 700 %m. The shear strength and hermeticity of the package satisfy the requirements of MIL-STD-883F. The total insertion loss for the packaging is 0.075 dB at 2 GHz.

Hermetic Seal Bonding at Low-temperature with Sub-micron Gold Particles for Wafer Level Packaging

2015 ◽  
Vol 2015 (1) ◽  
pp. 000073-000078 ◽  
Author(s):  
Toshinori Ogashiwa ◽  
Kentaro Totsu ◽  
Mitsutomo Nishizawa ◽  
Hiroyuki Ishida ◽  
Yuya Sasaki ◽  
...  
Keyword(s):  
Low Temperature ◽  
Leak Rate ◽  
Surface Irregularity ◽  
Wafer Level ◽  
Gold Particles ◽  
Wafer Level Packaging ◽  
Hermetic Sealing ◽  
Hermetic Seal ◽  
Micron Size ◽  
Surface Flatness

Au/Au hermetic sealing was successfully done using a rim structure covered with sub-micron-size Au particles by low-temperature thermo-compression bonding. The easy deformability of sintered Au particles is advantageous in terms of the compliance with surface irregularity as well as the insensitivity of surface flatness. From the deflection of Si diaphragms over the sealed cavity, an inside pressure of 100 Pa and the maximum leak rate in a range of 10−14 Pa·m3/s (He) were estimated, which is sufficient for many MEMS applications.

scholarly journals Dissecting the Roles of Cuticular Wax in Plant Resistance to Shoot Dehydration and Low-Temperature Stress in Arabidopsis

2021 ◽  
Vol 22 (4) ◽  
pp. 1554
Author(s):  
Tawhidur Rahman ◽  
Mingxuan Shao ◽  
Shankar Pahari ◽  
Prakash Venglat ◽  
Raju Soolanayakanahally ◽  
...  
Keyword(s):  
Fatty Acids ◽  
Low Temperature ◽  
Cold Acclimation ◽  
Water Loss ◽  
Cuticular Wax ◽  
Dehydration Stress ◽  
Wax Deposition ◽  
Cuticular Waxes ◽  
Gas Chromatography Mass Spectroscopy

Cuticular waxes are a mixture of hydrophobic very-long-chain fatty acids and their derivatives accumulated in the plant cuticle. Most studies define the role of cuticular wax largely based on reducing nonstomatal water loss. The present study investigated the role of cuticular wax in reducing both low-temperature and dehydration stress in plants using Arabidopsis thaliana mutants and transgenic genotypes altered in the formation of cuticular wax. cer3-6, a known Arabidopsis wax-deficient mutant (with distinct reduction in aldehydes, n-alkanes, secondary n-alcohols, and ketones compared to wild type (WT)), was most sensitive to water loss, while dewax, a known wax overproducer (greater alkanes and ketones compared to WT), was more resistant to dehydration compared to WT. Furthermore, cold-acclimated cer3-6 froze at warmer temperatures, while cold-acclimated dewax displayed freezing exotherms at colder temperatures compared to WT. Gas Chromatography-Mass Spectroscopy (GC-MS) analysis identified a characteristic decrease in the accumulation of certain waxes (e.g., alkanes, alcohols) in Arabidopsis cuticles under cold acclimation, which was additionally reduced in cer3-6. Conversely, the dewax mutant showed a greater ability to accumulate waxes under cold acclimation. Fourier Transform Infrared Spectroscopy (FTIR) also supported observations in cuticular wax deposition under cold acclimation. Our data indicate cuticular alkane waxes along with alcohols and fatty acids can facilitate avoidance of both ice formation and leaf water loss under dehydration stress and are promising genetic targets of interest.

The Role of Li2CO3and PbO in the Low-Temperature Sintering of Sr, K, Nb (SKN)-Doped PZT

2009 ◽  
Vol 92 (6) ◽  
pp. 1203-1207 ◽  
Author(s):  
Niall J. Donnelly ◽  
Thomas R. Shrout ◽  
Clive A. Randall
Keyword(s):  
Low Temperature ◽  
Low Temperature Sintering

High Precision Low Temperature Direct Wafer Bonding Technology for Wafer-Level 3D ICs Manufacturing

2016 ◽  
Vol 75 (9) ◽  
pp. 345-353 ◽  
Author(s):  
F. Kurz ◽  
T. Plach ◽  
J. Suss ◽  
T. Wagenleitner ◽  
D. Zinner ◽  
...  
Keyword(s):  
Low Temperature ◽  
High Precision ◽  
Wafer Bonding ◽  
Wafer Level ◽  
3D Ics ◽  
Direct Wafer Bonding ◽  
Bonding Technology

Spin-Lattice Coupling and Peculiarities of Magnetic Behavior of Ferrimagnetic Ludwigites Mn0.52+M1.52+Mn3+BO5(M=Cu, Ni)

2015 ◽  
Vol 233-234 ◽  
pp. 133-136 ◽  
Author(s):  
Leonard Bezmaternykh ◽  
Evgeniya Moshkina ◽  
Evgeniy Eremin ◽  
Maxim Molokeev ◽  
Nikita Volkov ◽  
...  
Keyword(s):  
Temperature Field ◽  
Low Temperature ◽  
Magnetic Anisotropy ◽  
Single Crystals ◽  
Magnetic Behavior ◽  
Temperature Hysteresis ◽  
Spin Lattice ◽  
Field Magnetization ◽  
Lattice Coupling

Temperature-field and orientational magnetization dependences of single crystals were measured. Both samples demonstrate significant field-depending temperature hysteresis and low-temperature counter field magnetization. The correlation of orientational dependences of these effects and magnetic anisotropy is analyzed; the role of spin-lattice interactions is discussed.

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