ChemInform Abstract: The Stability of the Passive State on Al-Mo Sputter-Deposited Glassy Metals.

ChemInform ◽  
2010 ◽  
Vol 26 (5) ◽  
pp. no-no
Author(s):  
M. JANIK-CZACHOR ◽  
A. WOLOWIK ◽  
Z. WERNER
Keyword(s):  
Passive State ◽  
Glassy Metals ◽  
Sputter Deposited ◽  
The Stability

The stability of the passive state on AlMo sputter-deposited glassy metals

1994 ◽  
Vol 36 (11) ◽  
pp. 1921-1923 ◽  
Author(s):  
M Janik-Czachor ◽  
A Wo&Ł ◽  
Z Werner
Keyword(s):  
Passive State ◽  
Glassy Metals ◽  
Sputter Deposited ◽  
The Stability

Reliability of Au-Ti for High Temperature Termination on Ferrite LTCC Inductors

2013 ◽  
Vol 2013 (HITEN) ◽  
pp. 000039-000045 ◽  
Author(s):  
James Galipeau ◽  
Matt Gerlach
Keyword(s):  
High Temperature ◽  
Thermal Shock ◽  
Thick Film ◽  
Thermal Ageing ◽  
Wire Bonding ◽  
Sputter Deposited ◽  
Commercial Applications ◽  
The Stability ◽  
Terminal Structure ◽  
Pull Tests

While ferrite Low Temperature Co-fired Ceramic (LTCC) inductor and transformer developments have undergone thermal shock and high temperature aging that focused on the stability of their electrical characteristics (resistance, inductance), little attention has been paid to their termination reliability at high temperatures. Testing has been done on AgPt and AgPd terminations with Ag5Cd95 and Pb88Sn10Ag2 solders for 2000 and 25 hrs, respectively. However, Ag5Cd95 is unusable in commercial applications due to ROHS restrictions while Pb88Sn10Ag2 is undesirable because of the high lead content. Sn96 solder and wire bonding are common attachment methods that have not been vetted. Initial investigations show that high Sn solders may interfere with bonding between the AgPt and AgPd termination materials and the ferrite bulk of the part. An alternative terminal structure for using Sn96 solder is created by electroplating Au and Ni; however, electroplating to ferrite is challenging due to the masking involved. Also, the preferred materials for wire bonding are thick film, thin film or electroplated Au. To this end an alternative termination structure using Au sputter deposited onto sputter deposited Ti is being investigated. This structure was chosen for its potential to be a lower cost alternative to thick film Au and for its potential for simpler manufacturing than electroplating. Tests involved measuring bond strength and resistance after thermal ageing and thermal shock. Baseline solder joint pull tests show strength comparable to other termination methods. Some issues with solder wetting of the terminals have been noted.

Effect of chlorides on the stability of the passive state of low Mn steels

1990 ◽  
Vol 41 (11) ◽  
pp. 618-622 ◽  
Author(s):  
A. Szummer ◽  
K. Lublińska ◽  
M. Janik-Czachor
Keyword(s):  
Passive State ◽  
The Stability

NANOSTRUCTURED ITO THIN FILMS BY RF SPUTTERING FOR ACETONE SENSOR

2011 ◽  
Vol 10 (01n02) ◽  
pp. 271-274
Author(s):  
H. J. PANDYA ◽  
SUDHIR CHANDRA ◽  
A. L. VYAS
Keyword(s):  
Rf Sputtering ◽  
Rf Magnetron Sputtering ◽  
Electrical Contacts ◽  
Vapor Sensing ◽  
Ito Film ◽  
Ito Thin Films ◽  
Lift Off ◽  
Sputter Deposited ◽  
The Stability ◽  
Acetone Sensor

A sensor for detection of acetone vapors using nanostructured ITO thin film is reported. The ITO film was sputter-deposited on glass substrate using RF magnetron sputtering at 200 W RF power in argon atmosphere at 20 mTorr pressure. The film was then annealed at 450°C for 1h in air. The sensing area was kept to be 3 mm × 3 mm. Two aluminum pads of 7 mm × 4 mm size were formed using lift-off technique for electrical contacts. The crystallinity, microstructure, and acetone vapor-sensing properties were systematically investigated. The stability of the sensing films with aging and temperature variations was also investigated.

