scholarly journals Tunable Supramolecular Gel Properties by Varying Thermal History

2019 ◽  
Vol 25 (33) ◽  
pp. 7881-7887 ◽  
Author(s):  
Sisir Debnath ◽  
Sangita Roy ◽  
Yousef M. Abul‐Haija ◽  
Pim W. J. M. Frederix ◽  
Susana M. Ramalhete ◽  
...  
Keyword(s):  
Thermal History ◽  
Gel Properties ◽  
Supramolecular Gel

scholarly journals Anion-tuning of supramolecular gel properties

2009 ◽  
Vol 1 (6) ◽  
pp. 437-442 ◽  
Author(s):  
Gareth O. Lloyd ◽  
Jonathan W. Steed
Keyword(s):  
Gel Properties ◽  
Supramolecular Gel

scholarly journals Surface-directed modulation of supramolecular gel properties

2016 ◽  
Vol 52 (23) ◽  
pp. 4298-4300 ◽  
Author(s):  
Maria Galini Faidra Angelerou ◽  
Akmal Sabri ◽  
Rhiannon Creasey ◽  
Polyxeni Angelerou ◽  
Maria Marlow ◽  
...  
Keyword(s):  
Surface Properties ◽  
Gel Properties ◽  
Supramolecular Gel ◽  
Self Assembled

Surface properties directly affect fibre architecture and stiffness of self-assembled cytidine based gel films.

Cation Tuning of Supramolecular Gel Properties: A New Paradigm for Sustained Drug Delivery

2017 ◽  
Vol 29 (13) ◽  
pp. 1605227 ◽  
Author(s):  
Michael A. Ramin ◽  
Kotagudda Ranganath Sindhu ◽  
Ananda Appavoo ◽  
Khalid Oumzil ◽  
Mark W. Grinstaff ◽  
...  
Keyword(s):  
Drug Delivery ◽  
New Paradigm ◽  
Gel Properties ◽  
Supramolecular Gel ◽  
Sustained Drug Delivery

Effect of slight structural changes on the gelation properties of N-phenylstearamide supramolecular gels

Soft Matter ◽  
2018 ◽  
Vol 14 (32) ◽  
pp. 6716-6727 ◽  
Author(s):  
Alexandre R. Meyer ◽  
Caroline R. Bender ◽  
Daniel M. dos Santos ◽  
Francieli I. Ziembowicz ◽  
Clarissa P. Frizzo ◽  
...  
Keyword(s):  
Structural Changes ◽  
Test Tube ◽  
Gel Properties ◽  
Supramolecular Gel ◽  
H Nmr ◽  
Supramolecular Gels

The effect of slight structural changes on several supramolecular gel properties were evaluated by the test tube method, UV-Vis, 1H NMR, rheology and DSC experiments.

Analytical electron microscopy of grain boundaries in Al-Cu metallizations

1992 ◽  
Vol 50 (2) ◽  
pp. 1684-1685
Author(s):  
J. R. Michael ◽  
A. D. Romig ◽  
D. R. Frear
Keyword(s):  
Electron Microscopy ◽  
Integrated Circuits ◽  
Failure Mode ◽  
Current Density ◽  
Thermal History ◽  
Analytical Electron Microscopy ◽  
Cu Metallization ◽  
Analytical Electron ◽  
Interconnect Lines

Al with additions of Cu is commonly used as the conductor metallizations for integrated circuits, the Cu being added since it improves resistance to electromigration failure. As linewidths decrease to submicrometer dimensions, the current density carried by the interconnect increases dramatically and the probability of electromigration failure increases. To increase the robustness of the interconnect lines to this failure mode, an understanding of the mechanism by which Cu improves resistance to electromigration is needed. A number of theories have been proposed to account for role of Cu on electromigration behavior and many of the theories are dependent of the elemental Cu distribution in the interconnect line. However, there is an incomplete understanding of the distribution of Cu within the Al interconnect as a function of thermal history. In order to understand the role of Cu in reducing electromigration failures better, it is important to characterize the Cu distribution within the microstructure of the Al-Cu metallization.

Thermal history and organic maturation of Paleozoic rocks, Pocatello area, southeastern Idaho

1988 ◽  
Author(s):  
G.A. Desborough ◽  
F.G. Poole ◽  
A.G. Harris ◽  
T.A. Daws
Keyword(s):  
Thermal History ◽  
Paleozoic Rocks

Thermal history of the Slušovice-1 borehole

2015 ◽  
Author(s):  
Petr Jirman ◽  
Marek Goldbach ◽  
Eva Geršlová
Keyword(s):  
Thermal History ◽  
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