Numerical Analysis of the Die Filling Process Within a Pharmaceutical Tableting Machine

2018 ◽  
Vol 90 (4) ◽  
pp. 483-492 ◽  
Author(s):  
Claudia Hildebrandt ◽  
Srikanth R. Gopireddy ◽  
Regina Scherließ ◽  
Nora Urbanetz
Pharmaceutics ◽  
2021 ◽  
Vol 13 (8) ◽  
pp. 1198
Author(s):  
Pauline H. M. Janssen ◽  
Sébastien Depaifve ◽  
Aurélien Neveu ◽  
Filip Francqui ◽  
Bastiaan H. J. Dickhoff

With the emergence of quality by design in the pharmaceutical industry, it becomes imperative to gain a deeper mechanistic understanding of factors impacting the flow of a formulation into tableting dies. Many flow characterization techniques are present, but so far only a few have shown to mimic the die filling process successfully. One of the challenges in mimicking the die filling process is the impact of rheological powder behavior as a result of differences in flow field in the feeding frame. In the current study, the rheological behavior was investigated for a wide range of excipients with a wide range of material properties. A new parameter for rheological behavior was introduced, which is a measure for the change in dynamic cohesive index upon changes in flow field. Particle size distribution was identified as a main contributing factor to the rheological behavior of powders. The presence of fines between larger particles turned out to reduce the rheological index, which the authors explain by improved particle separation at more dynamic flow fields. This study also revealed that obtained insights on rheological behavior can be used to optimize agitator settings in a tableting machine.


2010 ◽  
Vol 197 (1-2) ◽  
pp. 111-119 ◽  
Author(s):  
Y. Guo ◽  
C.-Y. Wu ◽  
K.D. Kafui ◽  
C. Thornton

2015 ◽  
Vol 46 (5) ◽  
pp. 2121-2128 ◽  
Author(s):  
Guangxu Wang ◽  
Honghua Huang ◽  
Zhao Yang ◽  
Xiaocheng Shi ◽  
Xiaolong He

2016 ◽  
Vol 256 ◽  
pp. 107-112 ◽  
Author(s):  
Wen Ying Qu ◽  
Fan Zhang ◽  
Jiao Jiao Wang ◽  
Xiao Gang Hu ◽  
Qiang Zhu

Semi-solid alloy slurries with different temperature distributions have diverse flow patterns of the slurries during die casting filling process. This different flow patterns can lead to various degrees of front separation of the slurry metal from the die cavity during die filling process. This separation can result in air entrapment, which is one of the origins for gas porosities and blisters occurred during followed heat treatment. Therefore, in this paper, the effects of slurry temperature distribution on filling patterns during die casting process were investigated. Based on partial filling experiments, positive and negative gradient temperature distribution, together with two homogeneous conditions 575°C, 579°C were compared by computer simulation. The results indicate that the positive gradient temperature condition of 357.0 slurry is more suitable for the semi-solid die casting of the connector, and 7 °C temperature gradient in slurry is appropriate for good filling.


2011 ◽  
Vol 101-102 ◽  
pp. 990-993
Author(s):  
Zhi Xin Jia ◽  
Ji Qiang Li ◽  
Li Jun Liu

The CAE simulations of filling and solidification processes for die-casting are studied. Numerical analysis is presented for a practical die-casting part using HZ CAE software. The temperature distributions and filling states in solidification and filling process are presented. Then the deficiencies of the part are predicted. Based on the analyzing results, the two die halves are modified and the die-casting parameters are adjusted. The service life of the revised die is increased from 12,000 shots to 20,000shots. It is proved that CAE simulation results can offer a helpful reference for die-casting die design.


Author(s):  
Huaqin Yao ◽  
Yuki Mori ◽  
Kazuya Takabatake ◽  
Xiaosong Sun ◽  
Mikio Sakai

2015 ◽  
Vol 41 (1) ◽  
pp. 1-10 ◽  
Author(s):  
Kenji Matsumoto ◽  
Mitsuhiro Ohta ◽  
Shuichi Iwata

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