Distortional‐dilatational strain failure mode concept for hyperelastic materials

ce/papers ◽  
2021 ◽  
Vol 4 (6) ◽  
pp. 301-322
Author(s):  
Philipp L. Rosendahl ◽  
Michael Drass ◽  
Jens Schneider
Keyword(s):  
Failure Mode ◽  
Hyperelastic Materials

Analytical electron microscopy of grain boundaries in Al-Cu metallizations

1992 ◽  
Vol 50 (2) ◽  
pp. 1684-1685
Author(s):  
J. R. Michael ◽  
A. D. Romig ◽  
D. R. Frear
Keyword(s):  
Electron Microscopy ◽  
Integrated Circuits ◽  
Failure Mode ◽  
Current Density ◽  
Thermal History ◽  
Analytical Electron Microscopy ◽  
Cu Metallization ◽  
Analytical Electron ◽  
Interconnect Lines

Al with additions of Cu is commonly used as the conductor metallizations for integrated circuits, the Cu being added since it improves resistance to electromigration failure. As linewidths decrease to submicrometer dimensions, the current density carried by the interconnect increases dramatically and the probability of electromigration failure increases. To increase the robustness of the interconnect lines to this failure mode, an understanding of the mechanism by which Cu improves resistance to electromigration is needed. A number of theories have been proposed to account for role of Cu on electromigration behavior and many of the theories are dependent of the elemental Cu distribution in the interconnect line. However, there is an incomplete understanding of the distribution of Cu within the Al interconnect as a function of thermal history. In order to understand the role of Cu in reducing electromigration failures better, it is important to characterize the Cu distribution within the microstructure of the Al-Cu metallization.

Remarks on nonlinear elastic waves with null conditions

2020 ◽  
Vol 26 ◽  
pp. 121
Author(s):  
Dongbing Zha ◽  
Weimin Peng
Keyword(s):  
Initial Data ◽  
Global Existence ◽  
Elastic Waves ◽  
Wave Equations ◽  
Alternative Proof ◽  
Classical Solutions ◽  
Small Initial Data ◽  
Hyperelastic Materials ◽  
Variational Structure ◽  
Nonlinear Elastic

For the Cauchy problem of nonlinear elastic wave equations for 3D isotropic, homogeneous and hyperelastic materials with null conditions, global existence of classical solutions with small initial data was proved in R. Agemi (Invent. Math. 142 (2000) 225–250) and T. C. Sideris (Ann. Math. 151 (2000) 849–874) independently. In this paper, we will give some remarks and an alternative proof for it. First, we give the explicit variational structure of nonlinear elastic waves. Thus we can identify whether materials satisfy the null condition by checking the stored energy function directly. Furthermore, by some careful analyses on the nonlinear structure, we show that the Helmholtz projection, which is usually considered to be ill-suited for nonlinear analysis, can be in fact used to show the global existence result. We also improve the amount of Sobolev regularity of initial data, which seems optimal in the framework of classical solutions.

An Alternative Technique to Evaluate Crack Propagation Path in Hyperelastic Materials

2012 ◽  
Vol 40 (1) ◽  
pp. 42-58 ◽  
Author(s):  
R. R. M. Ozelo ◽  
P. Sollero ◽  
A. L. A. Costa
Keyword(s):  
Constitutive Model ◽  
Crack Propagation ◽  
Experimental Tests ◽  
Growth Direction ◽  
Propagation Path ◽  
J Integral ◽  
Alternative Technique ◽  
Crack Propagation Path ◽  
Hyperelastic Materials ◽  
Material Constitutive Model

Abstract REFERENCE: R. R. M. Ozelo, P. Sollero, and A. L. A. Costa, “An Alternative Technique to Evaluate Crack Propagation Path in Hyperelastic Materials,” Tire Science and Technology, TSTCA, Vol. 40, No. 1, January–March 2012, pp. 42–58. ABSTRACT: The analysis of crack propagation in tires aims to provide safety and reliable life prediction. Tire materials are usually nonlinear and present a hyperelastic behavior. Therefore, the use of nonlinear fracture mechanics theory and a hyperelastic material constitutive model are necessary. The material constitutive model used in this work is the Mooney–Rivlin. There are many techniques available to evaluate the crack propagation path in linear elastic materials and estimate the growth direction. However, most of these techniques are not applicable to hyperelastic materials. This paper presents an alternative technique for modeling crack propagation in hyperelastic materials, based in the J-Integral, to evaluate the crack path. The J-Integral is an energy-based parameter and is applicable to nonlinear materials. The technique was applied using abaqus software and compared to experimental tests.

