Thermally reversible and self-healing novolac epoxy resins based on Diels-Alder chemistry

2015 ◽  
Vol 132 (26) ◽  
pp. n/a-n/a ◽  
Author(s):  
Jinhui Li ◽  
Guoping Zhang ◽  
Libo Deng ◽  
Kun Jiang ◽  
Songfang Zhao ◽  
...  
1993 ◽  
Vol 03 (C4) ◽  
pp. 249-252 ◽  
Author(s):  
T. MIURA ◽  
T. SUZUKI ◽  
Y. OKI ◽  
M. NUMAJIRI ◽  
K. KONDO ◽  
...  

2004 ◽  
Vol 44 (2) ◽  
pp. 376-387 ◽  
Author(s):  
S.-P. Rwei ◽  
A.-Y. Liu ◽  
G.-S. Liou ◽  
K.-C. Cheng ◽  
W. Guo

2008 ◽  
Vol 63 (4) ◽  
pp. 372-376 ◽  
Author(s):  
Ayman M. Atta ◽  
M.I. Abdou ◽  
Abdel-Atif A. Elsayed ◽  
Mohamed E. Ragab

1986 ◽  
Vol 72 ◽  
Author(s):  
Shuichi Kanagawa ◽  
Yutaka Terada

AbstractImpurities, especially chemically bonded impurities, of o-cresol novolac epoxy resins and their influence on the moisture resistance and other properties of the epoxy molding compounds have been investigated to clarify the influence of impurities of epoxy resins on the reliability of encapsulated semiconductor. As a result, the existence of hydrolyzable chlorine and hydroxyl group-containing impurities has been confirmed, and it was found that the impurity such as a hydrolyzable chlorine causes undesirable influence on both the moisture resistance and electrical properties at high temperatures. It was also found that the impurity such as a hydroxyl group causes undesirable influence on the moisture resistance, and that the lower hydroxyl content gives the higher heat resistance as a result of an increase in the epoxy content.


Author(s):  
Stefania Dello Iacono ◽  
Alfonso Martone ◽  
Eugenio Amendola

2005 ◽  
Vol 45 (4) ◽  
pp. 478-486 ◽  
Author(s):  
S.P. Rwei ◽  
C.Y. Cheng ◽  
G.S. Liou ◽  
K.C. Cheng

Author(s):  
Yunpeng Zhang ◽  
Jiaofeng Ye ◽  
Dongan Qu ◽  
Haitao Wang ◽  
Changsheng Chai ◽  
...  

1993 ◽  
Vol 49 (11) ◽  
pp. 1921-1929 ◽  
Author(s):  
T. Suzuki ◽  
Y. Oki ◽  
M. Numajiri ◽  
T. Miura ◽  
K. Kondo ◽  
...  

2004 ◽  
Vol 12 (1) ◽  
pp. 43-53
Author(s):  
C.P. Reghunadhan Nair ◽  
Dhanya Vijayan ◽  
C. Gouri

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