Multiphysics coupling numerical simulation of flow‐diverting stents in the treatment of patients with pulsatile tinnitus

2021 ◽  
Author(s):  
Zhenxia Mu ◽  
Li Liu ◽  
Yufeng Sun ◽  
Bin Gao ◽  
Han Lv ◽  
...  
Keyword(s):  
Numerical Simulation ◽  
Pulsatile Tinnitus ◽  
Multiphysics Coupling

Mechanism analysis of microvia filling based on multiphysics coupling

Circuit World ◽  
2018 ◽  
Vol 44 (2) ◽  
pp. 60-68
Author(s):  
Linxian Ji ◽  
Shidong Su ◽  
Hexian Nie ◽  
Shouxu Wang ◽  
Wei He ◽  
...  
Keyword(s):  
Numerical Simulation ◽  
Growth Period ◽  
Operating Conditions ◽  
Initial Growth ◽  
Copper Electrodeposition ◽  
Copper Plating ◽  
Content Type ◽  
Multiphysics Coupling ◽  
Plating Solution ◽  
Excellent Tool

Purpose Copper electrodeposition acts as a crucial step in the manufacture of high-density interconnect board. The stability of plating solution and the uniformity of copper electrodeposit are the hotspot and difficulty for the research of electrodeposition. Because a large number of factors are included in electrodeposition, experimentally determining all parameters and electrodeposition conditions becomes unmanageable. Therefore, a multiphysics coupling technology was introduced to investigate microvia filling process, and the mechanism of copper electrodeposition was analyzed. The results provide a strong theoretical basis and technical guidance for the actual electroplating experiments. The purpose of this paper is to provide an excellent tool for quickly and cheaply studying the process behavior of copper electrodeposition without actually needing to execute time-consuming and costly experiments. Design/methodology/approach The interactions among additives used in acidic copper plating solution for microvia filling and the effect on the copper deposition potential were characterized through galvanostatic measurement (GM). The adsorption behavior and surface coverage of additives with various concentrations under different rotating speeds of working electrode were investigated using cyclic voltammetry (CV) measurements. Further, a microvia filling model was constructed using multiphysics coupling technology based on the finite element method. Findings GM tests showed that accelerator, inhibitor and leveler affected the potential of copper electrodeposition, and bis(3-sulfopropyl) disulfide (SPS), ethylene oxide-propylene oxide (EO/PO) co-polymer, and self-made leveler were the effective additives in acidic copper plating solution. CV tests showed that EO/PO–Cu+-Cl− complex was adsorbed on the electrode surface by intermolecular forces, thus inhibiting copper electrodeposition. Numerical simulation indicated that the process of microvia filling included initial growth period, the outbreak period and the stable growth period, and modeling result was compared with the measured data, and a good agreement was observed. Research limitations/implications The research is still in progress with the development of high-performance computers. Practical implications A multiphysics coupling platform is an excellent tool for quickly and cheaply studying the electrodeposited process behaviors under a variety of operating conditions. Social implications The numerical simulation method has laid the foundation for mechanism of copper electrodeposition. Originality/value By using multiphysics coupling technology, the authors built a bridge between theoretical and experimental study for microvia filling. This method can help explain the mechanism of copper electrodeposition.

scholarly journals Numerical simulation of ultrasonic heat meter by multiphysics coupling finite-element simulation software

2020 ◽  
Vol 24 (5 Part B) ◽  
pp. 3309-3217
Author(s):  
Lin Li ◽  
Hongliang Zheng
Keyword(s):  
Numerical Simulation ◽  
Sound Pressure ◽  
Sound Field ◽  
Simulation Software ◽  
Ultrasonic Waves ◽  
Heat Meter ◽  
Element Simulation ◽  
Multiphysics Coupling ◽  
Ultrasonic Heat Meter ◽  
Heat Meters

Objective: To increase heat calculation accuracy, the numerical simulation of the ultrasonic heat meter is explored by multiphysics coupling. Methods: The COMSOL, a multiphysics coupling finite-element simulation software, is used to build the coupling model of the sound field, structure field, and electric field. The propagation of ultrasonic waves in heat meters is simulated, and its sound field distribution in pure water is analyzed. According to the operating conditions of ultrasonic heat meters, the influence of impurities with different concentrations on ultrasonic propagation is analyzed. The end-face sound pressure levels of the incident transducer and the receiving transducer are compared to obtain the attenuation laws of ultrasonic waves in the liquid-solid two-phase flow. Results: The main lobe and multiple side lobes exist during the propagation of ultrasonic waves. The energy of the main lobe is higher than that of the side lobes. Bubbles resonate under the action of the sound field. Also, bubbles of different diameters correspond to different resonance frequencies, which have larger sound pressure than that of the incident sound field. Most of the sound waves are reflected at the liquid-solid interface, while some of them continue to propagate through the media, affecting the sound pressure distribution on the end-face of the receiving transducer, thereby affecting the measurement accuracy of the ultrasonic heat meter. Conclusion: The reliability and detection efficiency of the heat meter is improved, which is significant and theoretically valuable.

Water uptake by substituted amylose tablets: experimentation and numerical simulation

2009 ◽  
Vol 00 (00) ◽  
pp. 090904073309027-8
Author(s):  
H.W. Wang ◽  
S. Kyriacos ◽  
L. Cartilier
Keyword(s):  
Numerical Simulation ◽  
Water Uptake
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