Solid‐state shear milling method to prepare PA12/boron nitride thermal conductive composite powders and their selective laser sintering 3D‐printing

2019 ◽  
Vol 137 (23) ◽  
pp. 48766 ◽  
Author(s):  
Lu Yang ◽  
Lequan Wang ◽  
Yinghong Chen
2021 ◽  
Vol 412 ◽  
pp. 128675
Author(s):  
Shaojie Sun ◽  
Guoxia Fei ◽  
Xiaorong Wang ◽  
Miao Xie ◽  
Quanfen Guo ◽  
...  

ACS Omega ◽  
2019 ◽  
Vol 4 (7) ◽  
pp. 12012-12017 ◽  
Author(s):  
Elmeri Lahtinen ◽  
Lotta Turunen ◽  
Mikko M. Hänninen ◽  
Kalle Kolari ◽  
Heikki M. Tuononen ◽  
...  

2019 ◽  
Vol 26 (09) ◽  
pp. 1950055
Author(s):  
CHENGMEI GUI ◽  
ZHENMING CHEN ◽  
CHENGUANG YAO ◽  
GUISHENG YANG

In this work, SiO2-encapsulated copper particles/PA12 (Cu-SiO2/PA12) composite powders were prepared by electroless composite plating, and the laser sintering behavior was investigated. Results showed that Cu, Cu2O, CuO, and SiO2 (Cu-SiO2) composite particles were plated on the surface of KH550-modified PA12 powders. The Cu-SiO2 particles existed independently on PA12 surface, and the size was around 200 nm. The melting temperature and crystallization temperature of Cu-SiO2/PA12 composite powders were 183∘C and 150∘C. The results indicate that the selective laser sintering (SLS) process involved the contact of Cu-SiO2/PA12 powders, the formation of sintering neck, the growth of sintering neck, and the formation of fused solid. The Cu-SiO2 composite particles uniformly dispersed in the part due to surface tension, and the contact interface was good due to their similar polarity. The Cu-SiO2/PA12 SLS parts had excellent dimensional precision. The tensile strength of the 15[Formula: see text]W-sintered Cu-SiO2/PA12 specimen was 48[Formula: see text]MPa.


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