Thermal stability and energetics of 15-mer DNA duplex interstrand crosslinked bytrans-diamminedichloroplatinum(II)

Biopolymers ◽  
2005 ◽  
Vol 77 (4) ◽  
pp. 222-229 ◽  
Author(s):  
Ctirad Hofr ◽  
Viktor Brabec
Keyword(s):  
Thermal Stability ◽  
Dna Duplex

Influence of an exocyclic guanine adduct on the thermal stability, conformation, and melting thermodynamics of a DNA duplex

Biochemistry ◽  
1992 ◽  
Vol 31 (48) ◽  
pp. 12096-12102 ◽  
Author(s):  
G. Eric Plum ◽  
Arthur P. Grollman ◽  
Frances Johnson ◽  
Kenneth J. Breslauer
Keyword(s):  
Thermal Stability ◽  
Dna Duplex ◽  
Melting Thermodynamics

A DNA Duplex with Extremely Enhanced Thermal Stability Based on Controlled Immobilization on Gold Nanoparticles

Nano Letters ◽  
2006 ◽  
Vol 6 (3) ◽  
pp. 491-495 ◽  
Author(s):  
Kensuke Akamatsu ◽  
Mio Kimura ◽  
Yoko Shibata ◽  
Shu-ichi Nakano ◽  
Daisuke Miyoshi ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Gold Nanoparticles ◽  
Dna Duplex

Alternate View on Thermal Stability of the DNA Duplex

Biochemistry ◽  
1995 ◽  
Vol 34 (40) ◽  
pp. 12921-12925 ◽  
Author(s):  
Anil Kumar
Keyword(s):  
Thermal Stability ◽  
Dna Duplex ◽  
Thermal Stability Of

scholarly journals Influence of cisplatin intrastrand crosslinking on the conformation, thermal stability, and energetics of a 20-mer DNA duplex.

1996 ◽  
Vol 93 (15) ◽  
pp. 7606-7611 ◽  
Author(s):  
N. Poklar ◽  
D. S. Pilch ◽  
S. J. Lippard ◽  
E. A. Redding ◽  
S. U. Dunham ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Dna Duplex

scholarly journals Second generation silver(I)-mediated imidazole base pairs

2014 ◽  
Vol 10 ◽  
pp. 2139-2144 ◽  
Author(s):  
Susanne Hensel ◽  
Nicole Megger ◽  
Kristina Schweizer ◽  
Jens Müller
Keyword(s):  
Thermal Stability ◽  
Melting Temperature ◽  
Base Pair ◽  
Metal Ion ◽  
Second Generation ◽  
Dna Duplex ◽  
Base Pairs ◽  
Double Helices ◽  
Thermal Stability Of

The imidazole–Ag(I)–imidazole base pair is one of the best-investigated artificial metal-mediated base pairs. We show here that its stability can be further improved by formally replacing the imidazole moiety by a 2-methylimidazole or 4-methylimidazole moiety. A comparison of the thermal stability of several double helices shows that the addition of one equivalent of Ag(I) leads to a 50% larger increase in the melting temperature when a DNA duplex with methylated imidazole nucleosides is applied. This significant effect can likely be attributed to a better steric shielding of the metal ion within the metal-mediated base pair.

Microfluidic Thermodynamics of the Shift in Thermal Stability of DNA Duplex in a Microchannel Laminar Flow

2007 ◽  
Vol 111 (22) ◽  
pp. 6127-6133 ◽  
Author(s):  
Kenichi Yamashita ◽  
Masaya Miyazaki ◽  
Yoshiko Yamaguchi ◽  
Hiroyuki Nakamura ◽  
Hideaki Maeda
Keyword(s):  
Thermal Stability ◽  
Laminar Flow ◽  
Dna Duplex ◽  
Thermal Stability Of

The Ordered Phase Formation in Ti-Al-Ga Alloys

1970 ◽  
Vol 28 ◽  
pp. 440-441
Author(s):  
Shiro Fujishiro ◽  
Harold L. Gegel
Keyword(s):  
Thermal Stability ◽  
High Temperature ◽  
Titanium Alloys ◽  
Growth Kinetics ◽  
Stoichiometric Composition ◽  
Good Potential ◽  
Alpha Titanium ◽  
Cold Rolled ◽  
Kinetics Of ◽  
Thermal Stability Of

Ordered-alpha titanium alloys having a DO19 type structure have good potential for high temperature (600°C) applications, due to the thermal stability of the ordered phase and the inherent resistance to recrystallization of these alloys. Five different Ti-Al-Ga alloys consisting of equal atomic percents of aluminum and gallium solute additions up to the stoichiometric composition, Ti3(Al, Ga), were used to study the growth kinetics of the ordered phase and the nature of its interface.The alloys were homogenized in the beta region in a vacuum of about 5×10-7 torr, furnace cooled; reheated in air to 50°C below the alpha transus for hot working. The alloys were subsequently acid cleaned, annealed in vacuo, and cold rolled to about. 050 inch prior to additional homogenization

Microstructure studies of tungsten silicide schottky contacts on Gaas

1987 ◽  
Vol 45 ◽  
pp. 328-329
Author(s):  
Yih-Cheng Shih ◽  
E. L. Wilkie
Keyword(s):  
Thermal Stability ◽  
Field Effect Transistors ◽  
Schottky Contact ◽  
Schottky Contacts ◽  
Excellent Thermal Stability ◽  
Barrier Heights ◽  
Gaas Substrates ◽  
Film Adhesion ◽  
Threshold Voltages ◽  
Thermal Stability Of

Tungsten silicides (WSix) have been successfully used as the gate materials in self-aligned GaAs metal-semiconductor-field- effect transistors (MESFET). Thermal stability of the WSix/GaAs Schottky contact is of major concern since the n+ implanted source/drain regions must be annealed at high temperatures (∼ 800°C). WSi0.6 was considered the best composition to achieve good device performance due to its low stress and excellent thermal stability of the WSix/GaAs interface. The film adhesion and the uniformity in barrier heights and ideality factors of the WSi0.6 films have been improved by depositing a thin layer of pure W as the first layer on GaAs prior to WSi0.6 deposition. Recently WSi0.1 has been used successfully as the gate material in 1x10 μm GaAs FET's on the GaAs substrates which were sputter-cleaned prior to deposition. These GaAs FET's exhibited uniform threshold voltages across a 51 mm wafer with good film adhesion after annealing at 800°C for 10 min.

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