Reduction of on-resistance in ion-implanted GaN/AlGaN/GaN HEMTs with low gate leakage current

2010 ◽  
Vol 93 (6) ◽  
pp. 19-24 ◽  
Author(s):  
Kazuki Nomoto ◽  
Masataka Satoh ◽  
Tohru Nakamura
2018 ◽  
Vol 27 (9) ◽  
pp. 097309 ◽  
Author(s):  
Sheng Zhang ◽  
Ke Wei ◽  
Yang Xiao ◽  
Xiao-Hua Ma ◽  
Yi-Chuan Zhang ◽  
...  

2019 ◽  
Vol 114 (1) ◽  
pp. 013503 ◽  
Author(s):  
Sheng Zhang ◽  
Ke Wei ◽  
Xiao-Hua Ma ◽  
Bin Hou ◽  
Guo-Guo Liu ◽  
...  

2015 ◽  
Vol 36 (12) ◽  
pp. 1281-1283 ◽  
Author(s):  
Dawei Yan ◽  
Jian Ren ◽  
Guofeng Yang ◽  
Shaoqing Xiao ◽  
Xiaofeng Gu ◽  
...  

Author(s):  
Wen-Shiuan Tsai ◽  
Zhen-Wei Qin ◽  
Yue-ming Hsin

Abstract This study proposes three hybrid Schottky-ohmic gate structures for normally-off p-GaN gate AlGaN/GaN HEMTs. One has a Schottky-gate cover on the ohmic-gate and has part of the area contact to the p-GaN surface at the left and right sides of ohmic-gate (Structure A). The two others only have the Schottky-gate contact to the p-GaN surface at the left side (Structure B) or right side (Structure C) of the ohmic-gate. Different gate metal designs change the hole injection from p-GaN to GaN channel and show various gate leakages. The optimized contact length of Schottky-gate can suppress on-state gate leakage current over two orders of magnitude compared to conventional ohmic p-GaN gate HEMT. The improved on-state maximum drain current is over 60 mA/mm compared to Schottky p-GaN gate HEMT. Optimal performance in Structure B with Schottky-gate contact length ranges from 0.8 to 1.8 μm in a 2 μm gate geometry.


2020 ◽  
Vol 67 (3) ◽  
pp. 834-840 ◽  
Author(s):  
Ankur Debnath ◽  
Nandita DasGupta ◽  
Amitava DasGupta

2013 ◽  
Vol 732-733 ◽  
pp. 1255-1260
Author(s):  
Chen Chen ◽  
Gang Xie ◽  
Ceng Tang ◽  
Kuang Sheng

An investigation of gate degradation characteristics of AlGaN/GaN HEMTs under PWM stress is proposed in this paper. The device under testing features double source-connected field plates to reshape the surface electric field. A PWM signal with the operation frequency varied from 10 kHz to 1 MHz was applied to the gate electrode while the source was shorted to ground. HP 4155B was used to measure the gate characteristic of the device by every 30 minutes. The value of on-resistance shows an increase of 12.9 % after the device has been under stress for 30 minutes with the switching frequency of 10 kHz and the degradation is improved with higher switching frequency, while the threshold voltage and gate leakage current do not change significantly during the test.


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