Flexible and transparent polymer/cellulose nanocrystal nanocomposites with high thermal conductivity for thermal management application

2019 ◽  
Vol 137 (28) ◽  
pp. 48864 ◽  
Author(s):  
Xinfeng Wu ◽  
Yuan Gao ◽  
Hang Yao ◽  
Kai Sun ◽  
Runhua Fan ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Management ◽  
High Thermal Conductivity ◽  
Cellulose Nanocrystal ◽  
Management Application

scholarly journals High thermal conductivity polymer chains with reactive groups: a step towards true application

2020 ◽  
Vol 1 (6) ◽  
pp. 1996-2002
Author(s):  
Anqi Chen ◽  
Yanyan Wu ◽  
Shaoxin Zhou ◽  
Wenxue Xu ◽  
Wenlong Jiang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Management ◽  
Polymer Chains ◽  
High Thermal Conductivity ◽  
Reactive Groups

Nanostructured polyethylene (PE, [–CH2–CH2–]n) films with metal-like thermal conductivity have opened up opportunities for polymers in advanced thermal management.

Mechanical Properties of Microscale Graphitic Carbon Foam Ligaments and Nodes

2009 ◽  
Author(s):  
S. Ganguli ◽  
A. K. Roy ◽  
R. Wheeler
Keyword(s):  
Thermal Conductivity ◽  
Thermal Management ◽  
Thermal Protection ◽  
Solid Phase ◽  
Coefficient Of Thermal Expansion ◽  
Carbon Foam ◽  
High Thermal Conductivity ◽  
Uniform Size ◽  
Open Cell ◽  
Carbon Foams

Carbon foam is recognized as having the greatest potential to replacement for metal fins in thermal management systems such as heat exchangers, space radiators, and thermal protection systems [1–5]. Carbon foam refers to a broad class of materials that include reticulated glassy, carbon and graphitic foams that are generally open-cell or mostly open-cell. They can be tailored to have low or high thermal conductivity with a low coefficient of thermal expansion and density. These foams have high modulus but low compression and tensile strength. Among the carbon foams, the graphitic foam offers superior thermal management properties such as high thermal conductivity. Graphitic foams are made of a network of spheroidal shell segments. Each cell has thin, stretched ligaments in the walls that are joined at the nodes or junctions. The parallel arrangement of graphene planes in the ligaments confers highly anisotropic properties to the walls of the graphitic foams. The graphene planes tend to be oriented with the plane of the ligaments but become disrupted at the junctions (nodes) of the walls. Since conduction is highest along parallel graphene planes, the thermal conductivity is highest in the plane of the ligaments or struts, and much lower in the direction transverse to the plane of these ligaments. In a previous study [6] extensive mechanical and thermal property characterization of carbon foams from Kopper Inc. (L1) and POCO Graphite, Inc. (P1) were reported. These foams were graphitic ones that are expected to have high thermal conductivity. Figure 1 shows sections of light microscopy images of the three foams of four foams. The most important thing to notice is that the images were not at the same magnification. The large cells in the GrafTech foam have an average diameter of only ∼100 μm but have a bimodal distribution cells with many small closed-cells few micrometers in diameter. Changes in density in the GrafTech foam was accompanied by a change in the large cells’ diameter — larger diameter giving greater porosity and lower density without changing the smaller cells’ sizes that filled the solid phase between the larger bubbles. The POCO foam has a fairly uniform size cell distribution of a few hundred micrometers. The Koppers’ foams show larger cells yet with the left (“L” precursor) having a uniform size while the right-hand (“D” precursor) is a less uniform and lower porosity.

scholarly journals Transparent glass-ceramics for thermal management application: achievement of optical transparency and high thermal conductivity

RSC Advances ◽  
2020 ◽  
Vol 10 (38) ◽  
pp. 22352-22360
Author(s):  
Nobuaki Terakado ◽  
Toshikazu Yoshimine ◽  
Ryusei Kozawa ◽  
Yoshihiro Takahashi ◽  
Takumi Fujiwara
Keyword(s):  
Thermal Conductivity ◽  
Thermal Management ◽  
Glass Ceramics ◽  
Optical Transparency ◽  
Oxide Glass ◽  
Transparent Glass ◽  
Disordered Structures ◽  
Industrial Material ◽  
Management Application ◽  
Shaping Ability

Oxide glass is an industrial material with advantages such as optical transparency and shaping ability of the melt, but at the same time, it is a bad conductor of heat due to its disordered structures.

Vapor grown carbon fiber reinforced aluminum composites with very high thermal conductivity

1995 ◽  
Vol 10 (2) ◽  
pp. 247-250 ◽  
Author(s):  
Jyh-Ming Ting ◽  
Max L. Lake
Keyword(s):  
Thermal Conductivity ◽  
Carbon Fiber ◽  
Thermal Management ◽  
Room Temperature ◽  
Electronic Devices ◽  
High Thermal Conductivity ◽  
Aluminum Metal ◽  
Aluminum Metal Matrix Composite ◽  
New Material ◽  
Very High

The first use of continuous vapor grown carbon fiber (VGCF) as reinforcement in aluminum metal matrix composite (Al MMC) is reported. Al MMC represents a new material for thermal management in high-power, high-density electronic devices. Due to the ultrahigh thermal conductivity of VGCF, 1950 W/m-K at room temperature, VGCF-reinforced Al MMC exhibits excellent thermal conductivity that cannot be achieved by using any other carbon fiber as reinforcement. An unprecedented high thermal conductivity of 642 W/m-K for Al MMC was obtained by using 36.5% of VGCF.

Passive Thermal Management of Excess Heat from Electronic Devices

1989 ◽  
Vol 154 ◽  
Author(s):  
John J. Glatz ◽  
Juan F. Leon
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Heat Exchanger ◽  
Thermal Management ◽  
Electronic Devices ◽  
High Thermal Conductivity ◽  
Enabling Technology ◽  
Electronic Components ◽  
Potential Applications ◽  
General Scope

AbstractThermal management in the packaging of electronic components is fast becoming an enabling technology in the development of reliable electronics for a range of applications. The objective of the paper is to assess the feasibility of using advance high thermal conductivity pitch fiber (HTCPF) as a solution to some of the packaging problems. The general scope will include the following: identification of the candidate material and its potential applications; thermal management of the chip to board interface; thermal management of the heat within the multi-layer interconnect board (MIB); thermal management of the standard electronic module-format E (SEME); and heat transfer thru the enclosure to a remote heatsink/heat exchanger.

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