scholarly journals The search for enhanced dielectric strength of polymer‐based dielectrics: A focused review on polymer nanocomposites

2020 ◽  
Vol 137 (33) ◽  
pp. 49379 ◽  
Author(s):  
Daniel Q. Tan
Keyword(s):  
Polymer Nanocomposites ◽  
Dielectric Strength

Topological-Structure Modulated Polymer Nanocomposites Exhibiting Highly Enhanced Dielectric Strength and Energy Density

2014 ◽  
Vol 24 (21) ◽  
pp. 3172-3178 ◽  
Author(s):  
Penghao Hu ◽  
Yang Shen ◽  
Yuhan Guan ◽  
Xuehui Zhang ◽  
Yuanhua Lin ◽  
...  
Keyword(s):  
Energy Density ◽  
Polymer Nanocomposites ◽  
Topological Structure ◽  
Dielectric Strength

Phosphonic Acid-Modified Barium Titanate Polymer Nanocomposites with High Permittivity and Dielectric Strength

2007 ◽  
Vol 19 (7) ◽  
pp. 1001-1005 ◽  
Author(s):  
P. Kim ◽  
S. C. Jones ◽  
P. J. Hotchkiss ◽  
J. N. Haddock ◽  
B. Kippelen ◽  
...  
Keyword(s):  
Barium Titanate ◽  
Polymer Nanocomposites ◽  
Phosphonic Acid ◽  
Dielectric Strength ◽  
High Permittivity

Electret effect in polymer nanocomposites (review

2019 ◽  
Vol 5 (2) ◽  
pp. 6-18
Author(s):  
V. A. Goldade ◽  
◽  
S. V. Zotov ◽  
V. M. Shapovalov ◽  
V. E. Yudin ◽  
...  
Keyword(s):  
Polymer Nanocomposites ◽  
Electret Effect

Assessment of Reliability of cap layers used in Cu-Black DiamondTM Interconnects

2003 ◽  
Vol 766 ◽  
Author(s):  
Ahila Krishnamoorthy ◽  
N.Y. Huang ◽  
Shu-Yunn Chong
Keyword(s):  
Dielectric Layer ◽  
Dielectric Breakdown ◽  
Copper Ions ◽  
Dielectric Strength ◽  
Time Dependent ◽  
Breakdown Field ◽  
Field Range ◽  
Time Dependent Dielectric Breakdown ◽  
Voltage Ramp ◽  
Low K

AbstractBlack DiamondTM. (BD) is one of the primary candidates for use in copper-low k integration. Although BD is SiO2 based, it is vastly different from oxide in terms of dielectric strength and reliability. One of the main reliability concerns is the drift of copper ions under electric field to the surrounding dielectric layer and this is evaluated by voltage ramp (V-ramp) and time dependent dielectric breakdown (TDDB). Metal 1 and Metal 2 intralevel comb structures with different metal widths and spaces were chosen for dielectric breakdown studies. Breakdown field of individual test structures were obtained from V-ramp tests in the temperature range of 30 to 150°C. TDDB was performed in the field range 0.5 – 2 MV/cm. From the leakage between combs at the same level (either metal 1 or metal 2) Cu drift through SiC/BD or SiN/BD interface was characterized. It was found that Cu/barrier and barrier/low k interfaces functioned as easy paths for copper drift thereby shorting the lines. Cu/SiC was found to provide a better interface than Cu/SiN.

CRYSTALLIZATION OF DISPERSIVELY FILLED POLYMER NANOCOMPOSITES

2019 ◽  
Vol 10 (4) ◽  
pp. 363-371
Author(s):  
Georgii V. Kozlov ◽  
Yulia N. Karnet ◽  
I. V. Dolbin ◽  
A. N. Vlasov
Keyword(s):  
Polymer Nanocomposites ◽  
Filled Polymer
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