Anodic Polarization Characteristics Of Gold and Silver In Chloride and Sulfate Media

CORROSION ◽  
1963 ◽  
Vol 19 (4) ◽  
pp. 115t-119t ◽  
Author(s):  
F. P. A. ROBINSON ◽  
F. A. FROST
Keyword(s):  
Anodic Polarization ◽  
Current System ◽  
Anodic Polarization Curve ◽  
Chloride Ions ◽  
Passive State ◽  
Anode Reaction ◽  
Polarization Characteristics ◽  
Impressed Current ◽  
The Stability ◽  
A Current

Abstract The anodic polarization characteristics of gold and silver in chloride and sulfate media have been studied, employing potentiostatic techniques. It was found that gold produces an active-passive S-shaped curve, the form of which is not seriously affected by the presence of oxygen in the electrolyte. The stability of the passive state was greater in the sulfate than in the chloride media. Silver does not give a typical anodic polarization curve in NaCl solution, because formation of an AgCl film is the primary anode reaction. This film thickens and exfoliates at a current density of 2 a/sq ft. For this reason, silver could not be used as an inexpendable anode in an impressed current system containing chloride ions.

Effects of phosphorus on the stability of the passive state of Fe and Fe-Ni base glasses

1988 ◽  
Vol 39 (10) ◽  
pp. 453-462 ◽  
Author(s):  
H. Viefhaus ◽  
R. Möller ◽  
M. Janik-Czachor
Keyword(s):  
Passive State ◽  
The Stability

scholarly journals Corrosion and Electrochemical Properties of Nanocrystalline W-Mo Alloys in NaOH Solutions

1970 ◽  
Vol 11 ◽  
pp. 147-152
Author(s):  
Arun Khadka ◽  
Jagadeesh Bhattarai
Keyword(s):  
Corrosion Resistance ◽  
Electrochemical Properties ◽  
Open Circuit Potential ◽  
Science And Technology ◽  
Open Circuit ◽  
Sputter Deposition ◽  
Corrosion Tests ◽  
Corrosion Rates ◽  
Sputter Deposited ◽  
The Stability

The corrosion and electrochemical properties of sputter-deposited nanocrystalline binary W-Mo alloys were studied after immersion for 2429 h in different concentrations of NaOH solutions open to air at 25°C using corrosion tests and open circuit potential measurements. Molybdenum acts synergistically with tungsten in enhancing the corrosion resistance of the sputter-deposited binary W-Mo alloys so as to show higher corrosion resistance than those of alloy-constituting elements (i.e. tungsten and molybdenum) after immersion for 24 h in NaOH solutions. Open circuit potentials of all the examined sputter-deposited W-Mo alloys are shifted to the more positive (noble) direction with increasing molybdenum content in the alloys. The stability of the spontaneously passivated films formed on the binary W-Mo alloys is decreased with increasing concentrations of NaOH solutions. In spite of these facts, the corrosion rates of all the examined W-Mo alloys are almost independent of concentrations of NaOH solutions after immersion for 24 h at 25°C.Key words: nanocrystalline W-Mo alloys; sputter deposition; corrosion resistance; open circuit potential; NaOH solutions DOI: 10.3126/njst.v11i0.4137Nepal Journal of Science and Technology 11 (2010) 147-152

Microstructural changes of Pt/Ti electrodes in an oxygen ambient

1994 ◽  
Vol 52 ◽  
pp. 584-585
Author(s):  
K. H. Park ◽  
C. Y. Kim ◽  
J. S. Lee ◽  
K. Y. Kim ◽  
Y. W. Jeong ◽  
...  
Keyword(s):  
Electron Spectroscopy ◽  
Auger Electron ◽  
Si Substrate ◽  
Adhesion Layer ◽  
Thermally Grown Oxides ◽  
Transmission Electron Microcopy ◽  
Transmission Electron ◽  
Sputter Deposited ◽  
The Stability ◽  
Ferroelectric Capacitors

The stability of bottom electrodes during annealing in oxidation environments is crucial for the fabrication of ferroelectric capacitors. The Pt/Ti bilayer has received attention as a promising electrode for Si-based devices. The Ti buffer layer is necessary not only to improve the adhesion of Pt to dielectrics but also to prevent the formation of Pt silicides at high temperatures. When the Pt/Ti electrodes are exposed to O2 atmosphere during heat treatment, the oxidation induced diffusion of Ti into Pt and the oxidation of Ti are observed. In spite of previous researches, the microstructural features of the Pt/Ti bilayers in oxygen ambients have not been cleared up yet. In this study, combined techniques of transmission electron microcopy(TEM), scanning electron nucroscopy(SEM), and Auger electron spectroscopy(AES) have been applied to clarify the correlation between the interdiffusion of Pt/Ti/O and the microstructural evolution.The chosen system was Pt/Ti/SiO2/Si. The electrode of 80 nm thick Pt was dc-sputter deposited on the 70 nm thick Ti adhesion layer. The Si substrate wafers were covered with 750 nm thick thermally grown oxides. Heat treatments at various temperatures were performed in an oxygen ambient for 30 min.

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