scholarly journals Heterotrophy mitigates the response of the temperate coral Oculina arbuscula to temperature stress

2016 ◽  
Vol 6 (18) ◽  
pp. 6758-6769 ◽  
Author(s):  
Hannah E. Aichelman ◽  
Joseph E. Townsend ◽  
Travis A. Courtney ◽  
Justin H. Baumann ◽  
Sarah W. Davies ◽  
...  
Keyword(s):  
Temperature Stress ◽  
Temperate Coral ◽  
Oculina Arbuscula

Recruits of the temperate coral Oculina arbuscula mimic adults in their resilience to ocean acidification

2020 ◽  
Vol 636 ◽  
pp. 63-75 ◽  
Author(s):  
BV Varnerin ◽  
BM Hopkinson ◽  
DF Gleason
Keyword(s):  
Ocean Acidification ◽  
Soluble Protein ◽  
Linear Response ◽  
Energetic Cost ◽  
Life Stages ◽  
Respiration Rates ◽  
Algal Symbiont ◽  
Temperate Coral ◽  
Oculina Arbuscula ◽  
Current Century

Ocean acidification has been investigated extensively in scleractinian corals, but studies on different life stages of the same species are lacking. We investigated the response of recruits of the temperate coral Oculina arbuscula to increased CO2 concentrations, a species whose adults show significant tolerance to elevated concentrations of CO2. Specifically, we exposed small colonies (5-12 mm diameter) to 475, 710, and 1261 ppm CO2 for 75 d in the laboratory to address the hypothesis that, like adults, the health of O. arbuscula recruits is not affected by increased CO2 concentrations. Calcification rates were monitored regularly during the experiment, while mortality, respiration rates, photosynthetic rates, algal symbiont densities, and soluble protein were quantified at the end. As predicted, CO2 concentration did not impact survival, algal densities, or soluble protein concentrations in O. arbuscula recruits. In contrast, both calcification rates and photosynthesis:respiration ratios tended to be lower at higher CO2. Comparing the results of this study on recruits with published studies on adults suggested that both life stages exhibit a similar non-linear response to CO2 concentration, whereby recruits may be unable to counter the increased energetic cost of calcification that occurs at the highest CO2. Based on these results and environmental monitoring showing that mean pCO2 is increasing by ~2.4% yr-1 in the waters off Georgia, USA, we conclude that O. arbuscula recruits may begin to exhibit depressed calcification rates within the current century if CO2 emissions are not reduced.

The role of larval supply and competition in controlling recruitment of the temperate coral Oculina arbuscula

2018 ◽  
Vol 506 ◽  
pp. 107-114 ◽  
Author(s):  
Daniel F. Gleason ◽  
Leslie R. Harbin ◽  
Lauren M. Divine ◽  
Kenan O. Matterson
Keyword(s):  
Larval Supply ◽  
Temperate Coral ◽  
Oculina Arbuscula

Assessment of wheat (Triticum aestivum L.) genotypes for high temperature stress tolerance using physico-chemical analysis

2020 ◽  
Vol 53 (2) ◽  
Author(s):  
Khalil Ahmed Laghari ◽  
Abdul Jabbar Pirzada ◽  
Mahboob Ali Sial ◽  
Muhammad Athar Khan ◽  
Jamal Uddin Mangi
Keyword(s):  
Triticum Aestivum ◽  
High Temperature ◽  
Chemical Analysis ◽  
Stress Tolerance ◽  
Temperature Stress ◽  
Triticum Aestivum L ◽  
High Temperature Stress ◽  
Physico Chemical

Genome-wide identification and analysis of maize PAL gene family and its expression profile in response to high-temperature stress

2020 ◽  
Vol 52 (5) ◽  
Author(s):  
De-Gong Wu ◽  
Qiu-Wen Zhan ◽  
Hai-Bing Yu ◽  
Bao-Hong Huang ◽  
Xin-Xin Cheng ◽  
...  
Keyword(s):  
High Temperature ◽  
Gene Family ◽  
Temperature Stress ◽  
Expression Profile ◽  
High Temperature Stress ◽  
Genome Wide

Improved Burn-In Stress Methodology for Stress Uniformity

2018 ◽  
Author(s):  
Jungsuk Ko ◽  
Hoonchang yang ◽  
Hyungchae Jeon ◽  
Gyuyoung Nam ◽  
Youngseok Ryu ◽  
...  
Keyword(s):  
Temperature Stress ◽  
Stress Condition ◽  
Temperature Deviation ◽  
Stress Effects ◽  
Hot Temperature ◽  
Production Environments ◽  
Stress Environment ◽  
The Stability ◽  
Stress Uniformity ◽  
Stress Voltage

Abstract The necessity of hot temperature stress is widely recognized as the initial stress methodology to maintain the stability of products from infant defects in device [1, 2]. However, hot temperature stress has a disadvantage in terms of stress uniformity because temperature variation according to stress environment such as chamber, board, and tester accelerates different stress effects per chips. In addition, this stress condition can cause serious reliability problem in the mass production environments. Therefore, the stress temperature should be lowered to minimize the temperature deviation due to the production environments. The reduction of stress temperature cause the lack of stress amount, so optimized stress voltage and time to maintain the stress condition is required. In this study, various stress voltage and time with decreasing temperature were evaluated in consideration of lifetime that unit elements such transistors and capacitors did not degrade by any stress conditions. In addition, it was confirmed that stress uniformity can be improved in the stress condition obtained by the evaluation. Furthermore, the enhanced initial failure screen ability was proven with mass evaluations.

Impact of Metal Pad Etch-Induced Plasma Damage on Dynamic Retention Time Degradation during High Temperature Stress in High Density DRAM Technology

2005 ◽  
Author(s):  
D-J Kim ◽  
I-G Kim ◽  
J-Y Noh ◽  
H-J Lee ◽  
S-H Park ◽  
...  
Keyword(s):  
High Temperature ◽  
Temperature Stress ◽  
Retention Time ◽  
High Temperature Stress ◽  
High Density ◽  
Cell Junction ◽  
Antenna Effect ◽  
Plasma Damage ◽  
Root Cause ◽  
Wafer Processing

Abstract As DRAM technology extends into 12-inch diameter wafer processing, plasma-induced wafer charging is a serious problem in DRAM volume manufacture. There are currently no comprehensive reports on the potential impact of plasma damage on high density DRAM reliability. In this paper, the possible effects of floating potential at the source/drain junction of cell transistor during high-field charge injection are reported, and regarded as high-priority issues to further understand charging damage during the metal pad etching. The degradation of block edge dynamic retention time during high temperature stress, not consistent with typical reliability degradation model, is analyzed. Additionally, in order to meet the satisfactory reliability level in volume manufacture of high density DRAM technology, the paper provides the guidelines with respect to plasma damage. Unlike conventional model as gate antenna effect, the cell junction damage by the exposure of dummy BL pad to plasma, was revealed as root cause.

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