Risk analysis of cutting system under intuitionistic fuzzy environment

2020 ◽  
Vol 1 (1) ◽  
pp. 162-173
Author(s):  
Dinesh Kumar Kushwaha ◽  
◽  
Dilbagh Panchal ◽  
Anish Sachdeva ◽  
◽  
...  
Keyword(s):  
Risk Assessment ◽  
Failure Mode ◽  
Thermal Power ◽  
Failure Detection ◽  
Engineering System ◽  
Effect Analysis ◽  
Intuitionistic Fuzzy ◽  
Mode Effect ◽  
Cutting System ◽  
Failure Mode Effect Analysis

Failure Mode Effect Analysis (FMEA) is popular and versatile approach applicable to risk assessment and safety improvement of a repairable engineering system. This method encompasses various fields such as manufacturing, healthcare, paper mill, thermal power industry, software industry, services, security etc. in terms of its application. In general, FMEA is based on Risk Priority Number (RPN) score which is found by product of probability of Occurrence (O), Severity of failure (S) and Failure Detection (D). As human judgement is approximate in nature, the accuracy of data obtained from FMEA members depend on degree of subjectivity. The subjective knowledge of members not only contains uncertainty but hesitation too which in turn, affect the results. Fuzzy FMEA considers uncertainty and vagueness of the data/ information obtained from experts. In order to take into account, the hesitation of experts and vague concept, in the present work we propose integrated framework based on Intuitionistic Fuzzy- Failure Mode Effect Analysis (IF-FMEA) and IF-Technique for Order Preference by Similarity to Ideal Solution (IF-TOPSIS) techniques to rank the listed failure causes. Failure cause Fibrizer (FR) was found to be the most critical failure cause with RPN score 0.500. IF-TOPSIS has been implemented within IF-FMEA to compare and verify ranking results obtained by both the IF based approaches. The proposed method was presented with its application for examining the risk assessment of cutting system in sugar mill industry situated in western Uttar Pradesh province of India. The result would be useful for the plant maintenance manager to fix the best maintenance schedule for improving availability of cutting system.

Case Study of Electro-Optical Probing Signal with High Signal-Noise Ratio

2019 ◽  
Author(s):  
Ryan Xiao ◽  
William Wang ◽  
Ang Li ◽  
Shengqiu Xu ◽  
Binghai Liu
Keyword(s):  
Failure Mode ◽  
High Signal ◽  
Signal Noise ◽  
Electrical Failure ◽  
Current Path ◽  
Probing Signal ◽  
Optical Probing ◽  
Noise Ratio ◽  
Case Collection

Abstract With the development of semiconductor technology and the increment quantity of metal layers in past few years, backside EFA (Electrical Failure Analysis) technology has become the dominant method. In this paper, abnormally high Signal Noise Ratio (SNR) signal captured by Electro-Optical Probing (EOP)/Laser Voltage Probing (LVP) from backside is shown and the cause of these phenomena are studied. Based on the real case collection, two kinds of failure mode are summarized, and simulated experiments are performed. The results indicate that when a current path from power to ground is formed, the high SNR signal can be captured at the transistor which was on this current path. It is helpful of this consequence for FA to identify the failure mode by high SNR signal.

Analysis of Delta Iddq Soft Fails on Pass Chips

2006 ◽  
Author(s):  
I. Österreicher ◽  
S. Eckl ◽  
B. Tippelt ◽  
S. Döring ◽  
R. Prang ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Failure Mode ◽  
Photon Emission ◽  
Complete Analysis ◽  
Functional Tests ◽  
Analysis Techniques ◽  
Atomic Force ◽  
Current Consumption ◽  
Emission Microscopy ◽  
Failure Localization

Abstract Depending on the field of application the ICs have to meet requirements that differ strongly from product to product, although they may be manufactured with similar technologies. In this paper a study of a failure mode is presented that occurs on chips which have passed all functional tests. Small differences in current consumption depending on the state of an applied pattern (delta Iddq measurement) are analyzed, although these differences are clearly within the usual specs. The challenge to apply the existing failure analysis techniques to these new fail modes is explained. The complete analysis flow from electrical test and Global Failure Localization to visualization is shown. The failure is localized by means of photon emission microscopy, further analyzed by Atomic Force Probing, and then visualized by SEM and TEM imaging.

Combine Nanoprobing Technique with Difference Analysis to Identify Nonvisual Failures

2006 ◽  
Author(s):  
Cha-Ming Shen ◽  
Tsan-Cheng Chuang ◽  
Jie-Fei Chang ◽  
Jin-Hong Chou
Keyword(s):  
Failure Mode ◽  
Failure Modes ◽  
Electrical Characteristic ◽  
The Novel ◽  
Difference Analysis ◽  
Original Idea ◽  
Deductive Method ◽  
Complete Measurement

Abstract This paper presents a novel deductive methodology, which is accomplished by applying difference analysis to nano-probing technique. In order to prove the novel methodology, the specimens with 90nm process and soft failures were chosen for the experiment. The objective is to overcome the difficulty in detecting non-visual, erratic, and complex failure modes. And the original idea of this deductive method is based on the complete measurement of electrical characteristic by nano-probing and difference analysis. The capability to distinguish erratic and invisible defect was proven, even when the compound and complicated failure mode resulted in a puzzling characteristic.

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