Tribological and thermal properties of hexagonal boron nitride filled high-performance polymer nanocomposites

2016 ◽  
Vol 134 (4) ◽  
Author(s):  
Manoj D. Joshi ◽  
A. Goyal ◽  
S. M. Patil ◽  
R. K. Goyal
2020 ◽  
Vol 16 (2) ◽  
pp. 145-153
Author(s):  
Fathin Najihah Nor Mohd Hussin ◽  
Roswanira Abdul Wahab ◽  
Nursyafreena Attan

The advancement of nanotechnology has opened a new opportunity to develop nanocomposites using nanocellulose (NC) and nanoclay (NCl). Researchers have regarded these nanocomposites as promising substitutes for conventional polymers because of their characteristic and useful features, which include exceptional strength and stiffness, low weight, and low environmental impact. These features of NC and NCl explain their multifarious applications across many sectors. Here we review NC and NCl as well as various reinforced polymer composites that are made up of either of the two nanomaterials. The structural and physicochemical properties of NC and NCl are highlighted, along with the mechanical behavior and thermal properties of NC. Current nanomaterial hybrid biopolymers for the production of novel high-performance polymer nanocomposites are also discussed with respect to their mechanical properties.


2020 ◽  
Vol 8 (13) ◽  
pp. 4421-4431 ◽  
Author(s):  
Soon Siang Chng ◽  
Minmin Zhu ◽  
Jing Wu ◽  
Xizu Wang ◽  
Zhi Kai Ng ◽  
...  

Orientation controlled hexagonal boron nitride (h-BN) films exhibit excellent mechanical and thermal properties, making them attractive for diverse applications.


2021 ◽  
Vol 7 (1) ◽  
pp. 5
Author(s):  
Okikiola Olaniyan ◽  
Lyudmila V. Moskaleva

In an attempt to push the boundary of miniaturization, there has been a rising interest in two-dimensional (2D) semiconductors with superior electronic, mechanical, and thermal properties as alternatives for silicon-based devices. Due to their fascinating properties resulting from lowering dimensionality, hexagonal boron nitride (h-BN) and graphene are considered promising candidates to be used in the next generation of high-performance devices. However, neither h-BN nor graphene is a semiconductor due to a zero bandgap in the one case and a too large bandgap in the other case. Here, we demonstrate from first-principles calculations that a hybrid 2D material formed by cross-linking alternating chains of carbon and boron nitride (HCBN) shows promising characteristics combining the thermal merits of graphene and h-BN while possessing the electronic structure characteristic of a semiconductor. Our calculations demonstrate that the thermal properties of HCBN are comparable to those of h-BN and graphene (parent systems). HCBN is dynamically stable and has a bandgap of 2.43 eV. At low temperatures, it exhibits smaller thermal contraction than the parent systems. However, beyond room temperature, in contrast to the parent systems, it has a positive but finitely small linear-thermal expansion coefficient. The calculated isothermal bulk modulus indicates that at high temperatures, HCBN is less compressible, whereas at low temperatures it is more compressible relative to the parent systems. The results of our study are important for the rational design of a 2D semiconductor with good thermal properties.


2007 ◽  
Vol 280-283 ◽  
pp. 1385-1390
Author(s):  
Guo Jun Zhang ◽  
Tatsuki Ohji ◽  
Shuzo Kanzaki

Based on the proposed inorganic reactions a series of high performance hexagonal boron nitride-containing composites (BNCC), include SiC-BN, Si3N4-SiC-BN, SiAlON-BN, AlN-BN, Al2O3-BN, AlON-BN and mullite-BN, have been prepared via reactive hot pressing or pressureless reactive sintering. Various boron-bearing components such as B, B4C, AlB2, SiB4, SiB6, B2O3 or H3BO3, 9Al2O3×2B2O3 (9A2B) and 2Al2O3×B2O3 (2AB) are used as the boron source. On the other hand, nitrogen gas or solid state nitirgen-bearing metal nitrides such as Si3N4 and AlN can be used as the nitrogen source. The in situ synthesized composites demonstrated homogeneous and isotropical microstructures with very fine (nano-sized) BN platelets or their agglomerates distributed in the matrixes. These composites showed high strength, low elasticity and improved strain tolerance. In this article the reaction design, thermodynamics, reaction mechanisms, reactive hot pressing or pressureless reactive sintering, microstructures and mechanical properties will be discussed.


Author(s):  
Guangyi Hou ◽  
Sai Li ◽  
Jun Liu ◽  
Yun-Xuan Weng ◽  
Liqun Zhang

Introducing polymer nanoparticles into polymer matrices is an interesting topic, and the robustness of polymeric nanoparticles is very crucial for the properties of polymer nanocomposites (PNCs). In this study, by...


2008 ◽  
Vol 57 (4) ◽  
pp. 547-553 ◽  
Author(s):  
Stéphane Bredeau ◽  
Sophie Peeterbroeck ◽  
Daniel Bonduel ◽  
Michaël Alexandre ◽  
Philippe Dubois

Science ◽  
2018 ◽  
Vol 362 (6416) ◽  
pp. 817-821 ◽  
Author(s):  
Joo Song Lee ◽  
Soo Ho Choi ◽  
Seok Joon Yun ◽  
Yong In Kim ◽  
Stephen Boandoh ◽  
...  

Although polycrystalline hexagonal boron nitride (PC-hBN) has been realized, defects and grain boundaries still cause charge scatterings and trap sites, impeding high-performance electronics. Here, we report a method of synthesizing wafer-scale single-crystalline hBN (SC-hBN) monolayer films by chemical vapor deposition. The limited solubility of boron (B) and nitrogen (N) atoms in liquid gold promotes high diffusion of adatoms on the surface of liquid at high temperature to provoke the circular hBN grains. These further evolve into closely packed unimodal grains by means of self-collimation of B and N edges inherited by electrostatic interaction between grains, eventually forming an SC-hBN film on a wafer scale. This SC-hBN film also allows for the synthesis of wafer-scale graphene/hBN heterostructure and single-crystalline tungsten disulfide.


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